Yuuichi Kurashima

Person

Ibaraki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Composite having diamond crystal base
- Patent number 12,027,440
- Issue date Jul 2, 2024
- National Institute of Advanced Industrial Science and Technology
- Takashi Matsumae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for semiconductor substrate
- Patent number 9,761,479
- Issue date Sep 12, 2017
- Kabushiki Kaisha Toyota Jidoshokki
- Ko Imaoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package formation method and MEMS package
- Patent number 9,751,754
- Issue date Sep 5, 2017
- National Institute of Advanced Industrial Science and Technology
- Yuuichi Kurashima
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Room temperature bonding apparatus and room temperature bonding method
- Patent number 9,580,306
- Issue date Feb 28, 2017
- MITSUBISHI HEAVY INDUSTRIES MACHINE TOOL CO., LTD.
- Masato Kinouchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PLASMA SOURCE, AND ATOMIC CLOCK EMPLOYING PLASMA SOURCE
- Publication number 20240276626
- Publication date Aug 15, 2024
- NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
- Yuuichi KURASHIMA
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
BONDED BODY COMPRISING MOSAIC DIAMOND WAFER AND SEMICONDUCTOR OF DI...
- Publication number 20240258195
- Publication date Aug 1, 2024
- NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
- Hideaki YAMADA
- B32 - LAYERED PRODUCTS
Information Patent Application
COMPOSITE BODY COMPRISING SILICON CARBIDE AND METHOD FOR PRODUCING...
- Publication number 20240149565
- Publication date May 9, 2024
- NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
- Takashi MATSUMAE
- B32 - LAYERED PRODUCTS
Information Patent Application
DIAMOND COMPOSITE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230170276
- Publication date Jun 1, 2023
- NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCINCE AND TECHNOLOGY
- Takashi MATSUMAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE HAVING DIAMOND CRYSTAL BASE
- Publication number 20220230934
- Publication date Jul 21, 2022
- NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
- Takashi MATSUMAE
- C30 - CRYSTAL GROWTH
Information Patent Application
SUBSTRATE JOINING METHOD
- Publication number 20190172813
- Publication date Jun 6, 2019
- MITSUBISHI HEAVY INDUSTRIES MACHINE TOOL CO., LTD.
- Jun UTSUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE FORMATION METHOD AND MEMS PACKAGE
- Publication number 20160332870
- Publication date Nov 17, 2016
- NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
- Yuuichi KURASHIMA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MANUFACTURING METHOD FOR SEMICONDUCTOR SUBSTRATE
- Publication number 20160204023
- Publication date Jul 14, 2016
- KABUSHIKI KAISHA TOYOTA JIDOSHOKKI
- Ko IMAOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ROOM TEMPERATURE BONDING APPARATUS AND ROOM TEMPERATURE BONDING METHOD
- Publication number 20150251904
- Publication date Sep 10, 2015
- Mitsubishi Heavy Industries, Ltd.
- Masato Kinouchi
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Yuuichi Kurashima

Person

Patents Grantslast 30 patents

Composite having diamond crystal base

Manufacturing method for semiconductor substrate

Package formation method and MEMS package

Room temperature bonding apparatus and room temperature bonding method

Patents Applicationslast 30 patents

PLASMA SOURCE, AND ATOMIC CLOCK EMPLOYING PLASMA SOURCE

BONDED BODY COMPRISING MOSAIC DIAMOND WAFER AND SEMICONDUCTOR OF DI...

COMPOSITE BODY COMPRISING SILICON CARBIDE AND METHOD FOR PRODUCING...

DIAMOND COMPOSITE AND METHOD OF MANUFACTURING THE SAME

COMPOSITE HAVING DIAMOND CRYSTAL BASE

SUBSTRATE JOINING METHOD

PACKAGE FORMATION METHOD AND MEMS PACKAGE

MANUFACTURING METHOD FOR SEMICONDUCTOR SUBSTRATE

ROOM TEMPERATURE BONDING APPARATUS AND ROOM TEMPERATURE BONDING METHOD