Yuya Touke

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Substrate plating method and apparatus
- Patent number 7,918,983
- Issue date Apr 5, 2011
- Ebara Corporation
- Yasuhiko Saijo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
Substrate plating method and apparatus
- Publication number 20070227894
- Publication date Oct 4, 2007
- Yasuhiko Saijo
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR