Zhaohui Ma

Person

Boise, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Bond pad with micro-protrusions for direct metallic bonding
- Patent number 12,087,719
- Issue date Sep 10, 2024
- Micron Technology, Inc.
- Aibin Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermocompression bond tips and related apparatus and methods
- Patent number 11,705,425
- Issue date Jul 18, 2023
- Micron Technology, Inc.
- Benjamin L. McClain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for solder bridging elimination for bulk solder C2S intercon...
- Patent number 11,670,612
- Issue date Jun 6, 2023
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermocompression bond tips and related apparatus and methods
- Patent number 11,024,595
- Issue date Jun 1, 2021
- Micron Technology, Inc.
- Benjamin L. McClain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of making semiconductor devices
- Patent number 10,734,370
- Issue date Aug 4, 2020
- Micron Technology, Inc.
- Zhaohui Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices comprising protected side surfaces and relate...
- Patent number 10,312,226
- Issue date Jun 4, 2019
- Micron Technology, Inc.
- Zhaohui Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing multi-die semiconductor device packages an...
- Patent number 10,103,134
- Issue date Oct 16, 2018
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BOND PAD WITH MICRO-PROTRUSIONS FOR DIRECT METALLIC BONDING
- Publication number 20240429190
- Publication date Dec 26, 2024
- Micron Technology, Inc.
- Aibin Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Arrays Comprising Strings Of Memory Cells And Methods Used I...
- Publication number 20230380159
- Publication date Nov 23, 2023
- Micron Technology, Inc.
- Damir Fazil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOCOMPRESSION BOND TIPS AND RELATED APPARATUS AND METHODS
- Publication number 20210233887
- Publication date Jul 29, 2021
- Micron Technology, Inc.
- Benjamin L. McClain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Solder Bridging Elimination for Bulk Solder C2S Intercon...
- Publication number 20210183802
- Publication date Jun 17, 2021
- Micron Technology, Inc.
- BRANDON P. WIRZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD WITH MICRO-PROTRUSIONS FOR DIRECT METALLIC BONDING
- Publication number 20210175194
- Publication date Jun 10, 2021
- Micron Technology, Inc.
- Aibin Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MAKING SEMICONDUCTOR DEVICES
- Publication number 20190252362
- Publication date Aug 15, 2019
- Micron Technology, Inc.
- Zhaohui Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Solder Bridging Elimination for Bulk Solder C2S Intercon...
- Publication number 20190067232
- Publication date Feb 28, 2019
- Micron Technology, Inc.
- BRANDON P. WIRZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOCOMPRESSION BOND TIPS AND RELATED APPARATUS AND METHODS
- Publication number 20180366434
- Publication date Dec 20, 2018
- Micron Technology, Inc.
- Benjamin L. McClain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES COMPRISING PROTECTED SIDE SURFACES AND RELATE...
- Publication number 20180033780
- Publication date Feb 1, 2018
- Micron Technology, Inc.
- Zhaohui Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING MULTI-DIE SEMICONDUCTOR DEVICE PACKAGES AN...
- Publication number 20180033781
- Publication date Feb 1, 2018
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Bond pad with micro-protrusions for direct metallic bonding

Thermocompression bond tips and related apparatus and methods

Method for solder bridging elimination for bulk solder C2S intercon...

Thermocompression bond tips and related apparatus and methods

Methods of making semiconductor devices

Semiconductor devices comprising protected side surfaces and relate...

Methods of manufacturing multi-die semiconductor device packages an...

Patents Applicationslast 30 patents

BOND PAD WITH MICRO-PROTRUSIONS FOR DIRECT METALLIC BONDING

Memory Arrays Comprising Strings Of Memory Cells And Methods Used I...

THERMOCOMPRESSION BOND TIPS AND RELATED APPARATUS AND METHODS

Method for Solder Bridging Elimination for Bulk Solder C2S Intercon...

BOND PAD WITH MICRO-PROTRUSIONS FOR DIRECT METALLIC BONDING

METHODS OF MAKING SEMICONDUCTOR DEVICES

Method for Solder Bridging Elimination for Bulk Solder C2S Intercon...

THERMOCOMPRESSION BOND TIPS AND RELATED APPARATUS AND METHODS

SEMICONDUCTOR DEVICES COMPRISING PROTECTED SIDE SURFACES AND RELATE...

METHODS OF MANUFACTURING MULTI-DIE SEMICONDUCTOR DEVICE PACKAGES AN...