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Patents Grantslast 30 patents

  • Information Patent Grant

    Processing method for wafer
    • Patent number 11,094,523
    • Issue date Aug 17, 2021
    • Disco Corporation
    • Xin Lu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wafer processing method
    • Patent number 10,950,504
    • Issue date Mar 16, 2021
    • Disco Corporation
    • Zach Powers
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20200176316
    • Publication date Jun 4, 2020
    • Disco Corporation
    • Zach POWERS
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PROCESSING METHOD FOR WAFER
    • Publication number 20200168451
    • Publication date May 28, 2020
    • Disco Corporation
    • Xin LU
    • H01 - BASIC ELECTRIC ELEMENTS