Zhijun Zhao

Follow

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method of forming a component having wire bonds and a stiffening layer
- Patent number 9,601,454
- Issue date Mar 21, 2017
- Invensas Corporation
- Zhijun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic package having wire bond vias and stiffening layer
- Patent number 9,136,254
- Issue date Sep 15, 2015
- Invensas Corporation
- Zhijun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making wire bond vias and microelectronic package having...
- Patent number 8,940,630
- Issue date Jan 27, 2015
- Invensas Corporation
- Philip Damberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 8,836,136
- Issue date Sep 16, 2014
- Invensas Corporation
- Ellis Chau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
MICROELECTRONIC PACKAGE HAVING WIRE BOND VIAS AND STIFFENING LAYER
- Publication number 20150380375
- Publication date Dec 31, 2015
- Invensas Corporation
- Zhijun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING WIRE BOND VIAS AND MICROELECTRONIC PACKAGE HAVING...
- Publication number 20140220744
- Publication date Aug 7, 2014
- Invensas Corporation
- Philip Damberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGE HAVING WIRE BOND VIAS AND STIFFENING LAYER
- Publication number 20140217619
- Publication date Aug 7, 2014
- Invensas Corporation
- Zhijun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS
- Publication number 20130093088
- Publication date Apr 18, 2013
- Invensas Corporation
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS