Zhifu Yang

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Beijing, CN

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Patents Grantslast 30 patents

Information Patent Grant
Display device, circuit bonding structure, and circuit bonding method
- Patent number 11,013,121
- Issue date May 18, 2021
- BOE Technology Group Co., Ltd.
- Zhifu Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT SUBSTRATE AND MANUFACTURING METHOD AND DETECTION METHOD THE...
- Publication number 20240282900
- Publication date Aug 22, 2024
- BOE MLED TECHNOLOGY CO., LTD.
- Shubai ZHANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ENCAPSULATING STRUCTURE, DISPLAY SUBSTRATE AND MANUFACTURING METHOD...
- Publication number 20240145645
- Publication date May 2, 2024
- BOE TECHNOLOGY GROUP CO., LTD.
- Jinpeng LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING SUBSTRATE AND PREPARATION METHOD THEREFOR, AND DISPL...
- Publication number 20230343895
- Publication date Oct 26, 2023
- BOE MLED TECHNOLOGY CO., LTD.
- Pengjun CAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE, CIRCUIT BONDING STRUCTURE, AND CIRCUIT BONDING METHOD
- Publication number 20210022251
- Publication date Jan 21, 2021
- BOE TECHNOLOGY GROUP CO., LTD.
- Zhifu Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR