Zhenguo Jiang

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Radio frequency front-end structures
- Patent number 12,200,855
- Issue date Jan 14, 2025
- Intel Corporation
- Sidharth Dalmia
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
In-package 3D antenna
- Patent number 12,003,023
- Issue date Jun 4, 2024
- Intel Corporation
- Zhenguo Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency front-end structures
- Patent number 11,937,367
- Issue date Mar 19, 2024
- Intel Corporation
- Sidharth Dalmia
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated circuit structures in package substrates
- Patent number 11,804,426
- Issue date Oct 31, 2023
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency front-end structures
- Patent number 11,729,902
- Issue date Aug 15, 2023
- Intel Corporation
- Sidharth Dalmia
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Wideband multi-pin edge connector for radio frequency front end module
- Patent number 11,611,164
- Issue date Mar 21, 2023
- Intel Corporation
- Zhenguo Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management solutions for integrated circuit packages
- Patent number 11,482,471
- Issue date Oct 25, 2022
- Intel Corporation
- Cheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structures in package substrates
- Patent number 11,107,757
- Issue date Aug 31, 2021
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structures in package substrates
- Patent number 10,672,693
- Issue date Jun 2, 2020
- Intel Corporation
- Sanka Ganesan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
RADIO FREQUENCY FRONT-END STRUCTURES
- Publication number 20240164010
- Publication date May 16, 2024
- Intel Corporation
- Sidharth Dalmia
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO PRODUCE...
- Publication number 20240105577
- Publication date Mar 28, 2024
- Intel Corporation
- Zhenguo Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO FREQUENCY FRONT-END STRUCTURES
- Publication number 20230354508
- Publication date Nov 2, 2023
- Intel Corporation
- Sidharth Dalmia
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INTEGRATED CIRCUIT STRUCTURES IN PACKAGE SUBSTRATES
- Publication number 20210351116
- Publication date Nov 11, 2021
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE LAND PAD IN CLOSED-LOOP TRACE FOR HIGH SPEED DATA SIGNALING
- Publication number 20210305138
- Publication date Sep 30, 2021
- Intel Corporation
- Zhichao ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIDEBAND MULTI-PIN EDGE CONNECTOR FOR RADIO FREQUENCY FRONT END MODULE
- Publication number 20200412041
- Publication date Dec 31, 2020
- Intel Corporation
- Zhenguo Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL MANAGEMENT SOLUTIONS FOR INTEGRATED CIRCUIT PACKAGES
- Publication number 20200273776
- Publication date Aug 27, 2020
- Intel Corporation
- Cheng Xu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RADIO FREQUENCY FRONT-END STRUCTURES
- Publication number 20200253040
- Publication date Aug 6, 2020
- Intel Corporation
- Sidharth Dalmia
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INTEGRATED CIRCUIT STRUCTURES IN PACKAGE SUBSTRATES
- Publication number 20200251411
- Publication date Aug 6, 2020
- Intel Corporation
- Sanka Ganesan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IN-PACKAGE 3D ANTENNA
- Publication number 20200243956
- Publication date Jul 30, 2020
- Intel Corporation
- ZHENGUO JIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURES IN PACKAGE SUBSTRATES
- Publication number 20190304887
- Publication date Oct 3, 2019
- Intel Corporation
- Sanka Ganesan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Zhenguo Jiang

Person

Patents Grantslast 30 patents

Radio frequency front-end structures

In-package 3D antenna

Radio frequency front-end structures

Integrated circuit structures in package substrates

Radio frequency front-end structures

Wideband multi-pin edge connector for radio frequency front end module

Thermal management solutions for integrated circuit packages

Integrated circuit structures in package substrates

Integrated circuit structures in package substrates

Patents Applicationslast 30 patents

RADIO FREQUENCY FRONT-END STRUCTURES

METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO PRODUCE...

RADIO FREQUENCY FRONT-END STRUCTURES

INTEGRATED CIRCUIT STRUCTURES IN PACKAGE SUBSTRATES

PACKAGE LAND PAD IN CLOSED-LOOP TRACE FOR HIGH SPEED DATA SIGNALING

WIDEBAND MULTI-PIN EDGE CONNECTOR FOR RADIO FREQUENCY FRONT END MODULE

THERMAL MANAGEMENT SOLUTIONS FOR INTEGRATED CIRCUIT PACKAGES

RADIO FREQUENCY FRONT-END STRUCTURES

INTEGRATED CIRCUIT STRUCTURES IN PACKAGE SUBSTRATES

IN-PACKAGE 3D ANTENNA

INTEGRATED CIRCUIT STRUCTURES IN PACKAGE SUBSTRATES