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Patent Application
INHIBITION OF COPPER DISSOLUTION FOR LEAD-FREE SOLDERING
Publication number
20100319967
Publication date
Dec 23, 2010
Agere Systems Inc.
Ahmed Amin
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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Patent Application
Semiconductor component package
Publication number
20060108681
Publication date
May 25, 2006
Kok Hua Chua
H01 - BASIC ELECTRIC ELEMENTS