Zhenghong HE

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Ningbo City, CN

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Patents Applicationslast 30 patents

Information Patent Application
CHIP PACKAGING METHOD, CHIP PACKAGING MODULE, AND EMBEDDED SUBSTRAT...
- Publication number 20240413138
- Publication date Dec 12, 2024
- FOREHOPE SEMICONDUCTOR (NINGBO) CO., LTD.
- Zhenghong HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PREPARATION METHOD OF FAN-IN PACKAGE STRUCTURE, AND FAN-IN PACKAGE...
- Publication number 20240063036
- Publication date Feb 22, 2024
- Forehope Electronic (Ningbo) Co., Ltd.
- Zhenghong HE
- H01 - BASIC ELECTRIC ELEMENTS