Yuzhuo Li

Person

People

Patents Grantslast 30 patents

Information Patent Grant
Chemical-mechanical polishing composition comprising benzotriazole...
- Patent number 11,168,239
- Issue date Nov 9, 2021
- BASF SE
- Robert Reichardt
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Chemical-mechanical polishing composition comprising benzotriazole...
- Patent number 10,647,900
- Issue date May 12, 2020
- BASF SE
- Robert Reichardt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical mechanical polishing (CMP) composition comprising a protein
- Patent number 9,777,192
- Issue date Oct 3, 2017
- BASF SE
- Yuzhuo Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Post chemical-mechanical-polishing (post-CMP) cleaning composition...
- Patent number 9,458,415
- Issue date Oct 4, 2016
- BASF SE
- Yuzhuo Li
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Grant
Process for the manufacture of semiconductor devices comprising the...
- Patent number 9,443,739
- Issue date Sep 13, 2016
- BASF SE
- Bastian Marten Noller
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Process for the manufacture of semiconductor devices comprising the...
- Patent number 9,416,298
- Issue date Aug 16, 2016
- BASF SE
- Yuzhuo Li
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Chemical mechanical polishing (CMP) composition comprising a non-io...
- Patent number 8,980,750
- Issue date Mar 17, 2015
- BASF SE
- Robert Reichardt
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Engineered non-polymeric organic particles for chemical mechanical...
- Patent number 7,419,519
- Issue date Sep 2, 2008
- Dynea Chemicals Oy
- Yuzhuo Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silica and silica-based slurry
- Patent number 7,279,119
- Issue date Oct 9, 2007
- PPG Industries Ohio, Inc.
- Stuart D. Hellring
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Chemical mechanical planarization process control utilizing in-situ...
- Patent number 7,166,014
- Issue date Jan 23, 2007
- TBW Industries Inc.
- Stephen J. Benner
- B24 - GRINDING POLISHING
Information Patent Grant
Non-polymeric organic particles for chemical mechanical planarization
- Patent number 7,037,351
- Issue date May 2, 2006
- Dynea Chemicals Oy
- Yuzhuo Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photo-chemical remediation of Cu-CMP waste
- Patent number 6,916,428
- Issue date Jul 12, 2005
- Amia Corporation
- Yuzhuo Li
- C02 - TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
Information Patent Grant
Method of fabricating a copper damascene structure
- Patent number 6,660,639
- Issue date Dec 9, 2003
- Ferro Corporation
- Yuzhuo Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Silica-based slurry
- Patent number 6,656,241
- Issue date Dec 2, 2003
- PPG Industries Ohio, Inc.
- Stuart D. Hellring
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Abrasive composition containing organic particles for chemical mech...
- Patent number 6,620,215
- Issue date Sep 16, 2003
- Dynea Canada, Ltd.
- Yuzhuo Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Slurry for chemical-mechanical polishing copper damascene structures
- Patent number 6,508,953
- Issue date Jan 21, 2003
- Ferro Corporation
- Yuzhuo Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Diamond slurry for chemical-mechanical planarization of semiconduct...
- Patent number 6,258,721
- Issue date Jul 10, 2001
- General Electric Company
- Yuzhuo Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Diamond slurry for chemical-mechanical planarization of semiconduct...
- Patent number 6,242,351
- Issue date Jun 5, 2001
- General Electric Company
- Yuzhuo Li
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

