Zheng Luo

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Guangzhou City, CN

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Patents Applicationslast 30 patents

Information Patent Application
High-Reliability Copper Alloy Bonding Wire for Electronic Packaging...
- Publication number 20200373272
- Publication date Nov 26, 2020
- SOUTH CHINA UNIVERSITY OF TECHNOLOGY
- Bin Yuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Nanoporous Copper-Zinc-Aluminum Shape Memory Alloy and Preparation...
- Publication number 20190316243
- Publication date Oct 17, 2019
- SOUTH CHINA UNIVERSITY OF TECHNOLOGY
- Bin Yuan
- B82 - NANO-TECHNOLOGY