Zhimin Jamie Yao

Person

Santa Barbara, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Superconducting bump bonds for quantum computing systems
- Patent number 11,600,588
- Issue date Mar 7, 2023
- Google LLC
- Zhimin Jamie Yao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Chip with integrated phosphor
- Patent number 10,439,107
- Issue date Oct 8, 2019
- Cree, Inc.
- Sten Heikman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lateral semiconductor light emitting diodes having large area contacts
- Patent number 9,397,266
- Issue date Jul 19, 2016
- Cree, Inc.
- Matthew Donofrio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High power LEDs with non-polymer material lenses and methods of mak...
- Patent number 9,391,247
- Issue date Jul 12, 2016
- Cree, Inc.
- Zhimin Jamie Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming through substrate vias with tethers
- Patent number 9,324,613
- Issue date Apr 26, 2016
- Innovative Micro Technology
- John C Harley
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
High reflective board or substrate for LEDs
- Patent number 9,105,824
- Issue date Aug 11, 2015
- Cree, Inc.
- Sten Heikman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device submounts including substrates with thermally con...
- Patent number 8,772,817
- Issue date Jul 8, 2014
- Cree, Inc.
- Zhimin Jamie Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lateral semiconductor Light Emitting Diodes having large area contacts
- Patent number 8,643,039
- Issue date Feb 4, 2014
- Cree, Inc.
- Matthew Donofrio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High voltage wire bond free LEDS
- Patent number 8,536,584
- Issue date Sep 17, 2013
- Cree, Inc.
- Zhimin Jamie Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High efficiency LEDs
- Patent number 8,455,882
- Issue date Jun 4, 2013
- Cree, Inc.
- Zhimin Jamie Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor light emitting diodes having reflective structures an...
- Patent number 8,368,100
- Issue date Feb 5, 2013
- Cree, Inc.
- Matthew Donofrio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
White-emitting LED chips and method for making same
- Patent number 8,329,482
- Issue date Dec 11, 2012
- Cree, Inc.
- Zhimin Jamie Yao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MULTI-LAYER CHIP ARCHITECTURE AND FABRICATION
- Publication number 20240194661
- Publication date Jun 13, 2024
- Google LLC
- Zhimin Jamie Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER CHIP ARCHITECTURE AND FABRICATION
- Publication number 20240194532
- Publication date Jun 13, 2024
- Google LLC
- Zhimin Jamie Yao
- B82 - NANO-TECHNOLOGY
Information Patent Application
Superconducting Bump Bonds for Quantum Computing Systems
- Publication number 20230207507
- Publication date Jun 29, 2023
- Google LLC
- Zhimin Jamie Yao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD FOR FORMING THROUGH SUBSTRATE VIAS WITH TETHERS
- Publication number 20160093531
- Publication date Mar 31, 2016
- Innovative Micro Technology
- John C HARLEY
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HIGH POWER LEDS
- Publication number 20150137151
- Publication date May 21, 2015
- ZHIMIN JAMIE YAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP WITH INTEGRATED PHOSPHOR
- Publication number 20140217443
- Publication date Aug 7, 2014
- Sten Heikman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LATERAL SEMICONDUCTOR LIGHT EMITTING DIODES HAVING LARGE AREA CONTACTS
- Publication number 20140151735
- Publication date Jun 5, 2014
- Cree, Inc.
- Matthew Donofrio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH EFFICIENCY LEDS
- Publication number 20120256200
- Publication date Oct 11, 2012
- Cree, Inc.
- ZHIMIN JAMIE YAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH REFLECTIVE BOARD OR SUBSTRATE FOR LEDS
- Publication number 20120199843
- Publication date Aug 9, 2012
- Cree, Inc.
- Sten HEIKMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE SUBMOUNTS INCLUDING SUBSTRATES WITH THERMALLY CON...
- Publication number 20120161190
- Publication date Jun 28, 2012
- Zhimin Jamie Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH POWER LEDS WITH NON-POLYMER MATERIAL LENSES AND METHODS OF MAK...
- Publication number 20120153306
- Publication date Jun 21, 2012
- Cree, Inc.
- ZHIMIN JAMIE YAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WHITE-EMITTING LED CHIPS AND METHOD FOR MAKING SAME
- Publication number 20110266560
- Publication date Nov 3, 2011
- Cree, Inc.
- Zhimin Jamie Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LATERAL SEMICONDUCTOR LIGHT EMITTING DIODES HAVING LARGE AREA CONTACTS
- Publication number 20110127568
- Publication date Jun 2, 2011
- Cree, Inc.
- MATTHEW DONOFRIO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH VOLTAGE WIRE BOND FREE LEDS
- Publication number 20110084294
- Publication date Apr 14, 2011
- Cree, Inc.
- Zhimin Jamie Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR LIGHT EMITTING DIODES HAVING REFLECTIVE STRUCTURES AN...
- Publication number 20090283787
- Publication date Nov 19, 2009
- Matthew Donofrio
- H01 - BASIC ELECTRIC ELEMENTS

Zhimin Jamie Yao

Person

Patents Grantslast 30 patents

Superconducting bump bonds for quantum computing systems

Chip with integrated phosphor

Lateral semiconductor light emitting diodes having large area contacts

High power LEDs with non-polymer material lenses and methods of mak...

Method for forming through substrate vias with tethers

High reflective board or substrate for LEDs

Electronic device submounts including substrates with thermally con...

Lateral semiconductor Light Emitting Diodes having large area contacts

High voltage wire bond free LEDS

High efficiency LEDs

Semiconductor light emitting diodes having reflective structures an...

White-emitting LED chips and method for making same

Patents Applicationslast 30 patents

MULTI-LAYER CHIP ARCHITECTURE AND FABRICATION

MULTI-LAYER CHIP ARCHITECTURE AND FABRICATION

Superconducting Bump Bonds for Quantum Computing Systems

METHOD FOR FORMING THROUGH SUBSTRATE VIAS WITH TETHERS

HIGH POWER LEDS

CHIP WITH INTEGRATED PHOSPHOR

LATERAL SEMICONDUCTOR LIGHT EMITTING DIODES HAVING LARGE AREA CONTACTS

HIGH EFFICIENCY LEDS

HIGH REFLECTIVE BOARD OR SUBSTRATE FOR LEDS

ELECTRONIC DEVICE SUBMOUNTS INCLUDING SUBSTRATES WITH THERMALLY CON...

HIGH POWER LEDS WITH NON-POLYMER MATERIAL LENSES AND METHODS OF MAK...

WHITE-EMITTING LED CHIPS AND METHOD FOR MAKING SAME

LATERAL SEMICONDUCTOR LIGHT EMITTING DIODES HAVING LARGE AREA CONTACTS

HIGH VOLTAGE WIRE BOND FREE LEDS

SEMICONDUCTOR LIGHT EMITTING DIODES HAVING REFLECTIVE STRUCTURES AN...