ZHIMIN WAN

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Thermally conductive slugs/active dies to improve cooling of stacke...
- Patent number 12,094,800
- Issue date Sep 17, 2024
- Intel Corporation
- Zhimin Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced base die heat path using through-silicon vias
- Patent number 12,057,369
- Issue date Aug 6, 2024
- Intel Corporation
- Weston Bertrand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated heat spreader with enhanced vapor chamber for multichip...
- Patent number 12,046,536
- Issue date Jul 23, 2024
- Intel Corporation
- Je-Young Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling solution including microchannel arrays and methods of formi...
- Patent number 11,901,262
- Issue date Feb 13, 2024
- Intel Corporation
- Nicholas Neal
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Vented lids for integrated circuit packages
- Patent number 11,894,282
- Issue date Feb 6, 2024
- Intel Corporation
- Zhimin Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced base die heat path using through-silicon vias
- Patent number 11,854,935
- Issue date Dec 26, 2023
- Intel Corporation
- Weston Bertrand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
STIM/liquid metal filled laser drill trench to improve cooling of s...
- Patent number 11,854,931
- Issue date Dec 26, 2023
- Intel Corporation
- Zhimin Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heatsink cutout and insulating through silicon vias to cut thermal...
- Patent number 11,837,519
- Issue date Dec 5, 2023
- Intel Corporation
- Zhimin Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D buildup of thermally conductive layers to resolve die height dif...
- Patent number 11,670,561
- Issue date Jun 6, 2023
- Intel Corporation
- Zhimin Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Socket loading mechanism for passive or active socket and package c...
- Patent number 11,646,244
- Issue date May 9, 2023
- Intel Corporation
- Steven A. Klein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal spreading management of 3D stacked integrated circuits
- Patent number 11,626,395
- Issue date Apr 11, 2023
- Intel Corporation
- Robert L. Sankman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package socket housing to enhance package cooling
- Patent number 11,581,671
- Issue date Feb 14, 2023
- Intel Corporation
- Zhimin Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies having a cooling channel
- Patent number 11,521,914
- Issue date Dec 6, 2022
- Intel Corporation
- Zhimin Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Effective heat conduction from hotspot to heat spreader through pac...
- Patent number 11,502,017
- Issue date Nov 15, 2022
- Intel Corporation
- Cheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management solutions for integrated circuit packages
- Patent number 11,482,471
- Issue date Oct 25, 2022
- Intel Corporation
- Cheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal assemblies for multi-chip packages
- Patent number 11,456,232
- Issue date Sep 27, 2022
- Intel Corporation
- Zhimin Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated heat spreader with multiple channels for multichip packages
- Patent number 11,444,003
- Issue date Sep 13, 2022
- Intel Corporation
- Zhimin Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sloped metal features for cooling hotspots in stacked-die packages
- Patent number 11,398,414
- Issue date Jul 26, 2022
- Intel Corporation
- Zhimin Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Phase change material in substrate cavity
- Patent number 11,387,224
- Issue date Jul 12, 2022
- Intel Corporation
- Cheng Xu
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Thermally coupled package-on-package semiconductor packages
- Patent number 11,222,877
- Issue date Jan 11, 2022
- Intel Corporation
- Omkar Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal spreading management of 3D stacked integrated circuits
- Patent number 11,127,727
- Issue date Sep 21, 2021
- Intel Corporation
- Robert L. Sankman
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ENHANCED BASE DIE HEAT PATH USING THROUGH-SILICON VIAS
- Publication number 20240282667
- Publication date Aug 22, 2024
- Intel Corporation
- Weston BERTRAND
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED BASE DIE HEAT PATH USING THROUGH-SILICON VIAS
- Publication number 20230128903
- Publication date Apr 27, 2023
- Intel Corporation
- Weston BERTRAND
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEC-EMBEDDED DUMMY DIE TO COOL THE BOTTOM DIE EDGE HOTSPOT
- Publication number 20220199482
- Publication date Jun 23, 2022
- Intel Corporation
- Chia-Pin CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL SPREADING MANAGEMENT OF 3D STACKED INTEGRATED CIRCUITS
- Publication number 20210398966
- Publication date Dec 23, 2021
- Intel Corporation
- Robert L. Sankman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED BASE DIE HEAT PATH USING THROUGH-SILICON VIAS
- Publication number 20210257277
- Publication date Aug 19, 2021
- Intel Corporation
- Weston BERTRAND
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEATSINK CUTOUT AND INSULATING THROUGH SILICON VIAS TO CUT THERMAL...
