ZHIJIE WANG

Person

Tianjin, CN

People

Patents Grantslast 30 patents

Information Patent Grant
QFN semiconductor package, semiconductor package and lead frame
- Patent number 12,051,642
- Issue date Jul 30, 2024
- NXP USA, INC.
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cavity formed in a molding compound of a semiconductor package to r...
- Patent number 11,984,408
- Issue date May 14, 2024
- NXP USA, INC.
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power die package
- Patent number 11,515,238
- Issue date Nov 29, 2022
- NXP USA, INC.
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making flexible semiconductor device with graphene tape
- Patent number 11,456,188
- Issue date Sep 27, 2022
- NXP USA, INC.
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with lead frame that accommodates various die...
- Patent number 11,171,077
- Issue date Nov 9, 2021
- NXP USA, INC.
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible semiconductor device with graphene tape
- Patent number 10,692,802
- Issue date Jun 23, 2020
- NXP USA, INC.
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of assembling QFP type semiconductor device
- Patent number 10,290,593
- Issue date May 14, 2019
- NXP USA, INC.
- Zhigang Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and lead frame with high density lead array
- Patent number 10,217,697
- Issue date Feb 26, 2019
- NXP B.V.
- Zhijie Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Woven signal-routing substrate for wearable electronic devices
- Patent number 10,041,195
- Issue date Aug 7, 2018
- NXP USA, INC.
- You Ge
- D10 - INDEXING SCHEME ASSOCIATED WITH SUBLASSES OF SECTION D, RELATING TO TEX...
Information Patent Grant
Cavity type pressure sensor device
- Patent number 9,890,034
- Issue date Feb 13, 2018
- NXP B.V.
- Zhigang Bai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Exposed die power semiconductor device
- Patent number 9,613,941
- Issue date Apr 4, 2017
- FREESCALE SEMICONDUCTOR, INC.
- Yanbo Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC package having non-horizontal die pad and flexible substrate the...
- Patent number 9,548,255
- Issue date Jan 17, 2017
- FREESCALE SEMICONDUCTOR, INC.
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cleaning mechanism for semiconductor singulation saws
- Patent number 9,498,898
- Issue date Nov 22, 2016
- Freescale Semiconductor,INC
- Zhijie Wang
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Lead frame with deflecting tie bar for IC package
- Patent number 9,449,901
- Issue date Sep 20, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Zhijie Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die edge seal employing low-K dielectric material
- Patent number 9,406,625
- Issue date Aug 2, 2016
- Freescale Semicondcutor, Inc.
- Zhijie Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond wire feed system and method therefor
- Patent number 9,397,066
- Issue date Jul 19, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Zhijie Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
IC package having non-horizontal die pad and lead frame therefor
- Patent number 9,379,035
- Issue date Jun 28, 2016
- FREESCALE SEMICONDUCTOR, INC.
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package having side and bottom contact pads
- Patent number 9,362,212
- Issue date Jun 7, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Yanbo Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with heat-dissipating lead frame
- Patent number 9,355,945
- Issue date May 31, 2016
- FREESCALE SEMICONDUCTOR, INC.
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device grid array package
- Patent number 9,252,114
- Issue date Feb 2, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Zhijie Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die package with pre-molded die
- Patent number 9,214,413
- Issue date Dec 15, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Zhijie Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-leaded type semiconductor package and method of assembling same
- Patent number 9,214,447
- Issue date Dec 15, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Zhigang Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with tube based heat spreader
- Patent number 9,190,343
- Issue date Nov 17, 2015
- FREESCALE SEMICONDUCTOR, INC.
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making chip-on-lead package
- Patent number 8,642,395
- Issue date Feb 4, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Zhe Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of assembling shielded integrated circuit device
- Patent number 8,536,684
- Issue date Sep 17, 2013
- Freescale Semiconductor Inc.
- Wei Min Chen
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of forming wire bonds in semiconductor devices
- Patent number 8,198,737
- Issue date Jun 12, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Changliang Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coated lead frame
- Patent number 7,887,928
- Issue date Feb 15, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Chao Wang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for assembling stackable semiconductor packages
- Patent number 7,888,186
- Issue date Feb 15, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Zhigang Bai
