Zheng Sung Chio

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Patents Grantslast 30 patents

Information Patent Grant
Probe card for efficient screening of highly-scaled monolithic semi...
- Patent number 11,579,182
- Issue date Feb 14, 2023
- Meta Platforms Technologies, LLC
- Daniel Brodoceanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Employing deformable contacts and pre-applied underfill for bonding...
- Patent number 11,575,069
- Issue date Feb 7, 2023
- Meta Platforms Technologies, LLC
- Daniel Brodoceanu
- G02 - OPTICS
Information Patent Grant
Curing pre-applied and plasma-etched underfill via a laser
- Patent number 11,563,142
- Issue date Jan 24, 2023
- Meta Platforms Technologies, LLC
- Daniel Brodoceanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selectively bonding light-emitting devices via a pulsed laser
- Patent number 11,557,692
- Issue date Jan 17, 2023
- Meta Platforms Technologies, LLC
- Daniel Brodoceanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid interconnect for laser bonding using nanoporous metal tips
- Patent number 11,424,214
- Issue date Aug 23, 2022
- Meta Platforms Technologies, LLC
- Daniel Brodoceanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect with nanotube fitting
- Patent number 11,417,792
- Issue date Aug 16, 2022
- Meta Platforms Technologies, LLC
- Ali Sengül
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and its process for curing post-applied underfill ma...
- Patent number 11,404,600
- Issue date Aug 2, 2022
- Meta Platforms Technologies, LLC
- Jeb Wu
- G02 - OPTICS
Information Patent Grant
Dielectric-dielectric and metallization bonding via plasma activati...
- Patent number 11,374,148
- Issue date Jun 28, 2022
- Facebook Technologies, LLC
- Daniel Brodoceanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible interconnect using conductive adhesive
- Patent number 11,349,053
- Issue date May 31, 2022
- Facebook Technologies, LLC
- Zheng Sung Chio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic clamping interconnects
- Patent number 11,296,268
- Issue date Apr 5, 2022
- Facebook Technologies, LLC
- Ali Sengül
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding dummy electrodes of light emitting diode chip to substrate
- Patent number 11,276,672
- Issue date Mar 15, 2022
- Facebook Technologies, LLC
- Jeb Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding corners of light emitting diode chip to substrate using laser
- Patent number 11,255,529
- Issue date Feb 22, 2022
- Facebook Technologies, LLC
- Jeb Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Curved pillar interconnects
- Patent number 11,239,400
- Issue date Feb 1, 2022
- Facebook Technologies, LLC
- Zheng Sung Chio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Atomic force microscopy tips for interconnection
- Patent number 10,989,735
- Issue date Apr 27, 2021
- Facebook Technologies, LLC
- Ali Sengül
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
HYBRID INTERCONNECT FOR LASER BONDING USING NANOPOROUS METAL TIPS
- Publication number 20230352437
- Publication date Nov 2, 2023
- Meta Platforms Technologies, LLC
- Daniel Brodoceanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CURING PRE-APPLIED AND LASER-ABLATED UNDERFILL VIA A LASER
- Publication number 20220393060
- Publication date Dec 8, 2022
- Facebook Technologies, LLC
- Jeb Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC-DIELECTRIC AND METALLIZATION BONDING VIA PLASMA ACTIVATI...
- Publication number 20220352412
- Publication date Nov 3, 2022
- Facebook Technologies, LLC
- Daniel Brodoceanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ATOMIC FORCE MICROSCOPY TIPS FOR INTERCONNECTION
- Publication number 20210055327
- Publication date Feb 25, 2021
- Facebook Technologies, LLC
- Ali Sengül
- G01 - MEASURING TESTING
Information Patent Application
CURING PRE-APPLIED AND PLASMA-ETCHED UNDERFILL VIA A LASER
- Publication number 20200395519
- Publication date Dec 17, 2020
- Daniel Brodoceanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMPLOYING DEFORMABLE CONTACTS AND PRE-APPLIED UNDERFILL FOR BONDING...
- Publication number 20200395504
- Publication date Dec 17, 2020
- Facebook Technologies, LLC
- Daniel Brodoceanu
- G02 - OPTICS
Information Patent Application
SELECTIVELY BONDING LIGHT-EMITTING DEVICES VIA A PULSED LASER
- Publication number 20200395521
- Publication date Dec 17, 2020
- Facebook Technologies, LLC
- Daniel Brodoceanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC-DIELECTRIC AND METALLIZATION BONDING VIA PLASMA ACTIVATI...
- Publication number 20200395520
- Publication date Dec 17, 2020
- Facebook Technologies, LLC
- Daniel Brodoceanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CURING PRE-APPLIED AND LASER-ABLATED UNDERFILL VIA A LASER
- Publication number 20200395503
- Publication date Dec 17, 2020
- Facebook Technologies, LLC
- Jeb Wu
- G02 - OPTICS

Zheng Sung Chio

Person

Patents Grantslast 30 patents

Probe card for efficient screening of highly-scaled monolithic semi...

Employing deformable contacts and pre-applied underfill for bonding...

Curing pre-applied and plasma-etched underfill via a laser

Selectively bonding light-emitting devices via a pulsed laser

Hybrid interconnect for laser bonding using nanoporous metal tips

Interconnect with nanotube fitting

Display device and its process for curing post-applied underfill ma...

Dielectric-dielectric and metallization bonding via plasma activati...

Flexible interconnect using conductive adhesive

Magnetic clamping interconnects

Bonding dummy electrodes of light emitting diode chip to substrate

Bonding corners of light emitting diode chip to substrate using laser

Curved pillar interconnects

Atomic force microscopy tips for interconnection

Patents Applicationslast 30 patents

HYBRID INTERCONNECT FOR LASER BONDING USING NANOPOROUS METAL TIPS

CURING PRE-APPLIED AND LASER-ABLATED UNDERFILL VIA A LASER

DIELECTRIC-DIELECTRIC AND METALLIZATION BONDING VIA PLASMA ACTIVATI...

ATOMIC FORCE MICROSCOPY TIPS FOR INTERCONNECTION

CURING PRE-APPLIED AND PLASMA-ETCHED UNDERFILL VIA A LASER

EMPLOYING DEFORMABLE CONTACTS AND PRE-APPLIED UNDERFILL FOR BONDING...

SELECTIVELY BONDING LIGHT-EMITTING DEVICES VIA A PULSED LASER

DIELECTRIC-DIELECTRIC AND METALLIZATION BONDING VIA PLASMA ACTIVATI...

CURING PRE-APPLIED AND LASER-ABLATED UNDERFILL VIA A LASER