Zelong JIAO

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Beijing, CN

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Patents Grantslast 30 patents

Information Patent Grant
Interconnection structure used in electronic device and method for...
- Patent number 11,849,559
- Issue date Dec 19, 2023
- Huawei Technologies Co., Ltd.
- Xuguang Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
COOLING MODULE AND COMPUTING DEVICE
- Publication number 20240357773
- Publication date Oct 24, 2024
- Huawei Technologies Co., Ltd
- Zelong JIAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP PACKAGE STRUCTURE AND ELECTRONIC DEVICE
- Publication number 20240071859
- Publication date Feb 29, 2024
- Huawei Technologies Co., Ltd
- Zelong Jiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOARD, ELECTRONIC DEVICE, AND MANUFACTURING METHOD
- Publication number 20220375821
- Publication date Nov 24, 2022
- Huawei Technologies Co., Ltd
- Zhaokuan LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE USED IN ELECTRONIC DEVICE AND METHOD FOR...
- Publication number 20220256727
- Publication date Aug 11, 2022
- Huawei Technologies Co., Ltd
- Xuguang YANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR