Zhaoqing Chen

Person

Poughkeepsie, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Single-ended-mode to mixed-mode transformer spice circuit model for...
- Patent number 11,120,189
- Issue date Sep 14, 2021
- International Business Machines Corporation
- Zhaoqing Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Transient and AC simulations with traveling wave probe circuit
- Patent number 10,943,044
- Issue date Mar 9, 2021
- International Business Machines Corporation
- Zhaoqing Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Transient and AC simulations with traveling wave probe circuit
- Patent number 10,803,220
- Issue date Oct 13, 2020
- International Business Machines Corporation
- Zhaoqing Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Data clocked retimer model
- Patent number 9,984,189
- Issue date May 29, 2018
- International Business Machines Corporation
- Zhaoqing Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Single ended-mode to mixed-mode transformer spice circuit model for...
- Patent number 9,984,188
- Issue date May 29, 2018
- International Business Machines Corporation
- Zhaoqing Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Interconnect array pattern with a 3:1 signal-to-ground ratio
- Patent number 9,972,566
- Issue date May 15, 2018
- International Business Machines Corporation
- Zhaoqing Chen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Spice circuit model for twinaxial cable
- Patent number 9,858,370
- Issue date Jan 2, 2018
- International Business Machines Corporation
- Zhaoqing Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Spice circuit model for twinaxial cable
- Patent number 9,703,908
- Issue date Jul 11, 2017
- International Business Machines Corporation
- Zhaoqing Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Spice circuit model for twinaxial cable
- Patent number 9,697,311
- Issue date Jul 4, 2017
- International Business Machines Corporation
- Zhaoqing Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Interconnect array pattern with a 3:1 signal-to-ground ratio
- Patent number 9,646,925
- Issue date May 9, 2017
- International Business Machines Corporation
- Zhaoqing Chen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Distribution of power vias in a multi-layer circuit board
- Patent number 9,600,619
- Issue date Mar 21, 2017
- International Business Machines Corporation
- Zhaoqing Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Distribution of power vias in a multi-layer circuit board
- Patent number 9,594,865
- Issue date Mar 14, 2017
- International Business Machines Corporation
- Zhaoqing Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Spice circuit model for twinaxial cable
- Patent number 9,542,516
- Issue date Jan 10, 2017
- International Business Machines Corporation
- Zhaoqing Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Interconnect array pattern with a 3:1 signal-to-ground ratio
- Patent number 9,543,241
- Issue date Jan 10, 2017
- International Business Machines Corporation
- Zhaoqing Chen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Crosstalk reduction in electrical interconnects using differential...
- Patent number 8,203,206
- Issue date Jun 19, 2012
- International Business Machines Corporation
- Zhaoqing Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic substrate grid structure for the creation of virtual coax a...
- Patent number 7,985,927
- Issue date Jul 26, 2011
- International Business Machines Corporation
- Wiren D. Becker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Crosstalk reduction in electrical interconnects using differential...
- Patent number 7,939,930
- Issue date May 10, 2011
- International Business Machines Corporation
- Zhaoqing Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic substrate grid structure for the creation of virtual coax a...
- Patent number 7,897,879
- Issue date Mar 1, 2011
- International Business Machines Corporation
- Wiren D. Becker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic substrate grid structure for the creation of virtual coax a...
- Patent number 7,465,882
- Issue date Dec 16, 2008
- International Business Machines Corporation
- Wiren D. Becker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Crosstalk reduction in electrical interconnects using differential...
- Patent number 7,335,976
- Issue date Feb 26, 2008
- International Business Machines Corporation
- Zhaoqing Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Characterizing input/output models
- Patent number 7,219,046
- Issue date May 15, 2007
- International Business Machines Corporation
- Zhaoqing Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Simulation management system
- Patent number 7,131,080
- Issue date Oct 31, 2006
- International Business Machines Corporation
- Thaddeus Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic circuit design analysis system
- Patent number 7,111,275
- Issue date Sep 19, 2006
- International Business Machines Corporation
- Thaddeus Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Fast simulation method for single and coupled lossy lines with freq...
- Patent number 6,694,289
- Issue date Feb 17, 2004
- International Business Machines Corporation
- Zhaoqing Chen
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
TRANSIENT AND AC SIMULATIONS WITH TRAVELING WAVE PROBE CIRCUIT
- Publication number 20180349536
- Publication date Dec 6, 2018
- International Business Machines Corporation
