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Zhenyu Huang
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San Diego, CA, US
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Patents Grants
last 30 patents
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Patent Grant
Stacked multi-chip integrated circuit package
Patent number
9,406,649
Issue date
Aug 2, 2016
QUALCOMM Incorporated
Dongming He
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Stacked multi-chip integrated circuit package
Patent number
8,963,339
Issue date
Feb 24, 2015
QUALCOMM Incorporated
Dongming He
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
STACKED MULTI-CHIP INTEGRATED CIRCUIT PACKAGE
Publication number
20150155265
Publication date
Jun 4, 2015
QUALCOMM Incorporated
Dongming He
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKED MULTI-CHIP INTEGRATED CIRCUIT PACKAGE
Publication number
20140097535
Publication date
Apr 10, 2014
QUALCOMM Incorporated
Dongming He
H01 - BASIC ELECTRIC ELEMENTS