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
QFN PACKAGED SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20250132212
- Publication date Apr 24, 2025
- NXP USA, Inc.
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICE AND METHOD OF MAKING THEREOF
- Publication number 20250112128
- Publication date Apr 3, 2025
- NXP USA, Inc.
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING
- Publication number 20250062217
- Publication date Feb 20, 2025
- NXP USA, Inc.
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QFN PACKAGED SEMICONDUCTOR DEVICE AND METHOD OF MAKING THEREOF
- Publication number 20250006596
- Publication date Jan 2, 2025
- NXP USA, Inc.
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING
- Publication number 20240413030
- Publication date Dec 12, 2024
- NXP USA, Inc.
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICES AND METHODS OF MAKING THE SAME
- Publication number 20240413065
- Publication date Dec 12, 2024
- NXP USA, Inc.
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAVITY FORMED IN A MOLDING COMPOUND OF A SEMICONDUCTOR PACKAGE TO R...
- Publication number 20230124619
- Publication date Apr 20, 2023
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PACKAGING
- Publication number 20230110402
- Publication date Apr 13, 2023
- NXP USA, Inc.
- YOU GE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE QFN PACKAGE AND METHOD OF MAKING THEREOF
- Publication number 20230115182
- Publication date Apr 13, 2023
- NXP USA, Inc.
- Meng Kong Lye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Type of bumpless and wireless semiconductor device
- Publication number 20230097173
- Publication date Mar 30, 2023
- NXP USA, Inc.
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICE, LEADFRAME AND METHOD FOR IMPROVED BO...
- Publication number 20230068886
- Publication date Mar 2, 2023
- NXP USA, Inc.
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QFN SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAGE AND LEAD FRAME
- Publication number 20220077052
- Publication date Mar 10, 2022
- NXP USA, Inc.
- YOU GE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH LEAD FRAME THAT ACCOMMODATES VARIOUS DIE...
- Publication number 20210013137
- Publication date Jan 14, 2021
- NXP USA, Inc.
- YOU GE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER DIE PACKAGE
- Publication number 20200411423
- Publication date Dec 31, 2020
- NXP USA, Inc.
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE SEMICONDUCTOR DEVICE WITH GRAPHENE TAPE
- Publication number 20200312751
- Publication date Oct 1, 2020
- NXP USA, Inc.
- YOU GE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF ASSEMBLING QFP TYPE SEMICONDUCTOR DEVICE
- Publication number 20190074254
- Publication date Mar 7, 2019
- NXP USA, Inc.
- ZHIGANG BAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND LEAD FRAME WITH HIGH DENSITY LEAD ARRAY
- Publication number 20180102305
- Publication date Apr 12, 2018
- NXP USA, Inc.
- ZHIJIE WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAVITY TYPE PRESSURE SENSOR DEVICE
- Publication number 20170362077
- Publication date Dec 21, 2017
- NXP USA,INC.
- ZHIGANG BAI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
FLEXIBLE SEMICONDUCTOR DEVICE WITH GRAPHENE TAPE
- Publication number 20170358525
- Publication date Dec 14, 2017
- NXP USA, Inc.
- YOU GE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE ARRAY FOR PACKAGING INTEGRATED CIRCUITS
- Publication number 20170125293
- Publication date May 4, 2017
- FREESCALE SEMICONDUCTOR, INC.
- ZHIJIE WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WOVEN SIGNAL-ROUTING SUBSTRATE FOR WEARABLE ELECTRONIC DEVICES
- Publication number 20170009387
- Publication date Jan 12, 2017
- FREESCALE SEMICONDUCTOR, INC.
- You Ge
- D03 - WEAVING
Information Patent Application
LEAD FRAME WITH DEFLECTING TIE BAR FOR IC PACKAGE
- Publication number 20160293526
- Publication date Oct 6, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Zhijie Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND WIRE FEED SYSTEM AND METHOD THEREFOR
- Publication number 20160155718
- Publication date Jun 2, 2016
- ZHIJIE WANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CLEANING MECHANISM FOR SEMICONDUCTOR SINGULATION SAWS
- Publication number 20150367529
- Publication date Dec 24, 2015
- Zhijie Wang
- B08 - CLEANING
Information Patent Application
DIE EDGE SEAL EMPLOYING LOW-K DIELECTRIC MATERIAL
- Publication number 20150371957
- Publication date Dec 24, 2015
- Zhijie Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE PACKAGE AND METHOD OF ASSEMBLING SAME
- Publication number 20150294929
- Publication date Oct 15, 2015
- Zhigang Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXPOSED DIE POWER SEMICONDUCTOR DEVICE
- Publication number 20150255443
- Publication date Sep 10, 2015
- Yanbo Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE GRID ARRAY PACKAGE
- Publication number 20150243623
- Publication date Aug 27, 2015
- Zhijie Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE PACKAGE WITH PRE-MOLDED DIE
- Publication number 20150243586
- Publication date Aug 27, 2015
- Zhijie Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-LEADED TYPE SEMICONDUCTOR PACKAGE AND METHOD OF ASSEMBLING SAME
- Publication number 20150028468
- Publication date Jan 29, 2015
- Zhigang Bai
- H01 - BASIC ELECTRIC ELEMENTS

