Zhe Li

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Tianjin, CN

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Patents Grantslast 30 patents

Information Patent Grant
Method of making chip-on-lead package
- Patent number 8,642,395
- Issue date Feb 4, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Zhe Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coated lead frame
- Patent number 7,887,928
- Issue date Feb 15, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Chao Wang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
Method for Early Warning Brandish of Transmission Wire Based on Imp...
- Publication number 20220383165
- Publication date Dec 1, 2022
- State Grid Henan Electric Power Company Electric Power Research Institute
- Degui Yao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD OF MAKING CHIP-ON-LEAD PACKAGE
- Publication number 20100248426
- Publication date Sep 30, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Zhe Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COATED LEAD FRAME
- Publication number 20090111220
- Publication date Apr 30, 2009
- FREESCALE SEMICONDUCTOR, INC.
- Chao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME FOR SEMICONDUCTOR DEVICE
- Publication number 20080290487
- Publication date Nov 27, 2008
- FREESCALE SEMICONDUCTOR, INC.
- Li-Guo ZHAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BOND AND METHOD OF FORMING SAME
- Publication number 20080116548
- Publication date May 22, 2008
- FREESCALE SEMICONDUCTOR, INC.
- Zhe Li
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BRACE FOR WIRE LOOP
- Publication number 20070105280
- Publication date May 10, 2007
- FREESCALE SEMICONDUCTOR, INC.
- Zhe Li
- H01 - BASIC ELECTRIC ELEMENTS