Zewen Wang

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Dongguan, CN

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Patents Grantslast 30 patents

Information Patent Grant
Printed circuit board, communications device, and manufacturing method
- Patent number 12,058,808
- Issue date Aug 6, 2024
- Huawei Technologies Co., Ltd.
- Wenliang Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Signal connector and terminal device
- Patent number 11,996,656
- Issue date May 28, 2024
- Huawei Technologies Co., Ltd.
- Zewen Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Printed Circuit Board, Backplane Architecture System, and Communica...
- Publication number 20230269862
- Publication date Aug 24, 2023
- Huawei Technologies Co., Ltd
- Wenliang Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIFFERENTIAL PAIR MODULE, CONNECTOR, COMMUNICATIONS DEVICE, AND SHI...
- Publication number 20220271458
- Publication date Aug 25, 2022
- Huawei Technologies Co., Ltd
- Zewen WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Printed Circuit Board, Communications Device, and Manufacturing Method
- Publication number 20220192007
- Publication date Jun 16, 2022
- Huawei Technologies Co., Ltd
- Wenliang Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Signal Connector and Terminal Device
- Publication number 20220085555
- Publication date Mar 17, 2022
- Huawei Technologies Co., Ltd
- Zewen Wang
- H01 - BASIC ELECTRIC ELEMENTS