ZHIJIE WANG

Person

Patents Grantslast 30 patents

QFN semiconductor package, semiconductor package and lead frame

Cavity formed in a molding compound of a semiconductor package to r...

Power die package

Method of making flexible semiconductor device with graphene tape

Semiconductor device with lead frame that accommodates various die...

Flexible semiconductor device with graphene tape

Method of assembling QFP type semiconductor device

Semiconductor device and lead frame with high density lead array

Woven signal-routing substrate for wearable electronic devices

Cavity type pressure sensor device

Exposed die power semiconductor device

IC package having non-horizontal die pad and flexible substrate the...

Cleaning mechanism for semiconductor singulation saws

Lead frame with deflecting tie bar for IC package

Die edge seal employing low-K dielectric material

Bond wire feed system and method therefor

IC package having non-horizontal die pad and lead frame therefor

Integrated circuit package having side and bottom contact pads

Semiconductor device with heat-dissipating lead frame

Semiconductor device grid array package

Semiconductor die package with pre-molded die

Non-leaded type semiconductor package and method of assembling same

Semiconductor device with tube based heat spreader

Method of making chip-on-lead package

Method of assembling shielded integrated circuit device

Method of forming wire bonds in semiconductor devices

Coated lead frame

Method for assembling stackable semiconductor packages

Patents Applicationslast 30 patents

QFN PACKAGED SEMICONDUCTOR DEVICE AND METHOD

PACKAGED SEMICONDUCTOR DEVICE AND METHOD OF MAKING THEREOF

PACKAGED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING

QFN PACKAGED SEMICONDUCTOR DEVICE AND METHOD OF MAKING THEREOF

PACKAGED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING

PACKAGED SEMICONDUCTOR DEVICES AND METHODS OF MAKING THE SAME

CAVITY FORMED IN A MOLDING COMPOUND OF A SEMICONDUCTOR PACKAGE TO R...

SEMICONDUCTOR DEVICE AND METHOD FOR PACKAGING

SEMICONDUCTOR DEVICE QFN PACKAGE AND METHOD OF MAKING THEREOF

Type of bumpless and wireless semiconductor device

PACKAGED SEMICONDUCTOR DEVICE, LEADFRAME AND METHOD FOR IMPROVED BO...

QFN SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAGE AND LEAD FRAME

SEMICONDUCTOR DEVICE WITH LEAD FRAME THAT ACCOMMODATES VARIOUS DIE...

POWER DIE PACKAGE

FLEXIBLE SEMICONDUCTOR DEVICE WITH GRAPHENE TAPE

METHOD OF ASSEMBLING QFP TYPE SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND LEAD FRAME WITH HIGH DENSITY LEAD ARRAY

CAVITY TYPE PRESSURE SENSOR DEVICE

FLEXIBLE SEMICONDUCTOR DEVICE WITH GRAPHENE TAPE

SUBSTRATE ARRAY FOR PACKAGING INTEGRATED CIRCUITS

WOVEN SIGNAL-ROUTING SUBSTRATE FOR WEARABLE ELECTRONIC DEVICES

LEAD FRAME WITH DEFLECTING TIE BAR FOR IC PACKAGE

BOND WIRE FEED SYSTEM AND METHOD THEREFOR

CLEANING MECHANISM FOR SEMICONDUCTOR SINGULATION SAWS

DIE EDGE SEAL EMPLOYING LOW-K DIELECTRIC MATERIAL

SEMICONDUCTOR DIE PACKAGE AND METHOD OF ASSEMBLING SAME

EXPOSED DIE POWER SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE GRID ARRAY PACKAGE

SEMICONDUCTOR DIE PACKAGE WITH PRE-MOLDED DIE

NON-LEADED TYPE SEMICONDUCTOR PACKAGE AND METHOD OF ASSEMBLING SAME