Zhijun Xu

Person

Shanghai, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Systems and methods for simulation of package configurations for ge...
- Patent number 12,198,097
- Issue date Jan 14, 2025
- COUPANG CORP.
- Xiaohua Cui
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Film in substrate for releasing z stack-up constraint
- Patent number 12,027,496
- Issue date Jul 2, 2024
- Intel Corporation
- Jianfeng Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power enhanced stacked chip scale package solution with integrated...
- Patent number 11,894,344
- Issue date Feb 6, 2024
- Intel Corporation
- Zhijun Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure fabricated using lithographic and deposition...
- Patent number 11,742,284
- Issue date Aug 29, 2023
- Intel Corporation
- Zhicheng Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for initial item grouping logic
- Patent number 11,727,354
- Issue date Aug 15, 2023
- COUPANG CORP.
- Xiaohua Cui
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Systems and methods for computer-determined efficient packaging det...
- Patent number 11,699,128
- Issue date Jul 11, 2023
- COUPANG CORP.
- Xiaohua Cui
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Systems and methods for initial item grouping logic
- Patent number 11,694,157
- Issue date Jul 4, 2023
- COUPANG CORP.
- Xiaohua Cui
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Systems and methods for computer-determined efficient bagging of or...
- Patent number 11,327,447
- Issue date May 10, 2022
- COUPANG CORP.
- Xiaohua Cui
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Power enhanced stacked chip scale package solution with integrated...
- Patent number 11,302,671
- Issue date Apr 12, 2022
- Intel Corporation
- Zhijun Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for simulation of package configurations for ge...
- Patent number 11,301,804
- Issue date Apr 12, 2022
- COUPANG CORP.
- Xiaohua Cui
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Systems and methods for initial item grouping logic
- Patent number 11,232,401
- Issue date Jan 25, 2022
- COUPANG CORP.
- Xiaohua Cui
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Systems and methods for responsive and automated predictive packagi...
- Patent number 11,138,527
- Issue date Oct 5, 2021
- COUPANG CORP.
- Rubin Zhao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Systems and methods for computer-determined efficient bagging of or...
- Patent number 10,705,488
- Issue date Jul 7, 2020
- COUPANG CORP.
- Xiaohua Cui
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Systems and methods for computer-determined efficient packaging det...
- Patent number 10,706,387
- Issue date Jul 7, 2020
- COUPANG CORP.
- Xiaohua Cui
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
POWER ENHANCED STACKED CHIP SCALE PACKAGE SOLUTION WITH INTEGRATED...
- Publication number 20220230995
- Publication date Jul 21, 2022
- Intel Corporation
- Zhijun Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR SIMULATION OF PACKAGE CONFIGURATIONS FOR GE...
- Publication number 20220188759
- Publication date Jun 16, 2022
- COUPANG CORP.
- Xiaohua Cui
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
JOINT CONNECTION OF CORNER NON-CRITICAL TO FUNCTION (NCTF) BALL FOR...
- Publication number 20220122907
- Publication date Apr 21, 2022
- Intel Corporation
- Xiaoying TANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR INITIAL ITEM GROUPING LOGIC
- Publication number 20220108271
- Publication date Apr 7, 2022
- COUPANG CORP.
- Xiaohua CUI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FILM IN SUBSTRATE FOR RELEASING Z STACK-UP CONSTRAINT
- Publication number 20220093568
- Publication date Mar 24, 2022
- Intel Corporation
- Jianfeng HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR RESPONSIVE AND AUTOMATED PREDICTIVE PACKAGI...
- Publication number 20210398036
- Publication date Dec 23, 2021
- COUPANG CORP.
- Rubin Zhao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SYSTEMS AND METHODS FOR INITIAL ITEM GROUPING LOGIC
- Publication number 20210256471
- Publication date Aug 19, 2021
- COUPANG CORP.
- Xiaohua CUI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SYSTEMS AND METHODS FOR COMPUTER-DETERMINED EFFICIENT PACKAGING DET...
- Publication number 20210090012
- Publication date Mar 25, 2021
- COUPANG CORP.
- Xiaohua Cui
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SYSTEMS AND METHODS FOR COMPUTER-DETERMINED EFFICIENT BAGGING OF OR...
- Publication number 20210092863
- Publication date Mar 25, 2021
- COUPANG CORP.
- Xiaohua Cui
- E04 - BUILDING
Information Patent Application
SYSTEMS AND METHODS FOR SIMULATION OF PACKAGE CONFIGURATIONS FOR GE...
- Publication number 20210090010
- Publication date Mar 25, 2021
- COUPANG CORP.
- Xiaohua Cui
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SYSTEMS AND METHODS FOR RESPONSIVE AND AUTOMATED PREDICTIVE PACKAGI...
- Publication number 20210089975
- Publication date Mar 25, 2021
- COUPANG CORP.
- Rubin Zhao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INTERCONNECT STRUCTURE FABRICATED USING LITHOGRAPHIC AND DEPOSITION...
- Publication number 20210057326
- Publication date Feb 25, 2021
- Intel Corporation
- Zhicheng Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER ENHANCED STACKED CHIP SCALE PACKAGE SOLUTION WITH INTEGRATED...
- Publication number 20200227387
- Publication date Jul 16, 2020
- Intel Corporation
- Zhijun Xu
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Systems and methods for simulation of package configurations for ge...

Film in substrate for releasing z stack-up constraint

Power enhanced stacked chip scale package solution with integrated...

Interconnect structure fabricated using lithographic and deposition...

Systems and methods for initial item grouping logic

Systems and methods for computer-determined efficient packaging det...

Systems and methods for initial item grouping logic

Systems and methods for computer-determined efficient bagging of or...

Power enhanced stacked chip scale package solution with integrated...

Systems and methods for simulation of package configurations for ge...

Systems and methods for initial item grouping logic

Systems and methods for responsive and automated predictive packagi...

Systems and methods for computer-determined efficient bagging of or...

Systems and methods for computer-determined efficient packaging det...

Patents Applicationslast 30 patents

POWER ENHANCED STACKED CHIP SCALE PACKAGE SOLUTION WITH INTEGRATED...

SYSTEMS AND METHODS FOR SIMULATION OF PACKAGE CONFIGURATIONS FOR GE...

JOINT CONNECTION OF CORNER NON-CRITICAL TO FUNCTION (NCTF) BALL FOR...

SYSTEMS AND METHODS FOR INITIAL ITEM GROUPING LOGIC

FILM IN SUBSTRATE FOR RELEASING Z STACK-UP CONSTRAINT

SYSTEMS AND METHODS FOR RESPONSIVE AND AUTOMATED PREDICTIVE PACKAGI...

SYSTEMS AND METHODS FOR INITIAL ITEM GROUPING LOGIC

SYSTEMS AND METHODS FOR COMPUTER-DETERMINED EFFICIENT PACKAGING DET...

SYSTEMS AND METHODS FOR COMPUTER-DETERMINED EFFICIENT BAGGING OF OR...

SYSTEMS AND METHODS FOR SIMULATION OF PACKAGE CONFIGURATIONS FOR GE...

SYSTEMS AND METHODS FOR RESPONSIVE AND AUTOMATED PREDICTIVE PACKAGI...

INTERCONNECT STRUCTURE FABRICATED USING LITHOGRAPHIC AND DEPOSITION...

POWER ENHANCED STACKED CHIP SCALE PACKAGE SOLUTION WITH INTEGRATED...