Zhiguo Qian

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Minimizing package impedance discontinuity through dielectric struc...
- Patent number 12,125,777
- Issue date Oct 22, 2024
- Intel Corporation
- Zhiguo Qian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies with inductors in direct bonding regions
- Patent number 12,107,060
- Issue date Oct 1, 2024
- Intel Corproation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power-forwarding bridge for inter-chip data signal transfer
- Patent number 12,100,662
- Issue date Sep 24, 2024
- Intel Corporation
- Zhiguo Qian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power delivery for embedded bridge die utilizing trench structures
- Patent number 12,062,616
- Issue date Aug 13, 2024
- Intel Corporation
- Kemal Aygun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selectively roughened copper architectures for low insertion loss c...
- Patent number 12,033,930
- Issue date Jul 9, 2024
- Intel Corporation
- Jieying Kong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect loss of high density package with magnetic material
- Patent number 12,009,320
- Issue date Jun 11, 2024
- Intel Corporation
- Zhiguo Qian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies
- Patent number 11,984,439
- Issue date May 14, 2024
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die interconnect structures having bump field and ground plane
- Patent number 11,923,308
- Issue date Mar 5, 2024
- Intel Corporation
- Zhiguo Qian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ground via clustering for crosstalk mitigation
- Patent number 11,901,280
- Issue date Feb 13, 2024
- Intel Corporation
- Zhiguo Qian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric-filled trench isolation of vias
- Patent number 11,887,932
- Issue date Jan 30, 2024
- Intel Corporation
- Kemal Aygun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power delivery for embedded bridge die utilizing trench structures
- Patent number 11,837,549
- Issue date Dec 5, 2023
- Intel Corporation
- Kemal Aygun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power delivery for embedded bridge die utilizing trench structures
- Patent number 11,817,391
- Issue date Nov 14, 2023
- Intel Corporation
- Kemal Aygun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ground via clustering for crosstalk mitigation
- Patent number 11,742,275
- Issue date Aug 29, 2023
- Intel Corporation
- Zhiguo Qian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Horizontal pitch translation using embedded bridge dies
- Patent number 11,694,952
- Issue date Jul 4, 2023
- Intel Corporation
- Sujit Sharan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrates with magnetic build-up layers
- Patent number 11,682,613
- Issue date Jun 20, 2023
- Intel Corporation
- Zhiguo Qian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power delivery for embedded bridge die utilizing trench structures
- Patent number 11,621,227
- Issue date Apr 4, 2023
- Intel Corporation
- Kemal Aygun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optimal signal routing performance through dielectric material conf...
- Patent number 11,574,862
- Issue date Feb 7, 2023
- Intel Corporation
- Zhiguo Qian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Minimization of insertion loss variation in through-silicon vias (T...
- Patent number 11,545,416
- Issue date Jan 3, 2023
- Intel Corporation
- Jianyong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Architecture and processes to enable high capacity memory packages...
- Patent number 11,456,281
- Issue date Sep 27, 2022
- Intel Corporation
- Yí Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies having magnetic core inductors
- Patent number 11,450,560
- Issue date Sep 20, 2022
- Intel Corporation
- Krishna Bharath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package with test circuitry for testing a channe...
- Patent number 11,450,613
- Issue date Sep 20, 2022
- Intel Corporation
- Mayue Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density interconnect structures configured for manufacturing a...
- Patent number 11,387,188
- Issue date Jul 12, 2022
- Intel Corporation
- Henning Braunisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric-filled trench isolation of vias
- Patent number 11,296,031
- Issue date Apr 5, 2022
- Intel Corporation
- Kemal Aygun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Horizontal pitch translation using embedded bridge dies
- Patent number 11,276,635
- Issue date Mar 15, 2022
- Intel Corporation
- Sujit Sharan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ground via clustering for crosstalk mitigation
- Patent number 11,244,890
- Issue date Feb 8, 2022
- Intel Corporation
- Zhiguo Qian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enabling long interconnect bridges
- Patent number 11,222,847
- Issue date Jan 11, 2022
- Intel Corporation
- Ravindranath V. Mahajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power delivery for embedded bridge die utilizing trench structures
- Patent number 11,222,848
- Issue date Jan 11, 2022
- Intel Corporation
- Kemal Aygun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bridge die design for high bandwidth memory interface
- Patent number 11,094,633
- Issue date Aug 17, 2021
- Intel Corporation
- Zhiguo Qian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrates with magnetic build-up layers
- Patent number 11,081,434
- Issue date Aug 3, 2021
- Intel Corporation
- Zhiguo Qian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Side mounted interconnect bridges
- Patent number 11,031,341
- Issue date Jun 8, 2021
- Intel Corporation
- Md Altai Hossain
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
POWER DELIVERY FOR EMBEDDED BRIDGE DIE UTILIZING TRENCH STRUCTURES
- Publication number 20240355745
- Publication date Oct 24, 2024
- Intel Corporation
