Zhe Wang

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Method for forming semiconductor structure
- Patent number 11,749,741
- Issue date Sep 5, 2023
- United Microelectronics Corp.
- Zhe Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test key for checking the window of a doped region and method of us...
- Patent number 9,685,387
- Issue date Jun 20, 2017
- United Microelectronics Corp.
- Zhe Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon based MEMS microphone, a system and a package with the same
- Patent number 9,438,972
- Issue date Sep 6, 2016
- GOERTEK INC.
- Zhe Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS microphone and method for packaging the same
- Patent number 9,108,840
- Issue date Aug 18, 2015
- GoerTek Inc.
- Zhe Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
CMOS compatible MEMS microphone and method for manufacturing the same
- Patent number 8,962,368
- Issue date Feb 24, 2015
- Goertek, Inc.
- Zhe Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
CMOS compatible silicon differential condenser microphone and metho...
- Patent number 8,860,154
- Issue date Oct 14, 2014
- Goertek Inc.
- Zhe Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
CMOS compatible MEMS microphone and method for manufacturing the same
- Patent number 8,847,289
- Issue date Sep 30, 2014
- Goertek Inc.
- Zhe Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Process for making particles for delivery of drug nanoparticles
- Patent number 8,835,376
- Issue date Sep 16, 2014
- Nanomaterials Technology PTE Ltd.
- Zhigang Shen
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Silicon microphone without dedicated backplate
- Patent number 8,467,559
- Issue date Jun 18, 2013
- Shandong Gettop Acoustic Co., Ltd.
- Wang Zhe
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Double-side mountable MEMS package
- Patent number 8,178,936
- Issue date May 15, 2012
- Shandong Gettop Acoustic Co. Ltd.
- Wang Zhe
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Silicon microphone with enhanced impact proof structure using bondi...
- Patent number 8,045,733
- Issue date Oct 25, 2011
- Shandong Gettop Acoustic Co., Ltd.
- Wang Zhe
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Backplateless silicon microphone
- Patent number 8,045,734
- Issue date Oct 25, 2011
- Shandong Gettop Acoustic Co., Ltd.
- Wang Zhe
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Folded lead-frame packages for MEMS devices
- Patent number 8,013,404
- Issue date Sep 6, 2011
- Shandong Gettop Acoustic Co. Ltd.
- Wang Zhe
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS G-switch device
- Patent number 7,999,201
- Issue date Aug 16, 2011
- Shandong Gettop Acoustic Co. Ltd.
- Wang Zhe
- G01 - MEASURING TESTING
Information Patent Grant
Double-side mountable MEMS package
- Patent number 7,843,021
- Issue date Nov 30, 2010
- Shandong Gettop Acoustic Co. Ltd.
- Wang Zhe
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Silicon microphone with impact proof structure
- Patent number 7,804,969
- Issue date Sep 28, 2010
- Shandong Gettop Acoustic Co., Ltd.
- Zhe Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS packaging method for enhanced EMI immunity using flexible subs...
- Patent number 7,692,288
- Issue date Apr 6, 2010
- Silicon Matrix Pte. Ltd.
- Wang Zhe
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS microphone with a stacked PCB package and method of producing...
- Patent number 7,436,054
- Issue date Oct 14, 2008
- Silicon Matrix, Pte. Ltd.
- Wang Zhe
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Insulation of anti-resonance in resonators
- Patent number 7,352,262
- Issue date Apr 1, 2008
- Yong Ping Xu
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Backplateless silicon microphone
- Patent number 7,346,178
- Issue date Mar 18, 2008
- Silicon Matrix Pte. Ltd.
- Wang Zhe
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Silicon microphone with softly constrained diaphragm
- Patent number 7,329,933
- Issue date Feb 12, 2008
- Silicon Matrix Pte. Ltd.
- Wang Zhe
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
MEMS package using flexible substrates, and method thereof
- Patent number 7,202,552
- Issue date Apr 10, 2007
- Silicon Matrix Pte. Ltd.
- Wang Zhe
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
High performance silicon condenser microphone with perforated singl...
- Patent number 7,132,307
- Issue date Nov 7, 2006
- Knowles Electronics, LLC
- Zhe Wang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Insulation of anti-resonance in resonators
- Patent number 7,095,297
- Issue date Aug 22, 2006
- National University of Singapore
- Yong Ping Xu
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Apparatus and process for bulk wet etch with leakage protection
- Patent number 6,855,640
- Issue date Feb 15, 2005
- Institute of Microelectronics
- Zhe Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High performance silicon condenser microphone with perforated singl...
- Patent number 6,667,189
- Issue date Dec 23, 2003
- Institute of Microelectronics
- Zhe Wang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Structural design for improving the sensitivity of a surface-microm...
- Patent number 6,293,148
- Issue date Sep 25, 2001
- Institute of Microelectronics
- Zhe Wang
- G01 - MEASURING TESTING
Information Patent Grant
CMOS compatable surface machined pressure sensor and method of fabr...
- Patent number 6,225,140
- Issue date May 1, 2001
- Institute of Microelectronics
- Lianjun Liu
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
Method for forming semiconductor structure
- Publication number 20230070135
- Publication date Mar 9, 2023
- UNITED MICROELECTRONICS CORP.
- ZHE WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING FIBER-SHAPED STRUCTURE, FIBER-SHAPED STRUCTURE, A...
- Publication number 20220025551
- Publication date Jan 27, 2022
- Nanyang Technological University
- Lei Wei
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
CMOS COMPATIBLE MEMS MICROPHONE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20150031160
- Publication date Jan 29, 2015
- Zhe Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SILICON BASED MEMS MICROPHONE, A SYSTEM AND A PACKAGE WITH THE SAME
- Publication number 20140299948
- Publication date Oct 9, 2014
- Goertek Inc.
- Zhe Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CMOS COMPATIBLE SILICON DIFFERENTIAL CONDENSER MICROPHONE AND METHO...
- Publication number 20140239352
- Publication date Aug 28, 2014
- Goertek Inc.
- Zhe Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS MICROPHONE AND METHOD FOR PACKAGING THE SAME
- Publication number 20140008740
- Publication date Jan 9, 2014
- Zhe Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CMOS COMPATIBLE MEMS MICROPHONE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20120319174
- Publication date Dec 20, 2012
- Goertek Inc.
- Zhe Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PROCESS FOR MAKING PARTICLES FOR DELIVERY OF DRUG NANOPARTICLES
- Publication number 20110306539
- Publication date Dec 15, 2011
- Zhigang Shen
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
Double-side mountable MEMS package
- Publication number 20110062573
- Publication date Mar 17, 2011
- Wang Zhe
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS G-switch device
- Publication number 20100108478
- Publication date May 6, 2010
- Silicon Matrix Pte Ltd
- Wang Zhe
- G01 - MEASURING TESTING
Information Patent Application
Folded lead-frame packages for MEMS devices
- Publication number 20100090295
- Publication date Apr 15, 2010
- Silicon Matrix Pte Ltd
- Wang Zhe
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Double-side mountable MEMS package
- Publication number 20090218668
- Publication date Sep 3, 2009
- Silicon Matrix Pte Ltd
- Wang Zhe
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Silicon microphone without dedicated backplate
- Publication number 20090208037
- Publication date Aug 20, 2009
- Silicon Matrix Pte Ltd
- Wang Zhe
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Silicon microphone with enhanced impact proof structure using bondi...
- Publication number 20090092273
- Publication date Apr 9, 2009
- Silicon Matrix Pte Ltd
- Wang Zhe
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Backplateless silicon microphone
- Publication number 20080123878
- Publication date May 29, 2008
- Silicon Matrix, Pte. Ltd.
- Wang Zhe
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Silicon microphone with impact proof structure
- Publication number 20080031476
- Publication date Feb 7, 2008
- Silicon Matrix Pte Ltd
- Zhe Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS microphone with a stacked PCB package and method of producing...
- Publication number 20070205492
- Publication date Sep 6, 2007
- Silicon Matrix, Pte. Ltd.
- Zhe Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Insulation of anti-resonance in resonators
- Publication number 20070040632
- Publication date Feb 22, 2007
- Yong Ping Xu
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
MEMS packaging method for enhanced EMI immunity using flexible subs...
- Publication number 20070013052
- Publication date Jan 18, 2007
- Silicon Matrix, Pte., Ltd.
- Wang Zhe
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS package using flexible substrates, and method thereof
- Publication number 20070013036
- Publication date Jan 18, 2007
- Silicon Matrix Pte Ltd
- Wang Zhe
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Backplateless silicon microphone
- Publication number 20060093170
- Publication date May 4, 2006
- Altus Technologies Pte. Ltd.
- Wang Zhe
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Silicon microphone with softly constrained diaphragm
- Publication number 20060093171
- Publication date May 4, 2006
- Altus Technologies Pte. Ltd.
- Wang Zhe
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Apparatus and process for bulk wet etch with leakage protection
- Publication number 20050118822
- Publication date Jun 2, 2005
- Institute of Microelectronics
- Zhe Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High performance silicon condenser microphone with perforated singl...
- Publication number 20050005421
- Publication date Jan 13, 2005
- KNOWLES ELECTRONICS, LLC
- Zhe Wang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Method to fabricate a highly perforated silicon diaphragm with cont...
- Publication number 20040253760
- Publication date Dec 16, 2004
- Agency For Science, Technology and Research
- Qingxin Zhang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
High performance silicon condenser microphone with perforated singl...
- Publication number 20040179705
- Publication date Sep 16, 2004
- Zhe Wang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Apparatus and process for bulk wet etch with leakage protection
- Publication number 20030160022
- Publication date Aug 28, 2003
- Institute of Microelectronics
- Zhe Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Insulation of anti-resonance in resonators
- Publication number 20030148733
- Publication date Aug 7, 2003
- Yong Ping Xu
- H03 - BASIC ELECTRONIC CIRCUITRY

