ZHAO-LI ZHANG

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Inspection method and system
- Patent number 11,880,971
- Issue date Jan 23, 2024
- ASML Netherlands B.V.
- Wei Fang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Inspection method and system
- Patent number 11,250,559
- Issue date Feb 15, 2022
- ASML Netherlands B.V.
- Wei Fang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Inspection method and system
- Patent number 10,679,340
- Issue date Jun 9, 2020
- ASML Netherlands B.V.
- Wei Fang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Inspection method and system
- Patent number 10,102,619
- Issue date Oct 16, 2018
- Hermes-Microvision, Inc.
- Wei Fang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Inspection method and system
- Patent number 9,965,844
- Issue date May 8, 2018
- Hermes Microvision Inc.
- Wei Fang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Methods for promoting semiconductor manufacturing yield and classif...
- Patent number 9,251,581
- Issue date Feb 2, 2016
- Hermes-Microvision, Inc.
- Shih-Tsung Chen
- G01 - MEASURING TESTING
Information Patent Grant
Method and system of classifying defects on a wafer
- Patent number 8,805,054
- Issue date Aug 12, 2014
- Hermes-Microvision, Inc.
- Wei Fang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method and system for filtering noises in an image scanned by charg...
- Patent number 8,712,184
- Issue date Apr 29, 2014
- Hermes-Microvision, Inc.
- Chad Liao
- G01 - MEASURING TESTING
Information Patent Grant
Method for inspecting localized image and system thereof
- Patent number 8,606,017
- Issue date Dec 10, 2013
- Hermes-Microvision, Inc.
- Wei Fang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method and system for determining a defect during charged particle...
- Patent number 8,068,662
- Issue date Nov 29, 2011
- Hermes-Microvision, Inc.
- Zhao-Li Zhang
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
INSPECTION METHOD AND SYSTEM
- Publication number 20220245780
- Publication date Aug 4, 2022
- ASML NETHERLANDS B.V.
- Wei FANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INSPECTION METHOD AND SYSTEM
- Publication number 20200302587
- Publication date Sep 24, 2020
- ASML Netherlands B.V.
- Wei FANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INSPECTION METHOD AND SYSTEM
- Publication number 20190147579
- Publication date May 16, 2019
- HERMES MICROVISION, INC.
- Wei FANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD AND SYSTEM OF CLASSIFYING DEFECTS ON A WAFER
- Publication number 20120027287
- Publication date Feb 2, 2012
- Wei FANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD AND SYSTEM FOR DETERMINING A DEFECT DURING CHARGED PARTICLE...
- Publication number 20100246929
- Publication date Sep 30, 2010
- Hermes-Microvision, Inc.
- ZHAO-LI ZHANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD AND SYSTEM OF CLASSIFYING DEFECTS ON A WAFER
- Publication number 20100158346
- Publication date Jun 24, 2010
- Wei FANG
- G06 - COMPUTING CALCULATING COUNTING

ZHAO-LI ZHANG

Person

Patents Grantslast 30 patents

Inspection method and system

Inspection method and system

Inspection method and system

Inspection method and system

Inspection method and system

Methods for promoting semiconductor manufacturing yield and classif...

Method and system of classifying defects on a wafer

Method and system for filtering noises in an image scanned by charg...

Method for inspecting localized image and system thereof

Method and system for determining a defect during charged particle...

Patents Applicationslast 30 patents

INSPECTION METHOD AND SYSTEM

INSPECTION METHOD AND SYSTEM

INSPECTION METHOD AND SYSTEM

METHOD AND SYSTEM OF CLASSIFYING DEFECTS ON A WAFER

METHOD AND SYSTEM FOR DETERMINING A DEFECT DURING CHARGED PARTICLE...

METHOD AND SYSTEM OF CLASSIFYING DEFECTS ON A WAFER