- Kemal Aygun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES
- Publication number 20240258296
- Publication date Aug 1, 2024
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GROUND VIA CLUSTERING FOR CROSSTALK MITIGATION
- Publication number 20240105572
- Publication date Mar 28, 2024
- Intel Corporation
- Zhiguo Qian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER DELIVERY FOR EMBEDDED BRIDGE DIE UTILIZING TRENCH STRUCTURES
- Publication number 20240030143
- Publication date Jan 25, 2024
- Intel Corporation
- Kemal Aygun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW INSERTION LOSS COAXIAL THROUGH-HOLE FOR HIGHSPEED INPUT-OUPUT
- Publication number 20240006289
- Publication date Jan 4, 2024
- Intel Corporation
- Kristof Darmawikarta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING ARCHITECTURE WITH ROUNDED TRACES FOR ON-PACKAGE HIGH-SPEE...
- Publication number 20230420347
- Publication date Dec 28, 2023
- Intel Corporation
- Cemil Geyik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING ARCHITECTURE WITH TRENCH VIA ROUTING FOR ON-PACKAGE HIGH-...
- Publication number 20230420377
- Publication date Dec 28, 2023
- Intel Corporation
- Cemil Geyik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES WITH SILVER AND SILICON NITRIDE MULTI-L...
- Publication number 20230420358
- Publication date Dec 28, 2023
- Intel Corporation
- Cemil S. Geyik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED VIA MODULATOR IN HIGH SPEED INTERCONNECT
- Publication number 20230317588
- Publication date Oct 5, 2023
- Intel Corporation
- Jiwei SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER DELIVERY FOR EMBEDDED BRIDGE DIE UTILIZING TRENCH STRUCTURES
- Publication number 20230238332
- Publication date Jul 27, 2023
- Intel Corporation
- Kemal Aygun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DIE INCLUDING SWAPPABLE PHY CIRCUITRY AND SEMICONDU...
- Publication number 20230230923
- Publication date Jul 20, 2023
- Intel Corporation
- Gerald Pasdast
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER DELIVERY FOR EMBEDDED BRIDGE DIE UTILIZING TRENCH STRUCTURES
- Publication number 20230138168
- Publication date May 4, 2023
- Intel Corporation
- Kemal Aygun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS SUBSTRATES HAVING SIGNAL SHIELDING FOR USE WITH SEMICONDUCTOR...
- Publication number 20230103183
- Publication date Mar 30, 2023
- Intel Corporation
- Kristof Darmawikarta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED GLASS CORES IN PACKAGE SUBSTRATES AND RELATED METHODS
- Publication number 20230088928
- Publication date Mar 23, 2023
- Intel Corporation
- Jung Kyu Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GROUND VIA CLUSTERING FOR CROSSTALK MITIGATION
- Publication number 20230014579
- Publication date Jan 19, 2023
- Intel Corporation
- Zhiguo Qian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE ROUTING THROUGH INTRA-CONNECT BRIDGE DIES
- Publication number 20220399277
- Publication date Dec 15, 2022
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLOCK PHASE MANAGEMENT FOR DIE-TO-DIE (D2D) INTERCONNECT
- Publication number 20220271912
- Publication date Aug 25, 2022
- Gerald Pasdast
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
DIELECTRIC-FILLED TRENCH ISOLATION OF VIAS
- Publication number 20220270974
- Publication date Aug 25, 2022
- Intel Corporation
- Kemal Aygun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER-FORWARDING BRIDGE FOR INTER-CHIP DATA SIGNAL TRANSFER
- Publication number 20220199537
- Publication date Jun 23, 2022
- Intel Corporation
- Zhiguo Qian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIELD STRUCTURES IN MICROELECTRONIC ASSEMBLIES HAVING DIRECT BONDING
- Publication number 20220199546
- Publication date Jun 23, 2022
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HORIZONTAL PITCH TRANSLATION USING EMBEDDED BRIDGE DIES
- Publication number 20220157706
- Publication date May 19, 2022
- Intel Corporation
- Sujit SHARAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GROUND VIA CLUSTERING FOR CROSSTALK MITIGATION
- Publication number 20220130742
- Publication date Apr 28, 2022
- Intel Corporation
- Zhiguo Qian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENABLING LONG INTERCONNECT BRIDGES
- Publication number 20220130763
- Publication date Apr 28, 2022
- Intel Corporation
- Ravindranath V. Mahajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVELY ROUGHENED COPPER ARCHITECTURES FOR LOW INSERTION LOSS C...
- Publication number 20220102259
- Publication date Mar 31, 2022
- Intel Corporation
- Jieying Kong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITORS AND RESISTORS AT DIRECT BONDING INTERFACES IN MICROELECT...
- Publication number 20220093725
- Publication date Mar 24, 2022
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER DELIVERY FOR EMBEDDED BRIDGE DIE UTILIZING TRENCH STRUCTURES
- Publication number 20220093516
- Publication date Mar 24, 2022
- Intel Corporation
- Kemal Aygun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH INDUCTORS IN DIRECT BONDING REGIONS
- Publication number 20220093547
- Publication date Mar 24, 2022
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SCALABLE AND INTEROPERABLE PHYLESS DIE-TO-DIE IO SOLUTION
- Publication number 20210398906
- Publication date Dec 23, 2021
- Intel Corporation
- Zhiguo QIAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AIRGAP STRUCTURES FOR HIGH SPEED SIGNAL INTEGRITY
- Publication number 20210375746
- Publication date Dec 2, 2021
- Intel Corporation
- Hongxia Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATES WITH MAGNETIC BUILD-UP LAYERS
- Publication number 20210327795
- Publication date Oct 21, 2021
- Intel Corporation
- ZHIGUO QIAN
- H01 - BASIC ELECTRIC ELEMENTS

Zhiguo Qian

Person

Patents Grantslast 30 patents

Minimizing package impedance discontinuity through dielectric struc...

