Yuuji Suzuki

Person

Tochigi-ken, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Surface treated electrodeposited copper foil and circuit board
- Patent number 8,153,273
- Issue date Apr 10, 2012
- The Furukawa Electric Co., Ltd.
- Takahiro Saito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ultrathin copper foil with carrier and printed circuit board using...
- Patent number 7,985,488
- Issue date Jul 26, 2011
- The Furukawa Electric Co., Ltd.
- Yuuji Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper foil for high frequency circuit, method of production and ap...
- Patent number 7,985,485
- Issue date Jul 26, 2011
- The Furukawa Electric Co., Ltd.
- Takami Moteki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laminated circuit board
- Patent number 7,976,956
- Issue date Jul 12, 2011
- Furukawa Circuit Foil., Ltd.
- Yuuji Suzuki
- B32 - LAYERED PRODUCTS
Information Patent Grant
Ultrathin copper foil with carrier and printed circuit board using...
- Patent number 7,892,655
- Issue date Feb 22, 2011
- The Furukawa Electric Co., Ltd.
- Yuuji Suzuki
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method for preparing a circuit board material having a conductive b...
- Patent number 7,794,578
- Issue date Sep 14, 2010
- The Furukawa Electric Co., Ltd.
- Akira Matsuda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ultrathin copper foil with carrier and printed circuit board using...
- Patent number 7,771,841
- Issue date Aug 10, 2010
- Furukawa Electric Co., Ltd.
- Yuuji Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Treated copper foil and circuit board
- Patent number 7,381,475
- Issue date Jun 3, 2008
- Furukawa Circuit Foil Co., Ltd.
- Yuuji Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of producing ultra-thin copper foil with carrier, ultra-thin...
- Patent number 7,223,481
- Issue date May 29, 2007
- Furukawa Circuit Foil Co., Inc.
- Yuuji Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive substrate with resistance layer, resistance board, and r...
- Patent number 7,215,235
- Issue date May 8, 2007
- Furukawa Circuit Foil Co., LTD
- Akira Matsuda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Gateway system having a redundant structure of media gateway contro...
- Patent number 6,944,280
- Issue date Sep 13, 2005
- NEC Corporation
- Yuuji Suzuki
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Ink, production method of the same materials for producing the same...
- Patent number 6,939,400
- Issue date Sep 6, 2005
- Teikoku Printing Mfg. Co., Ltd.
- Yuuji Suzuki
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Ultra-thin copper foil with carrier, method of production of same,...
- Patent number 6,924,043
- Issue date Aug 2, 2005
- Furkawa Circuit Foil Co., Ltd.
- Yuuji Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reflow-plated member and a manufacturing method therefor
- Patent number 5,614,328
- Issue date Mar 25, 1997
- The Furukawa Electric Co. Ltd.
- Satoshi Suzuki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
COPPER FOIL FOR HIGH FREQUENCY CIRCUIT, METHOD OF PRODUCTION AND AP...
- Publication number 20110171486
- Publication date Jul 14, 2011
- THE FURUKAWA ELECTRIC CO., LTD.
- Takami MOTEKI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ULTRATHIN COPPER FOIL WITH CARRIER AND PRINTED CIRCUIT BOARD USING...
- Publication number 20100270063
- Publication date Oct 28, 2010
- THE FURUKAWA ELECTRIC CO., LTD.
- Yuuji Suzuki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER FOIL FOR HIGH FREQUENCY CIRCUIT, METHOD OF PRODUCTION AND AP...
- Publication number 20090324988
- Publication date Dec 31, 2009
- FURUKAWA CIRCUIT FOIL CO., LTD.
- Takami Moteki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Surface treated electrodeposited copper foil, the production method...
- Publication number 20070287020
- Publication date Dec 13, 2007
- FURUKAWA CIRCUIT FOIL CO., LTD.
- Takahiro Saito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE BASE MATERIAL WITH THIN FILM RESISTANCE LAYER, METHOD OF...
- Publication number 20070228443
- Publication date Oct 4, 2007
- Furukawa Circuit Foil Co., Ltd.
- Yuuki KIKUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ULTRATHIN COPPER FOIL WITH CARRIER AND PRINTED CIRCUIT BOARD USING...
- Publication number 20070154692
- Publication date Jul 5, 2007
- Furukawa Circuit Foil Co., Ltd.
- Yuuji Suzuki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Ultrathin copper foil with carrier and printed circuit board using...
- Publication number 20070141381
- Publication date Jun 21, 2007
- FURUKAWA CIRCUIT FOIL CO., LTD.
- Yuuji Suzuki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Laminated circuit board
- Publication number 20070110969
- Publication date May 17, 2007
- FURUKAWA CIRCUIT FOIL CO., LTD.
- Yuuji Suzuki
- B32 - LAYERED PRODUCTS
Information Patent Application
LAMINATED CIRCUIT BOARD
- Publication number 20070048507
- Publication date Mar 1, 2007
- FURUKAWA CIRCUIT FOIL CO., LTD.
- Yuuji SUZUKI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Copper foil for high frequency circuit, method of production and ap...
- Publication number 20070042212
- Publication date Feb 22, 2007
- FURUKAWA CIRCUIT FOIL CO., LTD.
- Takami Moteki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Composite copper foil, method of production thereof and high freque...
- Publication number 20060147742
- Publication date Jul 6, 2006
- Akira Matsuda
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Surface treated copper foil and circuit board
- Publication number 20060088723
- Publication date Apr 27, 2006
- Yuuji Suzuki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Conductive base material with resistance layer and circuit board ma...
- Publication number 20050280498
- Publication date Dec 22, 2005
- Yuuki Kikuchi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Treated copper foil and circuit board
- Publication number 20050175826
- Publication date Aug 11, 2005
- Yuuji Suzuki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method of producing ultra-thin copper foil with carrier, ultra-thin...
- Publication number 20050048306
- Publication date Mar 3, 2005
- Yuuji Suzuki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Copper foil for high frequency circuit, method of production and ap...
- Publication number 20050019599
- Publication date Jan 27, 2005
- Takami Moteki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Conductive substrate with resistance layer, resistance board, and r...
- Publication number 20040201446
- Publication date Oct 14, 2004
- Akira Matsuda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Plating bath for forming thin resistance layer, method of formation...
- Publication number 20040144656
- Publication date Jul 29, 2004
- Akira Matsuda
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Ultra-thin copper foil with carrier, method of production of same,...
- Publication number 20040121178
- Publication date Jun 24, 2004
- Yuuji Suzuki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Ink, production method of the same materials for producing the same...
- Publication number 20040103816
- Publication date Jun 3, 2004
- Yuuji Suzuki
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Gateway system having a redundant structure of media gateway contol...
- Publication number 20020027983
- Publication date Mar 7, 2002
- Yuuji Suzuki
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Yuuji Suzuki

