Zhang Bei Chao

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Singapore, SG

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Patents Grantslast 30 patents

Information Patent Grant
Structure and method for fabricating a bond pad structure
- Patent number 7,276,797
- Issue date Oct 2, 2007
- Chartered Semiconductor Manufacturing Ltd.
- Zhang Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for fabricating a bond pad structure
- Patent number 6,998,335
- Issue date Feb 14, 2006
- Chartered Semiconductor Manufacturing, Ltd.
- Zhang Fan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Structure and method for fabricating a bond pad structure
- Publication number 20060071350
- Publication date Apr 6, 2006
- Zhang Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and method for fabricating a bond pad structure
- Publication number 20050127530
- Publication date Jun 16, 2005
- Zhang Fan
- H01 - BASIC ELECTRIC ELEMENTS