Zheng Wei WU

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Kaohsiung, TW

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Patents Grantslast 30 patents

Information Patent Grant
Manufacturing process steps of a semiconductor device package
- Patent number 11,682,631
- Issue date Jun 20, 2023
- Advanced Semiconductor Engineering, Inc.
- Ming-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240203897
- Publication date Jun 20, 2024
- Advanced Semiconductor Engineering, Inc.
- Zheng Wei WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240203896
- Publication date Jun 20, 2024
- Advanced Semiconductor Engineering, Inc.
- Zheng Wei WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING PROCESS STEPS OF A SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20230335505
- Publication date Oct 19, 2023
- Advanced Semiconductor Engineering, Inc.
- Ming-Hung CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220399283
- Publication date Dec 15, 2022
- Advanced Semiconductor Engineering, Inc.
- Ming-Hung CHEN
- H01 - BASIC ELECTRIC ELEMENTS