Information Patent Application
CHEMICAL-MECHANICAL POLISHING COMPOSITION COMPRISING BENZOTRIAZOLE...
- Publication number 20200255713
- Publication date Aug 13, 2020
- BASF SE
- Robert REICHARDT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL-MECHANICAL POLISHING COMPOSITION COMPRISING BENZOTRIAZOLE...
- Publication number 20160200943
- Publication date Jul 14, 2016
- BASF SE
- Robert REICHARDT
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CMP COMPOSITION COMPRISING ABRASIVE PARTICLES CONTAINING CERIA
- Publication number 20160160083
- Publication date Jun 9, 2016
- BASF SE
- Michael LAUTER
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PROCESS FOR THE MANUFACTURE OF SEMICONDUCTOR DEVICES COMPRISING THE...
- Publication number 20150175845
- Publication date Jun 25, 2015
- BASF SE
- Yuzhuo Li
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
POST CHEMICAL-MECHANICAL-POLISHING (POST-CMP) CLEANING COMPOSITION...
- Publication number 20150018261
- Publication date Jan 15, 2015
- BASF SE
- Yuzhuo Li
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Application
PROCESS FOR THE MANUFACTURE OF SEMICONDUCTOR DEVICES COMPRISING THE...
- Publication number 20140170852
- Publication date Jun 19, 2014
- BASF SE
- Bastian Marten Noller
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SLURRY CONTAINING MULTI-OXIDIZER AND MIXED NANO-ABRASIVES FOR TUNGS...
- Publication number 20110186542
- Publication date Aug 4, 2011
- ASPT, INC.
- Yuzhuo LI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD AND APARATUS FOR ELECTROCHEMICAL MECHANICAL POLISHING NiP SU...
- Publication number 20100059390
- Publication date Mar 11, 2010
- Yuzhuo Li
- B24 - GRINDING POLISHING
Information Patent Application
CHEMICAL MECHANICAL POLISHING OF MOISTURE SENSITIVE SURFACES AND CO...
- Publication number 20090321390
- Publication date Dec 31, 2009
- Yuzhuo Li
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Slurry containing multi-oxidizer and nano-abrasives for tungsten CMP
- Publication number 20090047787
- Publication date Feb 19, 2009
- Yuzhuo Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ELECTROLYTE FORMULATION FOR ELECTROCHEMICAL MECHANICAL PLANARIZATION
- Publication number 20080142375
- Publication date Jun 19, 2008
- Francois Doniat
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PROCESS FOR REDUCING DISHING AND EROSION DURING CHEMICAL MECHANICAL...
- Publication number 20080090500
- Publication date Apr 17, 2008
- PPG INDUSTRIES OHIO, INC.
- Stuart D. Hellring
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CHEMICALLY MODIFIED CHEMICAL MECHANICAL POLISHING PAD
- Publication number 20080034670
- Publication date Feb 14, 2008
- PPG INDUSTRIES OHIO, INC.
- Yuzhuo Li
- B24 - GRINDING POLISHING
Information Patent Application
Chemically modified chemical mechanical polishing pad, process of m...
- Publication number 20070037491
- Publication date Feb 15, 2007
- Yuzhuo Li
- B24 - GRINDING POLISHING
Information Patent Application
Engineered non-polymeric organic particles for chemical mechanical...
- Publication number 20060261306
- Publication date Nov 23, 2006
- Dynea Chemicals Oy
- Yuzhuo Li
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Chemical mechanical planarization process control utilizing in-situ...
- Publication number 20050164606
- Publication date Jul 28, 2005
- TBW Industries Inc.
- Stephen J. Benner
- B24 - GRINDING POLISHING
Information Patent Application
Photo-chemical remediation of Cu-CMP waste
- Publication number 20050072742
- Publication date Apr 7, 2005
- Yuzhuo Li
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Non-polymeric organic particles for chemical mechanical planarization
- Publication number 20050005525
- Publication date Jan 13, 2005
- Yuzhuo Li
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Process for reducing dishing and erosion during chemical mechanical...
- Publication number 20040077295
- Publication date Apr 22, 2004
- Stuart D. Hellring
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Silica and silica-based slurry
- Publication number 20040067649
- Publication date Apr 8, 2004
- Stuart D. Hellring
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Abrasive composition containing organic particles for chemical mech...
- Publication number 20030136055
- Publication date Jul 24, 2003
- Yuzhuo Li
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Method of fabricating a copper damascene structure
- Publication number 20030098434
- Publication date May 29, 2003
- Ferro Corporation
- Yuzhuo Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Silica and a silica-based slurry
- Publication number 20030094593
- Publication date May 22, 2003
- Stuart D. Hellring
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Person

Patents Grantslast 30 patents

Chemical-mechanical polishing composition comprising benzotriazole...

Chemical-mechanical polishing composition comprising benzotriazole...

Chemical mechanical polishing (CMP) composition comprising a protein

Post chemical-mechanical-polishing (post-CMP) cleaning composition...

Process for the manufacture of semiconductor devices comprising the...

Process for the manufacture of semiconductor devices comprising the...

Chemical mechanical polishing (CMP) composition comprising a non-io...

Engineered non-polymeric organic particles for chemical mechanical...

Silica and silica-based slurry

Chemical mechanical planarization process control utilizing in-situ...

Non-polymeric organic particles for chemical mechanical planarization

Photo-chemical remediation of Cu-CMP waste

Method of fabricating a copper damascene structure

Silica-based slurry

Abrasive composition containing organic particles for chemical mech...

Slurry for chemical-mechanical polishing copper damascene structures

Diamond slurry for chemical-mechanical planarization of semiconduct...

Diamond slurry for chemical-mechanical planarization of semiconduct...

Patents Applicationslast 30 patents

CHEMICAL-MECHANICAL POLISHING COMPOSITION COMPRISING BENZOTRIAZOLE...

CHEMICAL-MECHANICAL POLISHING COMPOSITION COMPRISING BENZOTRIAZOLE...

CMP COMPOSITION COMPRISING ABRASIVE PARTICLES CONTAINING CERIA

PROCESS FOR THE MANUFACTURE OF SEMICONDUCTOR DEVICES COMPRISING THE...

POST CHEMICAL-MECHANICAL-POLISHING (POST-CMP) CLEANING COMPOSITION...

PROCESS FOR THE MANUFACTURE OF SEMICONDUCTOR DEVICES COMPRISING THE...

SLURRY CONTAINING MULTI-OXIDIZER AND MIXED NANO-ABRASIVES FOR TUNGS...

METHOD AND APARATUS FOR ELECTROCHEMICAL MECHANICAL POLISHING NiP SU...

CHEMICAL MECHANICAL POLISHING OF MOISTURE SENSITIVE SURFACES AND CO...

Slurry containing multi-oxidizer and nano-abrasives for tungsten CMP

ELECTROLYTE FORMULATION FOR ELECTROCHEMICAL MECHANICAL PLANARIZATION

PROCESS FOR REDUCING DISHING AND EROSION DURING CHEMICAL MECHANICAL...

CHEMICALLY MODIFIED CHEMICAL MECHANICAL POLISHING PAD

Chemically modified chemical mechanical polishing pad, process of m...

Engineered non-polymeric organic particles for chemical mechanical...

Chemical mechanical planarization process control utilizing in-situ...

Photo-chemical remediation of Cu-CMP waste

Non-polymeric organic particles for chemical mechanical planarization

Process for reducing dishing and erosion during chemical mechanical...

Silica and silica-based slurry

Abrasive composition containing organic particles for chemical mech...

Method of fabricating a copper damascene structure

Silica and a silica-based slurry