Zakaria Abdullah

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Seremban, MY

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Patents Grantslast 30 patents

Information Patent Grant
Adjustable pick-up head and method for manufacturing a device
- Patent number 9,196,521
- Issue date Nov 24, 2015
- Infineon Technologies AG
- Abdul Rahman Mohamed
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor package with ribbon with metal layers
- Patent number 8,022,558
- Issue date Sep 20, 2011
- Infineon Technologies AG
- Chee Soon Law
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Adjustable Pick-up Head and Method for Manufacturing a Device
- Publication number 20140123454
- Publication date May 8, 2014
- INFINEON TECHNOLOGIES AG
- Abdul Rahman Mohamed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH RIBBON WITH METAL LAYERS
- Publication number 20100207279
- Publication date Aug 19, 2010
- INFINEON TECHNOLOGIES AG
- Chee Soon Law
- H01 - BASIC ELECTRIC ELEMENTS