Zhenjiang Cui

Person

Santa Clara, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Metal deposition and etch in high aspect-ratio features
- Patent number 12,087,595
- Issue date Sep 10, 2024
- Applied Materials, Inc.
- Baiwei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective removal of transition metal nitride materials
- Patent number 11,984,325
- Issue date May 14, 2024
- Applied Materials, Inc.
- Baiwei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective removal of ruthenium-containing materials
- Patent number 11,798,813
- Issue date Oct 24, 2023
- Applied Materials, Inc.
- Baiwei Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Systems and methods for selective metal compound removal
- Patent number 11,769,671
- Issue date Sep 26, 2023
- Applied Materials, Inc.
- Zhenjiang Cui
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Systems and methods for nitride-containing film removal
- Patent number 11,728,177
- Issue date Aug 15, 2023
- Applied Materials, Inc.
- Baiwei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for hafnium-containing film removal
- Patent number 11,682,560
- Issue date Jun 20, 2023
- Applied Materials, Inc.
- Zhenjiang Cui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal etch in high aspect-ratio features
- Patent number 11,631,589
- Issue date Apr 18, 2023
- Applied Materials, Inc.
- Baiwei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for tungsten-containing film removal
- Patent number 11,488,835
- Issue date Nov 1, 2022
- Applied Materials, Inc.
- Zhenjiang Cui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chamber conditioning and removal processes
- Patent number 11,328,909
- Issue date May 10, 2022
- Applied Materials, Inc.
- Hanshen Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching of metal oxides using fluorine and metal halides
- Patent number 11,239,091
- Issue date Feb 1, 2022
- Applied Materials, Inc.
- Keenan N. Woods
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for etching metals and metal derivatives
- Patent number 11,121,002
- Issue date Sep 14, 2021
- Applied Materials, Inc.
- Zhenjiang Cui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for aluminum-containing film removal
- Patent number 11,062,921
- Issue date Jul 13, 2021
- Applied Materials, Inc.
- Zhenjiang Cui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal recess for semiconductor structures
- Patent number 10,861,676
- Issue date Dec 8, 2020
- Applied Materials, Inc.
- Zhenjiang Cui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal recess for semiconductor structures
- Patent number 10,854,426
- Issue date Dec 1, 2020
- Applied Materials, Inc.
- Zhenjiang Cui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D NAND high aspect ratio structure etch
- Patent number 10,692,880
- Issue date Jun 23, 2020
- Applied Materials, Inc.
- Zhenjiang Cui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
HKMG integration
- Patent number 10,504,746
- Issue date Dec 10, 2019
- Applied Materials, Inc.
- Zhenjiang Cui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Two-step fluorine radical etch of hafnium oxide
- Patent number 9,960,049
- Issue date May 1, 2018
- Applied Materials, Inc.
- Hanshen Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cobalt-containing material removal
- Patent number 9,947,549
- Issue date Apr 17, 2018
- Applied Materials, Inc.
- Xikun Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Cleaning high aspect ratio vias
- Patent number 9,576,788
- Issue date Feb 21, 2017
- Applied Materials, Inc.
- Jie Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chlorine-based hardmask removal
- Patent number 9,478,434
- Issue date Oct 25, 2016
- Applied Materials, Inc.
- Xikun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluorine-based hardmask removal
- Patent number 9,355,862
- Issue date May 31, 2016
- Applied Materials, Inc.
- Mandar Pandit
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated cluster to enable next generation interconnect
- Patent number 9,318,383
- Issue date Apr 19, 2016
- Applied Materials, Inc.
- Mehul B. Naik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Air gap structure integration using a processing system
- Patent number 9,312,168
- Issue date Apr 12, 2016
- Applied Materials, Inc.
- Mehul B. Naik
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Integrated cluster to enable next generation interconnect
- Patent number 9,184,093
- Issue date Nov 10, 2015
- Applied Materials, Inc.
- Mehul B. Naik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for damascene structure with reduced low-k damage
- Patent number 8,951,911
- Issue date Feb 10, 2015
- Applied Materials, Inc.
- Mehul B. Naik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Restoring low dielectric constant film properties
- Patent number 8,058,183
- Issue date Nov 15, 2011
- Applied Materials, Inc.
- Zhenjiang Cui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus of creating airgap in dielectric layers for t...
- Patent number 7,879,683
- Issue date Feb 1, 2011
- Applied Materials, Inc.
- Amir Al-Bayati
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Air gap formation and integration using a patterning cap
- Patent number 7,811,924
- Issue date Oct 12, 2010
- Applied Materials, Inc.
- Zhenjiang Cui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chamber clean method using remote and in situ plasma cleaning systems
- Patent number 7,588,036
- Issue date Sep 15, 2009
- Applied Materials, Inc.
- Zhenjiang Cui
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Techniques promoting adhesion of porous low K film to underlying ba...
- Patent number 7,547,643
- Issue date Jun 16, 2009
- Applied Materials, Inc.
- Francimar Schmitt
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
HIGHLY CONFORMAL METAL ETCH IN HIGH ASPECT RATIO SEMICONDUCTOR FEAT...
