Zhihai Wang

Person

Sunnyvale, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Light sensor having a contiguous IR suppression filter and transpar...
- Patent number 9,472,696
- Issue date Oct 18, 2016
- Maxim Integrated Products, Inc.
- Nicole D. Kerness
- G01 - MEASURING TESTING
Information Patent Grant
Light sensor having transparent substrate and through-substrate via...
- Patent number 9,472,586
- Issue date Oct 18, 2016
- Maxim Integrated Products, Inc.
- Nicole D. Kerness
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light sensor having transparent substrate and diffuser formed therein
- Patent number 9,224,884
- Issue date Dec 29, 2015
- Maxim Integrated Products, Inc.
- Nicole D. Kerness
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light sensor having transparent substrate with lens formed therein
- Patent number 9,224,890
- Issue date Dec 29, 2015
- Maxim Integrated Products, Inc.
- Nicole D. Kerness
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light sensor having IR cut interference filter with color filter in...
- Patent number 9,129,874
- Issue date Sep 8, 2015
- Maxim Integrated Products, Inc.
- Zhihai Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light sensor having IR cut interference filter with color filter in...
- Patent number 8,809,099
- Issue date Aug 19, 2014
- Maxim Integrated Products, Inc.
- Zhihai Wang
- G02 - OPTICS
Information Patent Grant
Light sensor having IR cut and color pass interference filter integ...
- Patent number 8,803,270
- Issue date Aug 12, 2014
- Maxim Integrated Products, Inc.
- Prashanth Holenarsipur
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light sensor having a contiguous IR suppression filter and a transp...
- Patent number 8,803,068
- Issue date Aug 12, 2014
- Maxim Integrated Products, Inc.
- Nicole D. Kerness
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light sensor having a transparent substrate, a contiguous IR suppre...
- Patent number 8,791,404
- Issue date Jul 29, 2014
- Maxim Integrated Products, Inc.
- Nicole D. Kerness
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light sensor having transparent substrate with lens formed therein
- Patent number 8,779,540
- Issue date Jul 15, 2014
- Maxim Integrated Products, Inc.
- Nicole D. Kerness
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light sensor having transparent substrate and diffuser formed therein
- Patent number 8,749,007
- Issue date Jun 10, 2014
- Maxim Integrated Products, Inc.
- Nicole D. Kerness
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light sensor having IR cut and color pass interference filter integ...
- Patent number 8,624,341
- Issue date Jan 7, 2014
- Maxim Integrated Products, Inc.
- Prashanth Holenarsipur
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light sensor having IR cut interference filter with color filter in...
- Patent number 8,598,672
- Issue date Dec 3, 2013
- Maxim Integrated Products, Inc.
- Zhihai Wang
- G02 - OPTICS
Information Patent Grant
Multi-step process for forming a barrier film for use in copper lay...
- Patent number 7,413,984
- Issue date Aug 19, 2008
- LSI Corporation
- Wilbur G. Catabay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect dielectric tuning
- Patent number 7,259,462
- Issue date Aug 21, 2007
- LSI Corporation
- Wai Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-step process for forming a barrier film for use in copper lay...
- Patent number 7,229,923
- Issue date Jun 12, 2007
- LSI Corporation
- Wilbur G. Catabay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect dielectric tuning
- Patent number 7,081,406
- Issue date Jul 25, 2006
- LSI Logic Corporation
- Wai Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low via resistance system
- Patent number 6,893,962
- Issue date May 17, 2005
- LSI Logic Corporation
- Prabhakar P. Tripathi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Process for planarizing upper surface of damascene wiring structure...
- Patent number 6,881,664
- Issue date Apr 19, 2005
- LSI Logic Corporation
- Wilbur G. Catabay
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
In situ liner barrier
- Patent number 6,767,832
- Issue date Jul 27, 2004
- LSI Logic Corporation
- Kiran Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High frequency electrochemical deposition
- Patent number 6,736,953
- Issue date May 18, 2004
- LSI Logic Corporation
- Mei Zhu
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Diamond barrier layer
- Patent number 6,734,560
- Issue date May 11, 2004
- LSI Logic Corporation
- Wilbur G. Catabay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-step process for forming a barrier film for use in copper lay...
- Patent number 6,727,177
- Issue date Apr 27, 2004
- LSI Logic Corporation
- Wilbur G. Catabay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low via resistance system
