TREA

Yuto HATTORI

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  • Tokyo, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Bonding apparatus
    • Patent number 11,367,703
    • Issue date Jun 21, 2022
    • Shinkawa Ltd.
    • Hiroya Yuzawa
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

  • Information Patent Application

    Charged Particle Beam Apparatus
    • Publication number 20230369012
    • Publication date Nov 16, 2023
    • Hitachi High-Tech Corporation
    • Naoko TAKEDA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BONDING APPARATUS
    • Publication number 20210202432
    • Publication date Jul 1, 2021
    • SHINKAWA LTD.
    • Hiroya YUZAWA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR