Yutaka Yamasaki

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Koshi City, JP

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Patents Grantslast 30 patents

Information Patent Grant
Separating method, separating apparatus, and separating system
- Patent number 12,157,293
- Issue date Dec 3, 2024
- Tokyo Electron Limited
- Takashi Terada
- B32 - LAYERED PRODUCTS
Information Patent Grant
Bonding apparatus and bonding method
- Patent number 11,417,543
- Issue date Aug 16, 2022
- Tokyo Electron Limited
- Yoshitaka Otsuka
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEPARATING METHOD, SEPARATING APPARATUS, AND SEPARATING SYSTEM
- Publication number 20230055853
- Publication date Feb 23, 2023
- TOKYO ELECTRON LIMITED
- Takashi Terada
- B32 - LAYERED PRODUCTS
Information Patent Application
BONDING SYSTEM AND SURFACE MODIFICATION METHOD
- Publication number 20220384386
- Publication date Dec 1, 2022
- TOKYO ELECTRON LIMITED
- Yuji Mimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS, BONDING SYSTEM, AND BONDING METHOD
- Publication number 20220285196
- Publication date Sep 8, 2022
- TOKYO ELECTRON LIMITED
- Yutaka Yamasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS, BONDING SYSTEM, AND BONDING METHOD
- Publication number 20220277979
- Publication date Sep 1, 2022
- TOKYO ELECTRON LIMITED
- Yutaka Yamasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND BONDING METHOD
- Publication number 20200020553
- Publication date Jan 16, 2020
- TOKYO ELECTRON LIMITED
- Yoshitaka Otsuka
- H01 - BASIC ELECTRIC ELEMENTS