Yuuki Nakamura

Person

Ibaraki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor encapsulation adhesive composition, semiconductor enc...
- Patent number 9,129,898
- Issue date Sep 8, 2015
- Hitachi Chemical Company, Ltd.
- Kazutaka Honda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor-encapsulating adhesive, semiconductor-encapsulating f...
- Patent number 9,123,734
- Issue date Sep 1, 2015
- Hitachi Chemical Company, Ltd.
- Kazutaka Honda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor encapsulation adhesive composition, semiconductor enc...
- Patent number 9,024,455
- Issue date May 5, 2015
- Hitachi Chemical Company, Ltd.
- Kazutaka Honda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor-encapsulating adhesive, semiconductor-encapsulating f...
- Patent number 8,674,502
- Issue date Mar 18, 2014
- Hitachi Chemical Company, Ltd.
- Kazutaka Honda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Adhesive film for semiconductor, composite sheet, and method for pr...
- Patent number 8,404,564
- Issue date Mar 26, 2013
- Hitachi Chemical Company, Ltd.
- Yuuki Nakamura
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method for manufacturing semiconductor chip, adhesive film for semi...
- Patent number 8,232,185
- Issue date Jul 31, 2012
- Hitachi Chemical Company, Ltd.
- Yuuki Nakamura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing semiconductor chip with adhesive film, adhesiv...
- Patent number 8,198,176
- Issue date Jun 12, 2012
- Hitachi Chemical Company, Ltd.
- Keiichi Hatakeyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing semiconductor chip with adhesive film, adhesiv...
- Patent number 8,071,465
- Issue date Dec 6, 2011
- Hitachi Chemical Company, Ltd.
- Keiichi Hatakeyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
DIE BONDING/DICING SHEET
- Publication number 20170213765
- Publication date Jul 27, 2017
- Hitachi Chemical Company, Ltd.
- Ryouji FURUTANI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR-ENCAPSULATING ADHESIVE, SEMICONDUCTOR-ENCAPSULATING F...
- Publication number 20140206148
- Publication date Jul 24, 2014
- Hitachi Chemical Company, Ltd.
- Kazutaka Honda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR ENCAPSULATION ADHESIVE COMPOSITION, SEMICONDUCTOR ENC...
- Publication number 20140015149
- Publication date Jan 16, 2014
- Kazutaka Honda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR CHIP WITH ADHESIVE FILM, ADHESIV...
- Publication number 20120295400
- Publication date Nov 22, 2012
- Keiichi Hatakeyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR CHIP, ADHESIVE FILM FOR SEMI...
- Publication number 20120244347
- Publication date Sep 27, 2012
- Yuuki Nakamura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR-ENCAPSULATING ADHESIVE, SEMICONDUCTOR-ENCAPSULATING F...
- Publication number 20120012999
- Publication date Jan 19, 2012
- Hitachi Chemical Company, Ltd.
- Kazutaka Honda
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR CHIP WITH ADHESIVE FILM, ADHESIV...
- Publication number 20110318879
- Publication date Dec 29, 2011
- Keiichi HATAKEYAMA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR ENCAPSULATION ADHESIVE COMPOSITION, SEMICONDUCTOR ENC...
- Publication number 20110291260
- Publication date Dec 1, 2011
- Hitachi Chemical Company, Ltd.
- Kazutaka Honda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
DOUBLE-FACED ADHESIVE FILM AND ELECTRONIC COMPONENT MODULE USING SAME
- Publication number 20110210407
- Publication date Sep 1, 2011
- Youji Katayama
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR CHIP WITH ADHESIVE FILM, ADHESIV...
- Publication number 20100311227
- Publication date Dec 9, 2010
- Keiichi Hatakeyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR CHIP WITH ADHESIVE FILM, ADHESIV...
- Publication number 20100267199
- Publication date Oct 21, 2010
- Keiichi Hatakeyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR CHIP, ADHESIVE FILM FOR SEMI...
- Publication number 20100120229
- Publication date May 13, 2010
- Yuuki Nakamura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ADHESIVE FILM FOR SEMICONDUCTOR, COMPOSITE SHEET, AND METHOD FOR PR...
- Publication number 20100112783
- Publication date May 6, 2010
- Yuuki Nakamura
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Yuuki Nakamura

Person

Patents Grantslast 30 patents

Semiconductor encapsulation adhesive composition, semiconductor enc...

Semiconductor-encapsulating adhesive, semiconductor-encapsulating f...

Semiconductor encapsulation adhesive composition, semiconductor enc...

Semiconductor-encapsulating adhesive, semiconductor-encapsulating f...

Adhesive film for semiconductor, composite sheet, and method for pr...

Method for manufacturing semiconductor chip, adhesive film for semi...

Method for producing semiconductor chip with adhesive film, adhesiv...

Method for producing semiconductor chip with adhesive film, adhesiv...

Patents Applicationslast 30 patents

DIE BONDING/DICING SHEET

SEMICONDUCTOR-ENCAPSULATING ADHESIVE, SEMICONDUCTOR-ENCAPSULATING F...

SEMICONDUCTOR ENCAPSULATION ADHESIVE COMPOSITION, SEMICONDUCTOR ENC...

METHOD FOR PRODUCING SEMICONDUCTOR CHIP WITH ADHESIVE FILM, ADHESIV...

METHOD FOR MANUFACTURING SEMICONDUCTOR CHIP, ADHESIVE FILM FOR SEMI...

SEMICONDUCTOR-ENCAPSULATING ADHESIVE, SEMICONDUCTOR-ENCAPSULATING F...

METHOD FOR PRODUCING SEMICONDUCTOR CHIP WITH ADHESIVE FILM, ADHESIV...

SEMICONDUCTOR ENCAPSULATION ADHESIVE COMPOSITION, SEMICONDUCTOR ENC...

DOUBLE-FACED ADHESIVE FILM AND ELECTRONIC COMPONENT MODULE USING SAME

METHOD FOR PRODUCING SEMICONDUCTOR CHIP WITH ADHESIVE FILM, ADHESIV...

METHOD FOR PRODUCING SEMICONDUCTOR CHIP WITH ADHESIVE FILM, ADHESIV...

METHOD FOR MANUFACTURING SEMICONDUCTOR CHIP, ADHESIVE FILM FOR SEMI...

ADHESIVE FILM FOR SEMICONDUCTOR, COMPOSITE SHEET, AND METHOD FOR PR...