Zhijie Shen

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Jiangsu, CN

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Patents Applicationslast 30 patents

Information Patent Application
PACKAGING STRUCTURE AND PACKAGING METHOD
- Publication number 20190259634
- Publication date Aug 22, 2019
- China Wafer Level CSP Co., Ltd.
- Zhiqi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSING CHIP PACKAGING STRUCTURE AND PACKAGING METHOD THEREFOR
- Publication number 20180308890
- Publication date Oct 25, 2018
- China Wafer Level CSP Co., Ltd.
- Zhiqi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSING CHIP PACKAGING STRUCTURE AND METHOD
- Publication number 20180294302
- Publication date Oct 11, 2018
- China Wafer Level CSP Co., Ltd.
- Zhiqi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR PACKAGE STRUCTURE AND PACKAGING METHOD THEREOF
- Publication number 20180247962
- Publication date Aug 30, 2018
- China Wafer Level CSP Co., Ltd.
- Zhiqi Wang
- H01 - BASIC ELECTRIC ELEMENTS