- Publication number 20230386830
- Publication date Nov 30, 2023
- Applied Materials, Inc.
- Xiaolin C. Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF IN-SITU SELECTIVE METAL REMOVAL VIA GRADIENT OXIDATION FO...
- Publication number 20230343644
- Publication date Oct 26, 2023
- Applied Materials, Inc.
- Chih-Hsun HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL DEPOSITION AND ETCH IN HIGH ASPECT-RATIO FEATURES
- Publication number 20230290647
- Publication date Sep 14, 2023
- Applied Materials, Inc.
- Baiwei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL OXIDE DIRECTIONAL REMOVAL
- Publication number 20230015080
- Publication date Jan 19, 2023
- Applied Materials, Inc.
- Baiwei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE REMOVAL OF TRANSITION METAL NITRIDE MATERIALS
- Publication number 20230010978
- Publication date Jan 12, 2023
- Applied Materials, Inc.
- Baiwei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL ETCH IN HIGH ASPECT-RATIO FEATURES
- Publication number 20220359214
- Publication date Nov 10, 2022
- Applied Materials, Inc.
- Baiwei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR SELECTIVE METAL COMPOUND REMOVAL
- Publication number 20220351979
- Publication date Nov 3, 2022
- Applied Materials, Inc.
- Zhenjiang Cui
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SELECTIVE REMOVAL OF RUTHENIUM-CONTAINING MATERIALS
- Publication number 20220344172
- Publication date Oct 27, 2022
- Applied Materials, Inc.
- Baiwei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR NITRIDE-CONTAINING FILM REMOVAL
- Publication number 20220254648
- Publication date Aug 11, 2022
- Applied Materials, Inc.
- Baiwei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR TUNGSTEN-CONTAINING FILM REMOVAL
- Publication number 20220165580
- Publication date May 26, 2022
- Applied Materials, Inc.
- Zhenjiang Cui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Etching of Metal Oxides Using Fluorine and Metal Halides
- Publication number 20220139720
- Publication date May 5, 2022
- Applied Materials, Inc.
- Keenan N. Woods
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR SELECTIVE METAL COMPOUND REMOVAL
- Publication number 20220084832
- Publication date Mar 17, 2022
- Applied Materials, Inc.
- Zhenjiang Cui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Etching of Metal Oxides Using Fluorine and Metal Halides
- Publication number 20200395222
- Publication date Dec 17, 2020
- Applied Materials, Inc.
- Keenan N. Woods
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR ETCHING METALS AND METAL DERIVATIVES
- Publication number 20200135491
- Publication date Apr 30, 2020
- Applied Materials, Inc.
- Zhenjiang Cui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR HAFNIUM-CONTAINING FILM REMOVAL
- Publication number 20200118829
- Publication date Apr 16, 2020
- Applied Materials, Inc.
- Zhenjiang Cui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL RECESS FOR SEMICONDUCTOR STRUCTURES
- Publication number 20190214229
- Publication date Jul 11, 2019
- Applied Materials, Inc.
- Zhenjiang Cui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL RECESS FOR SEMICONDUCTOR STRUCTURES
- Publication number 20190214230
- Publication date Jul 11, 2019
- Applied Materials, Inc.
- Zhenjiang Cui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHAMBER CONDITIONING AND REMOVAL PROCESSES
- Publication number 20190198300
- Publication date Jun 27, 2019
- Applied Materials, Inc.
- Hanshen Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D NAND HIGH ASPECT RATIO STRUCTURE ETCH
- Publication number 20180182777
- Publication date Jun 28, 2018
- Applied Materials, Inc.
- Zhenjiang CUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COBALT-CONTAINING MATERIAL REMOVAL
- Publication number 20180102259
- Publication date Apr 12, 2018
- Applied Materials, Inc.
- Xikun Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
TWO-STEP FLUORINE RADICAL ETCH OF HAFNIUM OXIDE
- Publication number 20170338119
- Publication date Nov 23, 2017
- Applied Materials, Inc.
- Hanshen ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HKMG INTEGRATION
- Publication number 20170294320
- Publication date Oct 12, 2017
- Applied Materials, Inc.
- Zhenjiang CUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLUORINE REDUCTION WITH SCOPE WITH CONTROLLED OXIDATION
- Publication number 20170291199
- Publication date Oct 12, 2017
- Applied Materials, Inc.
- Xing ZHONG
- B08 - CLEANING
Information Patent Application
CLEANING HIGH ASPECT RATIO VIAS
- Publication number 20160314961
- Publication date Oct 27, 2016
- Applied Materials, Inc.
- Jie Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHLORINE-BASED HARDMASK REMOVAL
- Publication number 20160086816
- Publication date Mar 24, 2016
- Applied Materials, Inc.
- Xikun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLUORINE-BASED HARDMASK REMOVAL
- Publication number 20160086815
- Publication date Mar 24, 2016
- Applied Materials, Inc.
- Mandar Pandit
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED PROCESSING FOR MICROCONTAMINATION PREVENTION
- Publication number 20160068969
- Publication date Mar 10, 2016
- Zhenjiang Cui
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
INTEGRATED CLUSTER TO ENABLE NEXT GENERATION INTERCONNECT
- Publication number 20160049331
- Publication date Feb 18, 2016
- Applied Materials, Inc.
- Mehul B. NAIK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AIR GAP STRUCTURE INTEGRATION USING A PROCESSING SYSTEM
- Publication number 20150170956
- Publication date Jun 18, 2015
- Applied Materials, Inc.
- Mehul B. NAIK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CLUSTER TO ENABLE NEXT GENERATION INTERCONNECT
- Publication number 20140273430
- Publication date Sep 18, 2014
- Mehul B. NAIK
- H01 - BASIC ELECTRIC ELEMENTS

