Zhiming Geng

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Suzhou, Jiangsu, CN

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Patents Grantslast 30 patents

Information Patent Grant
Encapsulation structure of image sensing chip, and encapsulation me...
- Patent number 11,049,899
- Issue date Jun 29, 2021
- China Wafer Level CSP Co., Ltd.
- Zhiqi Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ENCAPSULATION STRUCTURE OF IMAGE SENSING CHIP, AND ENCAPSULATION ME...
- Publication number 20200303448
- Publication date Sep 24, 2020
- China Wafer Level CSP Co., Ltd.
- Zhiqi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE AND PACKAGING METHOD
- Publication number 20190259634
- Publication date Aug 22, 2019
- China Wafer Level CSP Co., Ltd.
- Zhiqi Wang
- H01 - BASIC ELECTRIC ELEMENTS