Yves DUPRAZ

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Valeyres-sous-Montagny, CH

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Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit die having a split solder pad
- Patent number 10,192,798
- Issue date Jan 29, 2019
- EM Microelectronic-Marin SA
- Christoph Kuratli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing humidity sensor
- Patent number 10,184,911
- Issue date Jan 22, 2019
- EM Microelectronic-Marin SA
- Pinchas Novac
- G01 - MEASURING TESTING
Information Patent Grant
Integrated circuit die having a split solder pad
- Patent number 10,096,561
- Issue date Oct 9, 2018
- EM Microelectronic-Marin SA
- Christoph Kuratli
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR WAFER
- Publication number 20240088066
- Publication date Mar 14, 2024
- EM Microelectronic-Marin SA
- Christophe ENTRINGER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TAMPER-EVIDENT RFID TAG AND METHOD THEREOF
- Publication number 20230206022
- Publication date Jun 29, 2023
- EM Microelectronic-Marin SA
- Pierre MULLER
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INTEGRATED CIRCUIT DIE HAVING A SPLIT SOLDER PAD
- Publication number 20180053699
- Publication date Feb 22, 2018
- EM Microelectronic-Marin SA
- Christoph KURATLI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DIE HAVING A SPLIT SOLDER PAD
- Publication number 20180053738
- Publication date Feb 22, 2018
- EM Microelectronic-Marin SA
- Christoph KURATLI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HUMIDITY SENSOR
- Publication number 20160178552
- Publication date Jun 23, 2016
- EM Microelectronic-Marin SA
- Pinchas NOVAC
- G01 - MEASURING TESTING