Yuying GAO

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Shanghai, CN

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Patents Grantslast 30 patents

Information Patent Grant
De-bonding leveling device and de-bonding method
- Patent number 10,971,380
- Issue date Apr 6, 2021
- SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
- Yuying Gao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DE-BONDING LEVELING DEVICE AND DE-BONDING METHOD
- Publication number 20200090961
- Publication date Mar 19, 2020
- Yuying GAO
- B32 - LAYERED PRODUCTS