Zengyu Zhou

Person

Shanghai, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Reducing keep-out-zone area for a semiconductor device
- Patent number 12,021,060
- Issue date Jun 25, 2024
- Western Digital Technologies, Inc.
- Kevin Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged memory device with flip chip and wire bond dies
- Patent number 12,021,061
- Issue date Jun 25, 2024
- Western Digital Technologies, Inc.
- Rui Yuan
- G11 - INFORMATION STORAGE
Information Patent Grant
Tombstone prevention for a surface mount device
- Patent number 11,917,761
- Issue date Feb 27, 2024
- Western Digital Technologies, Inc.
- Joyce Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate component layout and bonding method for increased package...
- Patent number 11,810,896
- Issue date Nov 7, 2023
- Western Digital Technologies, Inc.
- Jiandi Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including conductive bumps to improve EMI/RFI...
- Patent number 11,784,135
- Issue date Oct 10, 2023
- Western Digital Technologies, Inc.
- Jiandi Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including high speed heterogeneous integrated...
- Patent number 11,031,378
- Issue date Jun 8, 2021
- Western Digital Technologies, Inc.
- Yazhou Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including vertically integrated groups of semi...
- Patent number 10,236,276
- Issue date Mar 19, 2019
- SanDisk Information Technology (Shanghai) Co., Ltd.
- Yangming Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan out semiconductor device including a plurality of semiconductor...
- Patent number 10,177,119
- Issue date Jan 8, 2019
- SanDisk Information Technology (Shanghai) Co., Ltd.
- Cong Zhang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE HAVING AN INCREASED METAL TRACE THICKNESS
- Publication number 20240332156
- Publication date Oct 3, 2024
- Western Digital Technologies, Inc.
- Rui Yuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH THERMAL DISSIPATION FEATURES FOR A FLIP CHIP STRUCTURE
- Publication number 20240304515
- Publication date Sep 12, 2024
- Western Digital Technologies, Inc.
- Xuyi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device With Optimized Underfill Flow
- Publication number 20230299034
- Publication date Sep 21, 2023
- Western Digital Technologies, Inc.
- Yihao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOMBSTONE PREVENTION FOR A SURFACE MOUNT DEVICE
- Publication number 20230284388
- Publication date Sep 7, 2023
- Western Digital Technologies, Inc.
- Joyce Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING CONDUCTIVE BUMPS TO IMPROVE EMI/RFI...
- Publication number 20220406726
- Publication date Dec 22, 2022
- Western Digital Technologies, Inc.
- Jiandi Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate Component Layout and Bonding Method for Increased Package...
- Publication number 20220375896
- Publication date Nov 24, 2022
- Western Digital Technologies, Inc.
- Jiandi DU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED MEMORY DEVICE WITH FLIP CHIP AND WIRE BOND DIES
- Publication number 20220285316
- Publication date Sep 8, 2022
- Western Digital Technologies, Inc.
- Rui Yuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCING KEEP-OUT-ZONE AREA FOR A SEMICONDUCTOR DEVICE
- Publication number 20220093559
- Publication date Mar 24, 2022
- Western Digital Technologies, Inc.
- Kevin Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING HIGH SPEED HETEROGENEOUS INTEGRATED...
- Publication number 20200411479
- Publication date Dec 31, 2020
- Western Digital Technologies, Inc.
- Yazhou Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING VERTICALLY INTEGRATED GROUPS OF SEMI...
- Publication number 20180294251
- Publication date Oct 11, 2018
- SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
- Yangming Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN OUT SEMICONDUCTOR DEVICE INCLUDING A PLURALITY OF SEMICONDUCTOR...
- Publication number 20180019228
- Publication date Jan 18, 2018
- SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
- Cong Zhang
- H01 - BASIC ELECTRIC ELEMENTS

Zengyu Zhou

Person

Patents Grantslast 30 patents

Reducing keep-out-zone area for a semiconductor device

Packaged memory device with flip chip and wire bond dies

Tombstone prevention for a surface mount device

Substrate component layout and bonding method for increased package...

Semiconductor device including conductive bumps to improve EMI/RFI...

Semiconductor device including high speed heterogeneous integrated...

Semiconductor device including vertically integrated groups of semi...

Fan out semiconductor device including a plurality of semiconductor...

Patents Applicationslast 30 patents

SUBSTRATE HAVING AN INCREASED METAL TRACE THICKNESS

HIGH THERMAL DISSIPATION FEATURES FOR A FLIP CHIP STRUCTURE

Semiconductor Device With Optimized Underfill Flow

TOMBSTONE PREVENTION FOR A SURFACE MOUNT DEVICE

SEMICONDUCTOR DEVICE INCLUDING CONDUCTIVE BUMPS TO IMPROVE EMI/RFI...

Substrate Component Layout and Bonding Method for Increased Package...

PACKAGED MEMORY DEVICE WITH FLIP CHIP AND WIRE BOND DIES

REDUCING KEEP-OUT-ZONE AREA FOR A SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE INCLUDING HIGH SPEED HETEROGENEOUS INTEGRATED...

SEMICONDUCTOR DEVICE INCLUDING VERTICALLY INTEGRATED GROUPS OF SEMI...

FAN OUT SEMICONDUCTOR DEVICE INCLUDING A PLURALITY OF SEMICONDUCTOR...