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Zheng Peng Xiong
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Singapore, SG
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last 30 patents
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Patent Grant
High thermal performance packaging for circuit dies
Patent number
7,776,648
Issue date
Aug 17, 2010
Agere Systems Inc.
Kok Hua Chua
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
High Thermal Performance Packaging for Circuit Dies
Publication number
20090001561
Publication date
Jan 1, 2009
Kok Hua Chua
H01 - BASIC ELECTRIC ELEMENTS