- Patent number 6,569,751
- Issue date May 27, 2003
- LSI Logic Corporation
- Prabhakar P. Tripathi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate processing system
- Patent number 6,518,193
- Issue date Feb 11, 2003
- LSI Logic Corporation
- Kiran Kumar
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for forming barrier and seed layer
- Patent number 6,489,231
- Issue date Dec 3, 2002
- LSI Logic Corporation
- Kiran Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Diamond barrier layer
- Patent number 6,472,314
- Issue date Oct 29, 2002
- LSI Logic Corporation
- Wilbur G. Catabay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for forming trenches and vias in layers of low dielectric c...
- Patent number 6,368,979
- Issue date Apr 9, 2002
- LSI Logic Corporation
- Zhihai Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and composition for reducing gate oxide damage during RF spu...
- Patent number 6,204,550
- Issue date Mar 20, 2001
- LSI Logic Corporation
- Zhihai Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for forming metal interconnect stack for integrated circuit...
- Patent number 6,174,798
- Issue date Jan 16, 2001
- LSI Logic Corporation
- Shouli Steve Hsia
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LIGHT SENSOR HAVING TRANSPARENT SUBSTRATE AND DIFFUSER FORMED THEREIN
- Publication number 20140284748
- Publication date Sep 25, 2014
- Nicole D. Kerness
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT SENSOR HAVING IR CUT INTERFERENCE FILTER WITH COLOR FILTER IN...
- Publication number 20140035012
- Publication date Feb 6, 2014
- Maxim Integrated Products, Inc.
- Zhihai Wang
- G02 - OPTICS
Information Patent Application
LIGHT SENSOR HAVING IR CUT AND COLOR PASS INTERFERENCE FILTER INTEG...
- Publication number 20140027876
- Publication date Jan 30, 2014
- Maxim Integrated Products, Inc.
- Prashanth Holenarsipur
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT SENSOR HAVING IR CUT AND COLOR PASS INTERFERENCE FILTER INTEG...
- Publication number 20120187513
- Publication date Jul 26, 2012
- MAXIM INTEGRATED PRODUCTS, INC.
- Prashanth Holenarsipur
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT SENSOR HAVING TRANSPARENT SUBSTRATE WITH LENS FORMED THEREIN
- Publication number 20120187515
- Publication date Jul 26, 2012
- MAXIM INTEGRATED PRODUCTS, INC.
- Nicole D. Kerness
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT SENSOR HAVING TRANSPARENT SUBSTRATE AND THROUGH-SUBSTRATE VIAS
- Publication number 20120187281
- Publication date Jul 26, 2012
- MAXIM INTEGRATED PRODUCTS, INC.
- Nicole D. Kerness
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT SENSOR HAVING IR SUPPRESSION FILTER AND TRANSPARENT SUBSTRATE
- Publication number 20120187280
- Publication date Jul 26, 2012
- MAXIM INTEGRATED PRODUCTS, INC.
- Nicole D. Kerness
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT SENSOR HAVING IR CUT INTERFERENCE FILTER WITH COLOR FILTER IN...
- Publication number 20120187512
- Publication date Jul 26, 2012
- MAXIM INTEGRATED PRODUCTS, INC.
- Zhihai Wang
- G02 - OPTICS
Information Patent Application
MULTI-STEP PROCESS FOR FORMING A BARRIER FILM FOR USE IN COPPER LAY...
- Publication number 20070178692
- Publication date Aug 2, 2007
- LSI Logic Corporation
- Wilbur G. Catabay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnection capacitance reduction
- Publication number 20060035457
- Publication date Feb 16, 2006
- Richard J. Carter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect dielectric tuning
- Publication number 20060035455
- Publication date Feb 16, 2006
- Wai Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-step process for forming a barrier film for use in copper lay...
- Publication number 20040157425
- Publication date Aug 12, 2004
- LSI Logic Corporation
- Wilbur G. Catabay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for planarizing upper surface of damascene wiring structure...
- Publication number 20040009668
- Publication date Jan 15, 2004
- Wilbur G. Catabay
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Low via resistance system
- Publication number 20030203622
- Publication date Oct 30, 2003
- LSI Logic Corporation
- Prabhakar P. Tripathi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Substrate processing system
- Publication number 20030084587
- Publication date May 8, 2003
- LSI Logic Corporation
- Kiran Kumar
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Diamond barrier layer
- Publication number 20030064588
- Publication date Apr 3, 2003
- LSI Logic Corporation
- Wilbur G. Catabay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Barrier and seed layer system
- Publication number 20030064593
- Publication date Apr 3, 2003
- LSI Logic Corporation
- Kiran Kumar
- H01 - BASIC ELECTRIC ELEMENTS

