Zaid Aboush

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Cambridge, GB

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Patents Grantslast 30 patents

Information Patent Grant
Under bump passive components in wafer level packaging
- Patent number 8,710,658
- Issue date Apr 29, 2014
- Cambridge Silicon Radio Limited
- Zaid Aboush
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Under land routing
- Patent number 8,368,224
- Issue date Feb 5, 2013
- Cambridge Silicon Radio Ltd.
- Zaid Aboush
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Low cost flexible substrate
- Patent number 8,187,922
- Issue date May 29, 2012
- Cambridge Silicon Radio Ltd.
- Zaid Aboush
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
UNDER BUMP PASSIVES IN WAFER LEVEL PACKAGING
- Publication number 20130127060
- Publication date May 23, 2013
- Cambridge Silicon Radio Limited
- Zaid Aboush
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDER LAND ROUTING
- Publication number 20110006434
- Publication date Jan 13, 2011
- CAMBRIDGE SILICON RADIO LTD.
- Zaid Aboush
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
LOW COST FLEXIBLE SUBSTRATE
- Publication number 20100078800
- Publication date Apr 1, 2010
- CAMBRIDGE SILICON RADIO LTD.
- Zaid Aboush
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR