Zhen LV

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Shanghai, CN

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Patents Grantslast 30 patents

Information Patent Grant
Pin, pin combination structure, package body, and method for manufa...
- Patent number 11,539,150
- Issue date Dec 27, 2022
- Huawei Technologies Co., Ltd.
- Hong Wu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
POWER MODULE, POWER SUPPLY SYSTEM, VEHICLE, AND PHOTOVOLTAIC SYSTEM
- Publication number 20250070055
- Publication date Feb 27, 2025
- Huawei Digital Power Technologies Co., Ltd.
- Fengqun Lang
- B60 - VEHICLES IN GENERAL
Information Patent Application
POWER MODULE AND VEHICLE-MOUNTED POWER CIRCUIT
- Publication number 20240312895
- Publication date Sep 19, 2024
- Huawei Digital Power Technologies Co., Ltd.
- Huibin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE AND MANUFACTURING METHOD THEREOF
- Publication number 20230395464
- Publication date Dec 7, 2023
- Huawei Digital Power Technologies Co., Ltd.
- Ruoyang DU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE, PACKAGED STRUCTURE, AND ELECTRONIC DEVICE
- Publication number 20230230928
- Publication date Jul 20, 2023
- Huawei Technologies Co., Ltd.
- Huibin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing Power Semiconductor Module and Power Semicondu...
- Publication number 20220406679
- Publication date Dec 22, 2022
- Huawei Digital Power Technologies Co., Ltd.
- Ruoyang Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIN, PIN COMBINATION STRUCTURE, PACKAGE BODY, AND METHOD FOR MANUFA...
- Publication number 20210119358
- Publication date Apr 22, 2021
- Huawei Technologies Co., Ltd
- Hong WU
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Pin, pin combination structure, package body, and method for manufa...

Patents Applicationslast 30 patents

POWER MODULE, POWER SUPPLY SYSTEM, VEHICLE, AND PHOTOVOLTAIC SYSTEM

POWER MODULE AND VEHICLE-MOUNTED POWER CIRCUIT

POWER SEMICONDUCTOR MODULE AND MANUFACTURING METHOD THEREOF

SUBSTRATE, PACKAGED STRUCTURE, AND ELECTRONIC DEVICE

Method for Producing Power Semiconductor Module and Power Semicondu...

PIN, PIN COMBINATION STRUCTURE, PACKAGE BODY, AND METHOD FOR MANUFA...