Zhaosheng MENG

Follow

Person

Qingdao, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Method to form contacts with multiple depth by enhanced CESL
- Patent number 12,131,946
- Issue date Oct 29, 2024
- SiEn (QingDao) Integrated Circuits Co., Ltd
- Min-Hwa Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Simultaneous self-forming hea barrier and Cu seeding layers for Cu...
- Patent number 11,978,702
- Issue date May 7, 2024
- SiEn (QingDao) Integrated Circuits Co., Ltd
- Yong Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
ALD method with multi-chambers for sic or multi-elements epitaxial...
- Patent number 11,834,754
- Issue date Dec 5, 2023
- SiEn (QingDao) Integrated Circuits Co., Ltd
- Zhaosheng Meng
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
SIMULTANEOUS SELF-FORMING HEA BARRIER AND CU SEEDING LAYERS FOR CU...
- Publication number 20220319999
- Publication date Oct 6, 2022
- SiEn (QingDao) Integrated Circuits Co., Ltd
- Yong ZHAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NEW ALD METHOD WITH MULTI-CHAMBERS FOR SIC OR MULTI-ELEMENTS EPITAX...
- Publication number 20220243359
- Publication date Aug 4, 2022
- SiEn (QingDao) Integrated Circuits Co., Ltd
- Zhaosheng MENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NEW METHOD TO FORM CONTACTS WITH MULTIPLE DEPTH BY ENHANCED CESL
- Publication number 20220246470
- Publication date Aug 4, 2022
- SiEn (QingDao) Integrated Circuits Co., Ltd
- Min-Hwa CHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LINER AND BARRIER LAYER IN DUAL DAMASCENE CU INTERCONNECT FOR ENHAN...
- Publication number 20220216101
- Publication date Jul 7, 2022
- SiEn (QingDao) Integrated Circuits Co., Ltd
- Zhaosheng MENG
- H01 - BASIC ELECTRIC ELEMENTS