- Zhaoqing Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
TRANSIENT AND AC SIMULATIONS WITH TRAVELING WAVE PROBE CIRCUIT
- Publication number 20180349537
- Publication date Dec 6, 2018
- International Business Machines Corporation
- Zhaoqing Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SINGLE-ENDED-MODE TO MIXED-MODE TRANSFORMER SPICE CIRCUIT MODEL FOR...
- Publication number 20180225401
- Publication date Aug 9, 2018
- International Business Machines Corporation
- Zhaoqing Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Neural Network Based Prediction of PCB Glass Weave Induced Skew
- Publication number 20180113974
- Publication date Apr 26, 2018
- International Business Machines Corporation
- Dylan J. Boday
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DATA CLOCKED RETIMER MODEL
- Publication number 20170242947
- Publication date Aug 24, 2017
- International Business Machines Corporation
- Zhaoqing Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SINGLE-ENDED-MODE TO MIXED-MODE TRANSFORMER SPICE CIRCUIT MODEL FOR...
- Publication number 20170242946
- Publication date Aug 24, 2017
- International Business Machines Corporation
- Zhaoqing Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SPICE CIRCUIT MODEL FOR TWINAXIAL CABLE
- Publication number 20170091362
- Publication date Mar 30, 2017
- International Business Machines Corporation
- Zhaoqing Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SPICE CIRCUIT MODEL FOR TWINAXIAL CABLE
- Publication number 20170091363
- Publication date Mar 30, 2017
- International Business Machines Corporation
- Zhaoqing Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SPICE CIRCUIT MODEL FOR TWINAXIAL CABLE
- Publication number 20170091364
- Publication date Mar 30, 2017
- International Business Machines Corporation
- Zhaoqing Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INTERCONNECT ARRAY PATTERN WITH A 3:1 SIGNAL-TO-GROUND RATIO
- Publication number 20170048967
- Publication date Feb 16, 2017
- International Business Machines Corporation
- Zhaoqing Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PAD-TO-PAD EMBEDDED CAPACITANCE IN LIEU OF SIGNAL VIA TRANSITIONS I...
- Publication number 20170004923
- Publication date Jan 5, 2017
- International Business Machines Corporation
- Zhaoqing Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PAD-TO-PAD EMBEDDED CAPACITANCE IN LIEU OF SIGNAL VIA TRANSITIONS I...
- Publication number 20170006709
- Publication date Jan 5, 2017
- International Business Machines Corporation
- Zhaoqing Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISTRIBUTION OF POWER VIAS IN A MULTI-LAYER CIRCUIT BOARD
- Publication number 20160342723
- Publication date Nov 24, 2016
- International Business Machines Corporation
- Zhaoqing Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DISTRIBUTION OF POWER VIAS IN A MULTI-LAYER CIRCUIT BOARD
- Publication number 20160342724
- Publication date Nov 24, 2016
- International Business Machines Corporation
- Zhaoqing Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INTERCONNECT ARRAY PATTERN WITH A 3:1 SIGNAL-TO-GROUND RATIO
- Publication number 20160150638
- Publication date May 26, 2016
- International Business Machines Corporation
- Zhaoqing Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT ARRAY PATTERN WITH A 3:1 SIGNAL-TO-GROUND RATIO
- Publication number 20160149611
- Publication date May 26, 2016
- International Business Machines Corporation
- Zhaoqing Chen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
CROSSTALK REDUCTION IN ELECTRICAL INTERCONNECTS USING DIFFERENTIAL...
- Publication number 20110133254
- Publication date Jun 9, 2011
- Zhaoqing Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC SUBSTRATE GRID STRUCTURE FOR THE CREATION OF VIRTUAL COAX A...
- Publication number 20090113703
- Publication date May 7, 2009
- International Business Machines Corporation
- Wiren D. Becker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC SUBSTRATE GRID STRUCTURE FOR THE CREATION OF VIRTUAL COAX A...
- Publication number 20090108465
- Publication date Apr 30, 2009
- International Business Machines Corporation
- Wiren D. Becker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC SUBSTRATE GRID STRUCTURE FOR THE CREATION OF VIRTUAL COAX A...
- Publication number 20080142257
- Publication date Jun 19, 2008
- International Business Machines Corporation
- Wiren D. Becker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CROSSTALK REDUCTION IN ELECTRICAL INTERCONNECTS USING DIFFERENTIAL...
- Publication number 20080054308
- Publication date Mar 6, 2008
- Zhaoqing Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Crosstalk reduction in electrical interconnects using differential...
- Publication number 20060267048
- Publication date Nov 30, 2006
- Zhaoqing Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Characterizing input/output models
- Publication number 20050131664
- Publication date Jun 16, 2005
- International Business Machines Corporation
- Zhaoqing Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Electronic circuit design analysis system
- Publication number 20050050489
- Publication date Mar 3, 2005
- International Business Machines Corporation
- Thaddeus Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Simulation management system
- Publication number 20050049841
- Publication date Mar 3, 2005
- International Business Machines Corporation
- Thaddeus Chen
- G06 - COMPUTING CALCULATING COUNTING

