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Hsinchu Hsien, TW
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Patents Grants
last 30 patents
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Patent Grant
Substrate structure for an image sensor package and method for manu...
Patent number
8,314,481
Issue date
Nov 20, 2012
Kingpak Technology Inc.
Chung Hsien Hsin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Mechanism for positioning a substrate of an image sensor
Patent number
6,751,882
Issue date
Jun 22, 2004
Kingpak Technology Inc.
Pang-Chieh Yen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Memory module structure
Patent number
6,642,554
Issue date
Nov 4, 2003
Kingpak Technology, Inc.
Nai Hua Yeh
G11 - INFORMATION STORAGE
Patents Applications
last 30 patents
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Patent Application
Substrate structure for an image sensor package and method for manu...
Publication number
20060275943
Publication date
Dec 7, 2006
Chung Hsien Hsin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Mechanism for positioning a substrate of an image sensor
Publication number
20050055827
Publication date
Mar 17, 2005
Pang Chieh Yen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Apparatus for removing an adhesive film on a chip
Publication number
20040173322
Publication date
Sep 9, 2004
Pang-Chieh Yen
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Application
Memory module structure
Publication number
20030094628
Publication date
May 22, 2003
Nai Hua Yeh
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...