- Publication number 20210249324
- Publication date Aug 12, 2021
- Intel Corporation
- Zhimin WAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D BUILDUP OF THERMALLY CONDUCTIVE LAYERS TO RESOLVE DIE HEIGHT DIF...
- Publication number 20210193547
- Publication date Jun 24, 2021
- Intel Corporation
- Zhimin WAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STIM/LIQUID METAL FILLED LASER DRILL TRENCH TO IMPROVE COOLING OF S...
- Publication number 20210193548
- Publication date Jun 24, 2021
- Intel Corporation
- Zhimin WAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY CONDUCTIVE SLUGS/ACTIVE DIES TO IMPROVE COOLING OF STACKE...
- Publication number 20210193552
- Publication date Jun 24, 2021
- Intel Corporation
- Zhimin WAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID INTERPOSER OF GLASS AND SILICON TO REDUCE THERMAL CROSSTALK
- Publication number 20210118756
- Publication date Apr 22, 2021
- Intel Corporation
- Zhimin WAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEFLECTED-PILLAR COMPOSITE COMPLIANT ELONGATED MICRO-STRUCTURE THER...
- Publication number 20200411408
- Publication date Dec 31, 2020
- Intel Corporation
- Joe Walczyk
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
SOCKET LOADING MECHANISM FOR PASSIVE OR ACTIVE SOCKET AND PACKAGE C...
- Publication number 20200411410
- Publication date Dec 31, 2020
- Intel Corporation
- Steven A. Klein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE, SYSTEM AND METHOD FOR PROVIDING MICROCHANNELS WITH POROUS S...
- Publication number 20200409398
- Publication date Dec 31, 2020
- Intel Corporation
- Betsegaw Gebrehiwot
- G05 - CONTROLLING REGULATING
Information Patent Application
VENTED LIDS FOR INTEGRATED CIRCUIT PACKAGES
- Publication number 20200402884
- Publication date Dec 24, 2020
- Intel Corporation
- Zhimin Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL SPREADING MANAGEMENT OF 3D STACKED INTEGRATED CIRCUITS
- Publication number 20200388603
- Publication date Dec 10, 2020
- Intel Corporation
- Robert L. Sankman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED HEAT SPREADER WITH ENHANCED VAPOR CHAMBER FOR MULTICHIP...
- Publication number 20200350229
- Publication date Nov 5, 2020
- Intel Corporation
- Je-Young Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL MANAGEMENT SOLUTIONS USING COMPARTMENTALIZED PHASE CHANGE M...
- Publication number 20200312738
- Publication date Oct 1, 2020
- Intel Corporation
- Junnan Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOELECTRIC COOLER TO ENHANCE THERMAL-MECHANICAL PACKAGE PERFORM...
- Publication number 20200312741
- Publication date Oct 1, 2020
- Intel Corporation
- Zhimin Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SOCKET HOUSING TO ENHANCE PACKAGE COOLING
- Publication number 20200303852
- Publication date Sep 24, 2020
- Intel Corporation
- Zhimin Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL MANAGEMENT SOLUTIONS FOR INTEGRATED CIRCUIT PACKAGES
- Publication number 20200273776
- Publication date Aug 27, 2020
- Intel Corporation
- Cheng Xu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COOLING SOLUTION INCLUDING MICROCHANNEL ARRAYS AND METHODS OF FORMI...
- Publication number 20200243418
- Publication date Jul 30, 2020
- Intel Corporation
- Nicholas Neal
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
MICROELECTRONIC ASSEMBLIES HAVING A COOLING CHANNEL
- Publication number 20200211927
- Publication date Jul 2, 2020
- Intel Corporation
- Zhimin Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EFFECTIVE HEAT CONDUCTION FROM HOTSPOT TO HEAT SPREADER THROUGH PAC...
- Publication number 20200185300
- Publication date Jun 11, 2020
- Intel Corporation
- Cheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHASE CHANGE MATERIAL IN SUBSTRATE CAVITY
- Publication number 20200118990
- Publication date Apr 16, 2020
- Intel Corporation
- Cheng Xu
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
IN-SITU FORMATION OF A THERMOELECTRIC DEVICE IN A SUBSTRATE PACKAGING
- Publication number 20200119250
- Publication date Apr 16, 2020
- Intel Corporation
- Cheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL SIDE DIE PACKAGING FOR ENHANCED HEAT DISSIPATION
- Publication number 20200111720
- Publication date Apr 9, 2020
- Intel Corporation
- Zhimin Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED HEAT SPREADER WITH MULTIPLE CHANNELS FOR MULTICHIP PACKAGES
- Publication number 20200105643
- Publication date Apr 2, 2020
- Intel Corporation
- ZHIMIN WAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SLOPED METAL FEATURES FOR COOLING HOTSPOTS IN STACKED-DIE PACKAGES
- Publication number 20200098666
- Publication date Mar 26, 2020
- Intel Corporation
- ZHIMIN WAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL ASSEMBLIES FOR MULTI-CHIP PACKAGES
- Publication number 20200051894
- Publication date Feb 13, 2020
- Intel Corporation
- Zhimin Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY COUPLED PACKAGE-ON-PACKAGE SEMICONDUCTOR
- Publication number 20190103385
- Publication date Apr 4, 2019
- Intel Corporation
- OMKAR KARHADE
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Thermally conductive slugs/active dies to improve cooling of stacke...