Zhihai Wang

Person

Patents Grantslast 30 patents

Light sensor having a contiguous IR suppression filter and transpar...

Light sensor having transparent substrate and through-substrate via...

Light sensor having transparent substrate and diffuser formed therein

Light sensor having transparent substrate with lens formed therein

Light sensor having IR cut interference filter with color filter in...

Light sensor having IR cut interference filter with color filter in...

Light sensor having IR cut and color pass interference filter integ...

Light sensor having a contiguous IR suppression filter and a transp...

Light sensor having a transparent substrate, a contiguous IR suppre...

Light sensor having transparent substrate with lens formed therein

Light sensor having transparent substrate and diffuser formed therein

Light sensor having IR cut and color pass interference filter integ...

Light sensor having IR cut interference filter with color filter in...

Multi-step process for forming a barrier film for use in copper lay...

Interconnect dielectric tuning

Multi-step process for forming a barrier film for use in copper lay...

Interconnect dielectric tuning

Low via resistance system

Process for planarizing upper surface of damascene wiring structure...

In situ liner barrier

High frequency electrochemical deposition

Diamond barrier layer

Multi-step process for forming a barrier film for use in copper lay...

Low via resistance system

Substrate processing system

Method for forming barrier and seed layer

Diamond barrier layer

Process for forming trenches and vias in layers of low dielectric c...

Method and composition for reducing gate oxide damage during RF spu...

Process for forming metal interconnect stack for integrated circuit...

Patents Applicationslast 30 patents

LIGHT SENSOR HAVING TRANSPARENT SUBSTRATE AND DIFFUSER FORMED THEREIN

LIGHT SENSOR HAVING IR CUT INTERFERENCE FILTER WITH COLOR FILTER IN...

LIGHT SENSOR HAVING IR CUT AND COLOR PASS INTERFERENCE FILTER INTEG...

LIGHT SENSOR HAVING IR CUT AND COLOR PASS INTERFERENCE FILTER INTEG...

LIGHT SENSOR HAVING TRANSPARENT SUBSTRATE WITH LENS FORMED THEREIN

LIGHT SENSOR HAVING TRANSPARENT SUBSTRATE AND THROUGH-SUBSTRATE VIAS

LIGHT SENSOR HAVING IR SUPPRESSION FILTER AND TRANSPARENT SUBSTRATE

LIGHT SENSOR HAVING IR CUT INTERFERENCE FILTER WITH COLOR FILTER IN...

MULTI-STEP PROCESS FOR FORMING A BARRIER FILM FOR USE IN COPPER LAY...

Interconnection capacitance reduction

Interconnect dielectric tuning

Multi-step process for forming a barrier film for use in copper lay...

Process for planarizing upper surface of damascene wiring structure...

Low via resistance system

Substrate processing system

Diamond barrier layer

Barrier and seed layer system