Person

Patents Grantslast 30 patents

Surface treated electrodeposited copper foil and circuit board

Ultrathin copper foil with carrier and printed circuit board using...

Copper foil for high frequency circuit, method of production and ap...

Laminated circuit board

Ultrathin copper foil with carrier and printed circuit board using...

Method for preparing a circuit board material having a conductive b...

Ultrathin copper foil with carrier and printed circuit board using...

Treated copper foil and circuit board

Method of producing ultra-thin copper foil with carrier, ultra-thin...

Conductive substrate with resistance layer, resistance board, and r...

Gateway system having a redundant structure of media gateway contro...

Ink, production method of the same materials for producing the same...

Ultra-thin copper foil with carrier, method of production of same,...

Reflow-plated member and a manufacturing method therefor

Patents Applicationslast 30 patents

COPPER FOIL FOR HIGH FREQUENCY CIRCUIT, METHOD OF PRODUCTION AND AP...

ULTRATHIN COPPER FOIL WITH CARRIER AND PRINTED CIRCUIT BOARD USING...

COPPER FOIL FOR HIGH FREQUENCY CIRCUIT, METHOD OF PRODUCTION AND AP...

Surface treated electrodeposited copper foil, the production method...

CONDUCTIVE BASE MATERIAL WITH THIN FILM RESISTANCE LAYER, METHOD OF...

ULTRATHIN COPPER FOIL WITH CARRIER AND PRINTED CIRCUIT BOARD USING...

Ultrathin copper foil with carrier and printed circuit board using...

Laminated circuit board

LAMINATED CIRCUIT BOARD

Copper foil for high frequency circuit, method of production and ap...

Composite copper foil, method of production thereof and high freque...

Surface treated copper foil and circuit board

Conductive base material with resistance layer and circuit board ma...

Treated copper foil and circuit board

Method of producing ultra-thin copper foil with carrier, ultra-thin...

Copper foil for high frequency circuit, method of production and ap...

Conductive substrate with resistance layer, resistance board, and r...

Plating bath for forming thin resistance layer, method of formation...

Ultra-thin copper foil with carrier, method of production of same,...

Ink, production method of the same materials for producing the same...

Gateway system having a redundant structure of media gateway contol...