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Chandler, AZ, US
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Patents Grants
last 30 patents
Information
Patent Grant
Die interconnect structures having bump field and ground plane
Patent number
11,923,308
Issue date
Mar 5, 2024
Intel Corporation
Zhiguo Qian
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Ground via clustering for crosstalk mitigation
Patent number
11,901,280
Issue date
Feb 13, 2024
Intel Corporation
Zhiguo Qian
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Dielectric-filled trench isolation of vias
Patent number
11,887,932
Issue date
Jan 30, 2024
Intel Corporation
Kemal Aygun
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power delivery for embedded bridge die utilizing trench structures
Patent number
11,837,549
Issue date
Dec 5, 2023
Intel Corporation
Kemal Aygun
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power delivery for embedded bridge die utilizing trench structures
Patent number
11,817,391
Issue date
Nov 14, 2023
Intel Corporation
Kemal Aygun
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Ground via clustering for crosstalk mitigation
Patent number
11,742,275
Issue date
Aug 29, 2023
Intel Corporation
Zhiguo Qian
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Horizontal pitch translation using embedded bridge dies
Patent number
11,694,952
Issue date
Jul 4, 2023
Intel Corporation
Sujit Sharan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package substrates with magnetic build-up layers
Patent number
11,682,613
Issue date
Jun 20, 2023
Intel Corporation
Zhiguo Qian
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power delivery for embedded bridge die utilizing trench structures
Patent number
11,621,227
Issue date
Apr 4, 2023
Intel Corporation
Kemal Aygun
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Optimal signal routing performance through dielectric material conf...
Patent number
11,574,862
Issue date
Feb 7, 2023
Intel Corporation
Zhiguo Qian
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Minimization of insertion loss variation in through-silicon vias (T...
Patent number
11,545,416
Issue date
Jan 3, 2023
Intel Corporation
Jianyong Xie
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Architecture and processes to enable high capacity memory packages...
Patent number
11,456,281
Issue date
Sep 27, 2022
Intel Corporation
Yí Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic assemblies having magnetic core inductors
Patent number
11,450,560
Issue date
Sep 20, 2022
Intel Corporation
Krishna Bharath
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package with test circuitry for testing a channe...
Patent number
11,450,613
Issue date
Sep 20, 2022
Intel Corporation
Mayue Xie
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High density interconnect structures configured for manufacturing a...
Patent number
11,387,188
Issue date
Jul 12, 2022
Intel Corporation
Henning Braunisch
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Dielectric-filled trench isolation of vias
Patent number
11,296,031
Issue date
Apr 5, 2022
Intel Corporation
Kemal Aygun
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Horizontal pitch translation using embedded bridge dies
Patent number
11,276,635
Issue date
Mar 15, 2022
Intel Corporation
Sujit Sharan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Ground via clustering for crosstalk mitigation
Patent number
11,244,890
Issue date
Feb 8, 2022
Intel Corporation
Zhiguo Qian
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Enabling long interconnect bridges
Patent number
11,222,847
Issue date
Jan 11, 2022
Intel Corporation
Ravindranath V. Mahajan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power delivery for embedded bridge die utilizing trench structures
Patent number
11,222,848
Issue date
Jan 11, 2022
Intel Corporation
Kemal Aygun
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bridge die design for high bandwidth memory interface
Patent number
11,094,633
Issue date
Aug 17, 2021
Intel Corporation
Zhiguo Qian
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package substrates with magnetic build-up layers
Patent number
11,081,434
Issue date
Aug 3, 2021
Intel Corporation
Zhiguo Qian
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Side mounted interconnect bridges
Patent number
11,031,341
Issue date
Jun 8, 2021
Intel Corporation
Md Altai Hossain
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package with through bridge die connections
Patent number
10,950,550
Issue date
Mar 16, 2021
Intel Corporation
Zhiguo Qian
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Die interconnect structures and methods
Patent number
10,892,225
Issue date
Jan 12, 2021
Intel Corporation
Zhiguo Qian
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High density interconnect structures configured for manufacturing a...
Patent number
10,867,926
Issue date
Dec 15, 2020
Intel Corporation
Henning Braunisch
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Ground via clustering for crosstalk mitigation
Patent number
10,854,539
Issue date
Dec 1, 2020
Intel Corporation
Zhiguo Qian
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Coreless package architecture for multi-chip opto-electronics
Patent number
10,845,552
Issue date
Nov 24, 2020
Intel Corporation
Shawna M. Liff
G02 - OPTICS
Information
Patent Grant
Trace modulations in connectors for integrated-circuit packages
Patent number
10,840,196
Issue date
Nov 17, 2020
Intel Corporation
Cemil Geyik
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
High density interconnect structures configured for manufacturing a...
Patent number
10,833,020
Issue date
Nov 10, 2020
Intel Corporation
Henning Braunisch
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
GROUND VIA CLUSTERING FOR CROSSTALK MITIGATION
Publication number
20240105572
Publication date
Mar 28, 2024
Intel Corporation
Zhiguo Qian
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER DELIVERY FOR EMBEDDED BRIDGE DIE UTILIZING TRENCH STRUCTURES
Publication number
20240030143
Publication date
Jan 25, 2024
Intel Corporation
Kemal Aygun
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LOW INSERTION LOSS COAXIAL THROUGH-HOLE FOR HIGHSPEED INPUT-OUPUT
Publication number
20240006289
Publication date
Jan 4, 2024
Intel Corporation
Kristof Darmawikarta
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGING ARCHITECTURE WITH ROUNDED TRACES FOR ON-PACKAGE HIGH-SPEE...
