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Patents Grants
last 30 patents
Information
Patent Grant
Automatic kerf offset mapping and correction system for laser dicing
Patent number
11,901,232
Issue date
Feb 13, 2024
Applied Materials, Inc.
Karthik Balakrishnan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Laser scribing trench opening control in wafer dicing using hybrid...
Patent number
11,854,888
Issue date
Dec 26, 2023
Applied Materials, Inc.
Jungrae Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Hybrid wafer dicing approach using a spatially multi-focused laser...
Patent number
11,011,424
Issue date
May 18, 2021
Applied Materials, Inc.
Jungrae Park
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
HYBRID WAFER DICING APPROACH USING A RECTANGULAR LASER SPOT-BASED L...
Publication number
20240363412
Publication date
Oct 31, 2024
Applied Materials, Inc.
Karthik Balakrishnan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LASER SCRIBING TRENCH OPENING CONTROL IN WAFER DICING USING HYBRID...
Publication number
20240079273
Publication date
Mar 7, 2024
Applied Materials, Inc.
Jungrae Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
AUTOMATIC KERF OFFSET MAPPING AND CORRECTION SYSTEM FOR LASER DICING
Publication number
20210398853
Publication date
Dec 23, 2021
Applied Materials, Inc.
Karthik Balakrishnan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LASER SCRIBING TRENCH OPENING CONTROL IN WAFER DICING USING HYBRID...
Publication number
20210398854
Publication date
Dec 23, 2021
Applied Materials, Inc.
Jungrae Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HYBRID WAFER DICING APPROACH USING A SPATIALLY MULTI-FOCUSED LASER...
Publication number
20210233816
Publication date
Jul 29, 2021
Applied Materials, Inc.
Jungrae Park
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR