Yuuji Nishitani

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Kanagawa, JP

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor chip package for improving freedom of arrangement of...
- Patent number 10,714,402
- Issue date Jul 14, 2020
- Sony Corporation
- Hiroyuki Shigeta
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 10,332,826
- Issue date Jun 25, 2019
- Sony Corporation
- Kosuke Hareyama
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR CHIP PACKAGE
- Publication number 20190139843
- Publication date May 9, 2019
- SONY CORPORATION
- HIROYUKI SHIGETA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20150380347
- Publication date Dec 31, 2015
- SONY CORPORATION
- Kosuke Hareyama
- H01 - BASIC ELECTRIC ELEMENTS