Publication number
20230420347
Publication date
Dec 28, 2023
Intel Corporation
Cemil Geyik
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGING ARCHITECTURE WITH TRENCH VIA ROUTING FOR ON-PACKAGE HIGH-...
Publication number
20230420377
Publication date
Dec 28, 2023
Intel Corporation
Cemil Geyik
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGES WITH SILVER AND SILICON NITRIDE MULTI-L...
Publication number
20230420358
Publication date
Dec 28, 2023
Intel Corporation
Cemil S. Geyik
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKED VIA MODULATOR IN HIGH SPEED INTERCONNECT
Publication number
20230317588
Publication date
Oct 5, 2023
Intel Corporation
Jiwei SUN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER DELIVERY FOR EMBEDDED BRIDGE DIE UTILIZING TRENCH STRUCTURES
Publication number
20230238332
Publication date
Jul 27, 2023
Intel Corporation
Kemal Aygun
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC DIE INCLUDING SWAPPABLE PHY CIRCUITRY AND SEMICONDU...
Publication number
20230230923
Publication date
Jul 20, 2023
Intel Corporation
Gerald Pasdast
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER DELIVERY FOR EMBEDDED BRIDGE DIE UTILIZING TRENCH STRUCTURES
Publication number
20230138168
Publication date
May 4, 2023
Intel Corporation
Kemal Aygun
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
GLASS SUBSTRATES HAVING SIGNAL SHIELDING FOR USE WITH SEMICONDUCTOR...
Publication number
20230103183
Publication date
Mar 30, 2023
Intel Corporation
Kristof Darmawikarta
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
EMBEDDED GLASS CORES IN PACKAGE SUBSTRATES AND RELATED METHODS
Publication number
20230088928
Publication date
Mar 23, 2023
Intel Corporation
Jung Kyu Han
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
GROUND VIA CLUSTERING FOR CROSSTALK MITIGATION
Publication number
20230014579
Publication date
Jan 19, 2023
Intel Corporation
Zhiguo Qian
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SELECTIVE ROUTING THROUGH INTRA-CONNECT BRIDGE DIES
Publication number
20220399277
Publication date
Dec 15, 2022
Intel Corporation
Adel A. Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CLOCK PHASE MANAGEMENT FOR DIE-TO-DIE (D2D) INTERCONNECT
Publication number
20220271912
Publication date
Aug 25, 2022
Gerald Pasdast
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Application
DIELECTRIC-FILLED TRENCH ISOLATION OF VIAS
Publication number
20220270974
Publication date
Aug 25, 2022
Intel Corporation
Kemal Aygun
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER-FORWARDING BRIDGE FOR INTER-CHIP DATA SIGNAL TRANSFER
Publication number
20220199537
Publication date
Jun 23, 2022
Intel Corporation
Zhiguo Qian
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SHIELD STRUCTURES IN MICROELECTRONIC ASSEMBLIES HAVING DIRECT BONDING
Publication number
20220199546
Publication date
Jun 23, 2022
Intel Corporation
Adel A. Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HORIZONTAL PITCH TRANSLATION USING EMBEDDED BRIDGE DIES
Publication number
20220157706
Publication date
May 19, 2022
Intel Corporation
Sujit SHARAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
GROUND VIA CLUSTERING FOR CROSSTALK MITIGATION
Publication number
20220130742
Publication date
Apr 28, 2022
Intel Corporation
Zhiguo Qian
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ENABLING LONG INTERCONNECT BRIDGES
Publication number
20220130763
Publication date
Apr 28, 2022
Intel Corporation
Ravindranath V. Mahajan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SELECTIVELY ROUGHENED COPPER ARCHITECTURES FOR LOW INSERTION LOSS C...
Publication number
20220102259
Publication date
Mar 31, 2022
Intel Corporation
Jieying Kong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CAPACITORS AND RESISTORS AT DIRECT BONDING INTERFACES IN MICROELECT...
Publication number
20220093725
Publication date
Mar 24, 2022
Intel Corporation
Adel A. Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER DELIVERY FOR EMBEDDED BRIDGE DIE UTILIZING TRENCH STRUCTURES
Publication number
20220093516
Publication date
Mar 24, 2022
Intel Corporation
Kemal Aygun
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC ASSEMBLIES WITH INDUCTORS IN DIRECT BONDING REGIONS
Publication number
20220093547
Publication date
Mar 24, 2022
Intel Corporation
Adel A. Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SCALABLE AND INTEROPERABLE PHYLESS DIE-TO-DIE IO SOLUTION
Publication number
20210398906
Publication date
Dec 23, 2021
Intel Corporation
Zhiguo QIAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
AIRGAP STRUCTURES FOR HIGH SPEED SIGNAL INTEGRITY
Publication number
20210375746
Publication date
Dec 2, 2021
Intel Corporation
Hongxia Feng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE SUBSTRATES WITH MAGNETIC BUILD-UP LAYERS
Publication number
20210327795
Publication date
Oct 21, 2021
Intel Corporation
ZHIGUO QIAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SIDE MOUNTED INTERCONNECT BRIDGES
Publication number
20210296242
Publication date
Sep 23, 2021
Intel Corporation
MD Altaf Hossain
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIE INTERCONNECT STRUCTURES AND METHODS
Publication number
20210167015
Publication date
Jun 3, 2021
Intel Corporation
Zhiguo Qian
H01 - BASIC ELECTRIC ELEMENTS