Enhanced base die heat path using through-silicon vias

Integrated heat spreader with enhanced vapor chamber for multichip...

Cooling solution including microchannel arrays and methods of formi...

Vented lids for integrated circuit packages

Enhanced base die heat path using through-silicon vias

STIM/liquid metal filled laser drill trench to improve cooling of s...

Heatsink cutout and insulating through silicon vias to cut thermal...

3D buildup of thermally conductive layers to resolve die height dif...

Socket loading mechanism for passive or active socket and package c...

Thermal spreading management of 3D stacked integrated circuits

Integrated circuit package socket housing to enhance package cooling

Microelectronic assemblies having a cooling channel

Effective heat conduction from hotspot to heat spreader through pac...

Thermal management solutions for integrated circuit packages

Thermal assemblies for multi-chip packages

Integrated heat spreader with multiple channels for multichip packages

Sloped metal features for cooling hotspots in stacked-die packages

Phase change material in substrate cavity

Thermally coupled package-on-package semiconductor packages

Thermal spreading management of 3D stacked integrated circuits

Patents Applicationslast 30 patents

ENHANCED BASE DIE HEAT PATH USING THROUGH-SILICON VIAS

ENHANCED BASE DIE HEAT PATH USING THROUGH-SILICON VIAS

TEC-EMBEDDED DUMMY DIE TO COOL THE BOTTOM DIE EDGE HOTSPOT

THERMAL SPREADING MANAGEMENT OF 3D STACKED INTEGRATED CIRCUITS

ENHANCED BASE DIE HEAT PATH USING THROUGH-SILICON VIAS

HEATSINK CUTOUT AND INSULATING THROUGH SILICON VIAS TO CUT THERMAL...

3D BUILDUP OF THERMALLY CONDUCTIVE LAYERS TO RESOLVE DIE HEIGHT DIF...

STIM/LIQUID METAL FILLED LASER DRILL TRENCH TO IMPROVE COOLING OF S...

THERMALLY CONDUCTIVE SLUGS/ACTIVE DIES TO IMPROVE COOLING OF STACKE...

HYBRID INTERPOSER OF GLASS AND SILICON TO REDUCE THERMAL CROSSTALK

DEFLECTED-PILLAR COMPOSITE COMPLIANT ELONGATED MICRO-STRUCTURE THER...

SOCKET LOADING MECHANISM FOR PASSIVE OR ACTIVE SOCKET AND PACKAGE C...

DEVICE, SYSTEM AND METHOD FOR PROVIDING MICROCHANNELS WITH POROUS S...

VENTED LIDS FOR INTEGRATED CIRCUIT PACKAGES

THERMAL SPREADING MANAGEMENT OF 3D STACKED INTEGRATED CIRCUITS

INTEGRATED HEAT SPREADER WITH ENHANCED VAPOR CHAMBER FOR MULTICHIP...

THERMAL MANAGEMENT SOLUTIONS USING COMPARTMENTALIZED PHASE CHANGE M...

THERMOELECTRIC COOLER TO ENHANCE THERMAL-MECHANICAL PACKAGE PERFORM...

INTEGRATED CIRCUIT PACKAGE SOCKET HOUSING TO ENHANCE PACKAGE COOLING

THERMAL MANAGEMENT SOLUTIONS FOR INTEGRATED CIRCUIT PACKAGES

COOLING SOLUTION INCLUDING MICROCHANNEL ARRAYS AND METHODS OF FORMI...

MICROELECTRONIC ASSEMBLIES HAVING A COOLING CHANNEL

EFFECTIVE HEAT CONDUCTION FROM HOTSPOT TO HEAT SPREADER THROUGH PAC...

PHASE CHANGE MATERIAL IN SUBSTRATE CAVITY

IN-SITU FORMATION OF A THERMOELECTRIC DEVICE IN A SUBSTRATE PACKAGING

DUAL SIDE DIE PACKAGING FOR ENHANCED HEAT DISSIPATION

INTEGRATED HEAT SPREADER WITH MULTIPLE CHANNELS FOR MULTICHIP PACKAGES

SLOPED METAL FEATURES FOR COOLING HOTSPOTS IN STACKED-DIE PACKAGES

THERMAL ASSEMBLIES FOR MULTI-CHIP PACKAGES

THERMALLY COUPLED PACKAGE-ON-PACKAGE SEMICONDUCTOR