Zhaoqing Chen

Person

Patents Grantslast 30 patents

Single-ended-mode to mixed-mode transformer spice circuit model for...

Transient and AC simulations with traveling wave probe circuit

Transient and AC simulations with traveling wave probe circuit

Data clocked retimer model

Single ended-mode to mixed-mode transformer spice circuit model for...

Interconnect array pattern with a 3:1 signal-to-ground ratio

Spice circuit model for twinaxial cable

Spice circuit model for twinaxial cable

Spice circuit model for twinaxial cable

Interconnect array pattern with a 3:1 signal-to-ground ratio

Distribution of power vias in a multi-layer circuit board

Distribution of power vias in a multi-layer circuit board

Spice circuit model for twinaxial cable

Interconnect array pattern with a 3:1 signal-to-ground ratio

Crosstalk reduction in electrical interconnects using differential...

Ceramic substrate grid structure for the creation of virtual coax a...

Crosstalk reduction in electrical interconnects using differential...

Ceramic substrate grid structure for the creation of virtual coax a...

Ceramic substrate grid structure for the creation of virtual coax a...

Crosstalk reduction in electrical interconnects using differential...

Characterizing input/output models

Simulation management system

Electronic circuit design analysis system

Fast simulation method for single and coupled lossy lines with freq...

Patents Applicationslast 30 patents

TRANSIENT AND AC SIMULATIONS WITH TRAVELING WAVE PROBE CIRCUIT

TRANSIENT AND AC SIMULATIONS WITH TRAVELING WAVE PROBE CIRCUIT

SINGLE-ENDED-MODE TO MIXED-MODE TRANSFORMER SPICE CIRCUIT MODEL FOR...

Neural Network Based Prediction of PCB Glass Weave Induced Skew

DATA CLOCKED RETIMER MODEL

SINGLE-ENDED-MODE TO MIXED-MODE TRANSFORMER SPICE CIRCUIT MODEL FOR...

SPICE CIRCUIT MODEL FOR TWINAXIAL CABLE

SPICE CIRCUIT MODEL FOR TWINAXIAL CABLE

SPICE CIRCUIT MODEL FOR TWINAXIAL CABLE

INTERCONNECT ARRAY PATTERN WITH A 3:1 SIGNAL-TO-GROUND RATIO

PAD-TO-PAD EMBEDDED CAPACITANCE IN LIEU OF SIGNAL VIA TRANSITIONS I...

PAD-TO-PAD EMBEDDED CAPACITANCE IN LIEU OF SIGNAL VIA TRANSITIONS I...

DISTRIBUTION OF POWER VIAS IN A MULTI-LAYER CIRCUIT BOARD

DISTRIBUTION OF POWER VIAS IN A MULTI-LAYER CIRCUIT BOARD

INTERCONNECT ARRAY PATTERN WITH A 3:1 SIGNAL-TO-GROUND RATIO

INTERCONNECT ARRAY PATTERN WITH A 3:1 SIGNAL-TO-GROUND RATIO

CROSSTALK REDUCTION IN ELECTRICAL INTERCONNECTS USING DIFFERENTIAL...

CERAMIC SUBSTRATE GRID STRUCTURE FOR THE CREATION OF VIRTUAL COAX A...

CERAMIC SUBSTRATE GRID STRUCTURE FOR THE CREATION OF VIRTUAL COAX A...

CERAMIC SUBSTRATE GRID STRUCTURE FOR THE CREATION OF VIRTUAL COAX A...

CROSSTALK REDUCTION IN ELECTRICAL INTERCONNECTS USING DIFFERENTIAL...

Crosstalk reduction in electrical interconnects using differential...

Characterizing input/output models

Electronic circuit design analysis system

Simulation management system