Zhenjiang Cui

Person

Patents Grantslast 30 patents

Metal deposition and etch in high aspect-ratio features

Selective removal of transition metal nitride materials

Selective removal of ruthenium-containing materials

Systems and methods for selective metal compound removal

Systems and methods for nitride-containing film removal

Systems and methods for hafnium-containing film removal

Metal etch in high aspect-ratio features

Systems and methods for tungsten-containing film removal

Chamber conditioning and removal processes

Etching of metal oxides using fluorine and metal halides

Systems and methods for etching metals and metal derivatives

Systems and methods for aluminum-containing film removal

Metal recess for semiconductor structures

Metal recess for semiconductor structures

3D NAND high aspect ratio structure etch

HKMG integration

Two-step fluorine radical etch of hafnium oxide

Cobalt-containing material removal

Cleaning high aspect ratio vias

Chlorine-based hardmask removal

Fluorine-based hardmask removal

Integrated cluster to enable next generation interconnect

Air gap structure integration using a processing system

Integrated cluster to enable next generation interconnect

Process for damascene structure with reduced low-k damage

Restoring low dielectric constant film properties

Methods and apparatus of creating airgap in dielectric layers for t...

Air gap formation and integration using a patterning cap

Chamber clean method using remote and in situ plasma cleaning systems

Techniques promoting adhesion of porous low K film to underlying ba...

Patents Applicationslast 30 patents

HIGHLY CONFORMAL METAL ETCH IN HIGH ASPECT RATIO SEMICONDUCTOR FEAT...

METHOD OF IN-SITU SELECTIVE METAL REMOVAL VIA GRADIENT OXIDATION FO...

METAL DEPOSITION AND ETCH IN HIGH ASPECT-RATIO FEATURES

METAL OXIDE DIRECTIONAL REMOVAL

SELECTIVE REMOVAL OF TRANSITION METAL NITRIDE MATERIALS

METAL ETCH IN HIGH ASPECT-RATIO FEATURES

SYSTEMS AND METHODS FOR SELECTIVE METAL COMPOUND REMOVAL

SELECTIVE REMOVAL OF RUTHENIUM-CONTAINING MATERIALS

SYSTEMS AND METHODS FOR NITRIDE-CONTAINING FILM REMOVAL

SYSTEMS AND METHODS FOR TUNGSTEN-CONTAINING FILM REMOVAL

Etching of Metal Oxides Using Fluorine and Metal Halides

SYSTEMS AND METHODS FOR SELECTIVE METAL COMPOUND REMOVAL

Etching of Metal Oxides Using Fluorine and Metal Halides

SYSTEMS AND METHODS FOR ETCHING METALS AND METAL DERIVATIVES

SYSTEMS AND METHODS FOR HAFNIUM-CONTAINING FILM REMOVAL

METAL RECESS FOR SEMICONDUCTOR STRUCTURES

METAL RECESS FOR SEMICONDUCTOR STRUCTURES

CHAMBER CONDITIONING AND REMOVAL PROCESSES

3D NAND HIGH ASPECT RATIO STRUCTURE ETCH

COBALT-CONTAINING MATERIAL REMOVAL

TWO-STEP FLUORINE RADICAL ETCH OF HAFNIUM OXIDE

HKMG INTEGRATION

FLUORINE REDUCTION WITH SCOPE WITH CONTROLLED OXIDATION

CLEANING HIGH ASPECT RATIO VIAS

CHLORINE-BASED HARDMASK REMOVAL

FLUORINE-BASED HARDMASK REMOVAL

INTEGRATED PROCESSING FOR MICROCONTAMINATION PREVENTION

INTEGRATED CLUSTER TO ENABLE NEXT GENERATION INTERCONNECT

AIR GAP STRUCTURE INTEGRATION USING A PROCESSING SYSTEM

INTEGRATED CLUSTER TO ENABLE NEXT GENERATION INTERCONNECT