Person

Patents Grantslast 30 patents

Method for forming semiconductor structure

Test key for checking the window of a doped region and method of us...

Silicon based MEMS microphone, a system and a package with the same

MEMS microphone and method for packaging the same

CMOS compatible MEMS microphone and method for manufacturing the same

CMOS compatible silicon differential condenser microphone and metho...

CMOS compatible MEMS microphone and method for manufacturing the same

Process for making particles for delivery of drug nanoparticles

Silicon microphone without dedicated backplate

Double-side mountable MEMS package

Silicon microphone with enhanced impact proof structure using bondi...

Backplateless silicon microphone

Folded lead-frame packages for MEMS devices

MEMS G-switch device

Double-side mountable MEMS package

Silicon microphone with impact proof structure

MEMS packaging method for enhanced EMI immunity using flexible subs...

MEMS microphone with a stacked PCB package and method of producing...

Insulation of anti-resonance in resonators

Backplateless silicon microphone

Silicon microphone with softly constrained diaphragm

MEMS package using flexible substrates, and method thereof

High performance silicon condenser microphone with perforated singl...

Insulation of anti-resonance in resonators

Apparatus and process for bulk wet etch with leakage protection

High performance silicon condenser microphone with perforated singl...

Structural design for improving the sensitivity of a surface-microm...

CMOS compatable surface machined pressure sensor and method of fabr...

Patents Applicationslast 30 patents

Method for forming semiconductor structure

METHOD OF FORMING FIBER-SHAPED STRUCTURE, FIBER-SHAPED STRUCTURE, A...

CMOS COMPATIBLE MEMS MICROPHONE AND METHOD FOR MANUFACTURING THE SAME

SILICON BASED MEMS MICROPHONE, A SYSTEM AND A PACKAGE WITH THE SAME

CMOS COMPATIBLE SILICON DIFFERENTIAL CONDENSER MICROPHONE AND METHO...

MEMS MICROPHONE AND METHOD FOR PACKAGING THE SAME

CMOS COMPATIBLE MEMS MICROPHONE AND METHOD FOR MANUFACTURING THE SAME

PROCESS FOR MAKING PARTICLES FOR DELIVERY OF DRUG NANOPARTICLES

Double-side mountable MEMS package

MEMS G-switch device

Folded lead-frame packages for MEMS devices

Double-side mountable MEMS package

Silicon microphone without dedicated backplate

Silicon microphone with enhanced impact proof structure using bondi...

Backplateless silicon microphone

Silicon microphone with impact proof structure

MEMS microphone with a stacked PCB package and method of producing...

Insulation of anti-resonance in resonators

MEMS packaging method for enhanced EMI immunity using flexible subs...

MEMS package using flexible substrates, and method thereof

Backplateless silicon microphone

Silicon microphone with softly constrained diaphragm

Apparatus and process for bulk wet etch with leakage protection

High performance silicon condenser microphone with perforated singl...

Method to fabricate a highly perforated silicon diaphragm with cont...

High performance silicon condenser microphone with perforated singl...

Apparatus and process for bulk wet etch with leakage protection

Insulation of anti-resonance in resonators