Zhendong Luo

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Shenzhen, CN

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Patents Grantslast 30 patents

Information Patent Grant
Photosensitive chip package structure, camera module, and mobile te...
- Patent number 11,869,908
- Issue date Jan 9, 2024
- HONOR DEVICE CO., LTD.
- Atsushi Yajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Camera substrate assembly, camera module, and terminal device
- Patent number 11,102,384
- Issue date Aug 24, 2021
- Huawei Technologies Co., Ltd.
- Guanghai Wang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
PHOTOSENSITIVE CHIP PACKAGE STRUCTURE, CAMERA MODULE, AND MOBILE TE...
- Publication number 20210313366
- Publication date Oct 7, 2021
- Huawei Technologies Co., Ltd
- Atsushi YAJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Camera Substrate Assembly, Camera Module, and Terminal Device
- Publication number 20190356822
- Publication date Nov 21, 2019
- Huawei Technologies Co., Ltd
- Guanghai Wang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE