Zeki Z. Celik

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Sunnyvale, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Thermal improvement of integrated circuit packages
- Patent number 8,946,871
- Issue date Feb 3, 2015
- LSI Corporation
- Zeki Z. Celik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process of grounding heat spreader/stiffener to a flip chip package...
- Patent number 7,968,999
- Issue date Jun 28, 2011
- LSI Corporation
- Zeki Z. Celik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally-enhanced flip chip IC package with extruded heatspreader
- Patent number 6,114,761
- Issue date Sep 5, 2000
- LSI Logic Corporation
- Atila Mertol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for low velocity measurement of fluid flow
- Patent number 5,880,377
- Issue date Mar 9, 1999
- LSI Logic Corporation
- Zeki Z. Celik
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
THERMAL IMPROVEMENT OF INTEGRATED CIRCUIT PACKAGES
- Publication number 20140124918
- Publication date May 8, 2014
- LSI Corporation
- Zeki Z. Celik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS OF GROUNDING HEAT SPREADER/STIFFENER TO A FLIP CHIP PACKAGE...
- Publication number 20090218680
- Publication date Sep 3, 2009
- Zeki Z. Celik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR GENERATING FULLY DETAILED THREE-DIMENSIONA...
- Publication number 20090030660
- Publication date Jan 29, 2009
- LSI Logic Corporation
- Zeki Celik
- G06 - COMPUTING CALCULATING COUNTING