Microelectronic assemblies with inductors in direct bonding regions

Power-forwarding bridge for inter-chip data signal transfer

Power delivery for embedded bridge die utilizing trench structures

Selectively roughened copper architectures for low insertion loss c...

Interconnect loss of high density package with magnetic material

Microelectronic assemblies

Die interconnect structures having bump field and ground plane

Ground via clustering for crosstalk mitigation

Dielectric-filled trench isolation of vias

Power delivery for embedded bridge die utilizing trench structures

Power delivery for embedded bridge die utilizing trench structures

Ground via clustering for crosstalk mitigation

Horizontal pitch translation using embedded bridge dies

Package substrates with magnetic build-up layers

Power delivery for embedded bridge die utilizing trench structures

Optimal signal routing performance through dielectric material conf...

Minimization of insertion loss variation in through-silicon vias (T...

Architecture and processes to enable high capacity memory packages...

Microelectronic assemblies having magnetic core inductors

Integrated circuit package with test circuitry for testing a channe...

High density interconnect structures configured for manufacturing a...

Dielectric-filled trench isolation of vias

Horizontal pitch translation using embedded bridge dies

Ground via clustering for crosstalk mitigation

Enabling long interconnect bridges

Power delivery for embedded bridge die utilizing trench structures

Bridge die design for high bandwidth memory interface

Package substrates with magnetic build-up layers

Side mounted interconnect bridges

Patents Applicationslast 30 patents

POWER DELIVERY FOR EMBEDDED BRIDGE DIE UTILIZING TRENCH STRUCTURES

MICROELECTRONIC ASSEMBLIES

GROUND VIA CLUSTERING FOR CROSSTALK MITIGATION

POWER DELIVERY FOR EMBEDDED BRIDGE DIE UTILIZING TRENCH STRUCTURES

LOW INSERTION LOSS COAXIAL THROUGH-HOLE FOR HIGHSPEED INPUT-OUPUT

PACKAGING ARCHITECTURE WITH ROUNDED TRACES FOR ON-PACKAGE HIGH-SPEE...

PACKAGING ARCHITECTURE WITH TRENCH VIA ROUTING FOR ON-PACKAGE HIGH-...

INTEGRATED CIRCUIT PACKAGES WITH SILVER AND SILICON NITRIDE MULTI-L...

STACKED VIA MODULATOR IN HIGH SPEED INTERCONNECT

POWER DELIVERY FOR EMBEDDED BRIDGE DIE UTILIZING TRENCH STRUCTURES

MICROELECTRONIC DIE INCLUDING SWAPPABLE PHY CIRCUITRY AND SEMICONDU...

POWER DELIVERY FOR EMBEDDED BRIDGE DIE UTILIZING TRENCH STRUCTURES

GLASS SUBSTRATES HAVING SIGNAL SHIELDING FOR USE WITH SEMICONDUCTOR...

EMBEDDED GLASS CORES IN PACKAGE SUBSTRATES AND RELATED METHODS

GROUND VIA CLUSTERING FOR CROSSTALK MITIGATION

SELECTIVE ROUTING THROUGH INTRA-CONNECT BRIDGE DIES

CLOCK PHASE MANAGEMENT FOR DIE-TO-DIE (D2D) INTERCONNECT

DIELECTRIC-FILLED TRENCH ISOLATION OF VIAS

POWER-FORWARDING BRIDGE FOR INTER-CHIP DATA SIGNAL TRANSFER

SHIELD STRUCTURES IN MICROELECTRONIC ASSEMBLIES HAVING DIRECT BONDING

HORIZONTAL PITCH TRANSLATION USING EMBEDDED BRIDGE DIES

GROUND VIA CLUSTERING FOR CROSSTALK MITIGATION

ENABLING LONG INTERCONNECT BRIDGES

SELECTIVELY ROUGHENED COPPER ARCHITECTURES FOR LOW INSERTION LOSS C...

CAPACITORS AND RESISTORS AT DIRECT BONDING INTERFACES IN MICROELECT...

POWER DELIVERY FOR EMBEDDED BRIDGE DIE UTILIZING TRENCH STRUCTURES

MICROELECTRONIC ASSEMBLIES WITH INDUCTORS IN DIRECT BONDING REGIONS

SCALABLE AND INTEROPERABLE PHYLESS DIE-TO-DIE IO SOLUTION

AIRGAP STRUCTURES FOR HIGH SPEED SIGNAL INTEGRITY

PACKAGE SUBSTRATES WITH MAGNETIC BUILD-UP LAYERS