Zhipeng DING

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Patents Grantslast 30 patents

Information Patent Grant
Packaging structure and method of acoustic device
- Patent number 11,799,440
- Issue date Oct 24, 2023
- Wuhan MEMSonics Technologies Co., Ltd.
- Zhipeng Ding
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Method for low temperature bonding of wafers
- Patent number 10,134,607
- Issue date Nov 20, 2018
- Agency for Science, Technology and Research
- Vivek Chidambaram
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Film bulk acoustic wave resonator and preparation method thereof
- Publication number 20230402993
- Publication date Dec 14, 2023
- Wuhan MEMSonics Technologies Co., Ltd.
- Chengliang SUN
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Resonator and Preparation Method for Resonator
- Publication number 20230318557
- Publication date Oct 5, 2023
- Wuhan MEMSonics Technologies Co., Ltd.
- Yao CAI
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Packaging Structure and Method of Acoustic Device
- Publication number 20230308073
- Publication date Sep 28, 2023
- Wuhan MEMSonics Technologies Co.,Ltd.
- Zhipeng DING
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Film Bulk Acoustic Resonator and Manufacturing Method therefor, and...
- Publication number 20230091745
- Publication date Mar 23, 2023
- Wuhan MEMSonics Technologies Co.,Ltd.
- Bangtao CHEN
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
A Method For Low Temperature Bonding Of Wafers
- Publication number 20170178929
- Publication date Jun 22, 2017
- Agency for Science, Technology and Research
- Vivek CHIDAMBARAM
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR