Zhenging Zhao

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Suzhou, CN

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Patents Grantslast 30 patents

Information Patent Grant
Prefabricated lead frame and bonding method using the same
- Patent number 8,084,847
- Issue date Dec 27, 2011
- Samsung Electronics Co., Ltd.
- Lei Wang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
PREFABRICATED LEAD FRAME AND BONDING METHOD USING THE SAME
- Publication number 20090315160
- Publication date Dec 24, 2009
- Samsung Electronics Co., Ltd.
- Lei Wang
- H01 - BASIC ELECTRIC ELEMENTS