Zheng-Yi LIM

Person

Hsinchu City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Bonding package components through plating
- Patent number 10,840,212
- Issue date Nov 17, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zheng-Yi Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding package components through plating
- Patent number 10,483,230
- Issue date Nov 19, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zheng-Yi Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming post-passivation interconnect structure
- Patent number 9,953,891
- Issue date Apr 24, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding package components through plating
- Patent number 9,691,738
- Issue date Jun 27, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zheng-Yi Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper pillar bump with cobalt-containing sidewall protection layer
- Patent number 9,275,965
- Issue date Mar 1, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding package components through plating
- Patent number 9,117,772
- Issue date Aug 25, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zheng-Yi Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Post-passivation interconnect structure and method of forming the same
- Patent number 9,099,396
- Issue date Aug 4, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper pillar bump with cobalt-containing sidewall protection
- Patent number 9,048,135
- Issue date Jun 2, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
UBM formation for integrated circuits
- Patent number 8,865,586
- Issue date Oct 21, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal bump formation
- Patent number 8,501,615
- Issue date Aug 6, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming semiconductor die
- Patent number 8,258,055
- Issue date Sep 4, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming metal pillar
- Patent number 8,242,011
- Issue date Aug 14, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zheng-Yi Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Doping minor elements into metal bumps
- Patent number 8,227,334
- Issue date Jul 24, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STACKED TRANSISTOR ISOLATION FEATURES AND METHODS OF FORMING THE SAME
- Publication number 20250048689
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ji-Yin Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCH STOP LAYER FOR REMOVAL OF SUBSTRATE IN STACKING TRANSISTORS AN...
- Publication number 20250048716
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yen Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED TRANSISTOR ISOLATION FEATURES AND METHODS OF FORMING THE SAME
- Publication number 20250031435
- Publication date Jan 23, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding Package Components Through Plating
- Publication number 20200020662
- Publication date Jan 16, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zheng-Yi Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding Package Components Through Plating
- Publication number 20170294402
- Publication date Oct 12, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zheng-Yi Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding Package Components Through Plating
- Publication number 20150364449
- Publication date Dec 17, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zheng-Yi Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING POST-PASSIVATION INTERCONNECT STRUCTURE
- Publication number 20150325539
- Publication date Nov 12, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Wen WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER PILLAR BUMP WITH COBALT-CONTAINING SIDEWALL PROTECTION LAYER
- Publication number 20140342546
- Publication date Nov 20, 2014
- Chien Ling HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding Package components Through Plating
- Publication number 20130334692
- Publication date Dec 19, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zheng-Yi Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UBM Formation for Integrated Circuits
- Publication number 20130175685
- Publication date Jul 11, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Wen WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POST-PASSIVATION INTERCONNECT STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20130113094
- Publication date May 9, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Wen WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal Bump Formation
- Publication number 20120322255
- Publication date Dec 20, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Doping Minor Elements into Metal Bumps
- Publication number 20120286423
- Publication date Nov 15, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING METAL PILLAR
- Publication number 20120178251
- Publication date Jul 12, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zheng-Yi LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER PILLAR BUMP WITH COBALT-CONTAINING SIDEWALL PROTECTION
- Publication number 20120091577
- Publication date Apr 19, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Ling HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Doping Minor Elements into Metal Bumps
- Publication number 20120018878
- Publication date Jan 26, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE BUMP FOR SEMICONDUCTOR SUBSTRATE AND METHOD OF MANUFACTURE
- Publication number 20120007230
- Publication date Jan 12, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS

Zheng-Yi LIM

Person

Patents Grantslast 30 patents

Bonding package components through plating

Bonding package components through plating

Method of forming post-passivation interconnect structure

Bonding package components through plating

Copper pillar bump with cobalt-containing sidewall protection layer

Bonding package components through plating

Post-passivation interconnect structure and method of forming the same

Copper pillar bump with cobalt-containing sidewall protection

UBM formation for integrated circuits

Metal bump formation

Method of forming semiconductor die

Method of forming metal pillar

Doping minor elements into metal bumps

Patents Applicationslast 30 patents

STACKED TRANSISTOR ISOLATION FEATURES AND METHODS OF FORMING THE SAME

ETCH STOP LAYER FOR REMOVAL OF SUBSTRATE IN STACKING TRANSISTORS AN...

STACKED TRANSISTOR ISOLATION FEATURES AND METHODS OF FORMING THE SAME

Bonding Package Components Through Plating

Bonding Package Components Through Plating

Bonding Package Components Through Plating

METHOD OF FORMING POST-PASSIVATION INTERCONNECT STRUCTURE

COPPER PILLAR BUMP WITH COBALT-CONTAINING SIDEWALL PROTECTION LAYER

Bonding Package components Through Plating

UBM Formation for Integrated Circuits

POST-PASSIVATION INTERCONNECT STRUCTURE AND METHOD OF FORMING THE SAME

Metal Bump Formation

Doping Minor Elements into Metal Bumps

METHOD OF FORMING METAL PILLAR

COPPER PILLAR BUMP WITH COBALT-CONTAINING SIDEWALL PROTECTION

Doping Minor Elements into Metal Bumps

CONDUCTIVE BUMP FOR SEMICONDUCTOR SUBSTRATE AND METHOD OF MANUFACTURE